Monocrystalline Solar Silicon Wafer

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Shanghai Port
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TT or LC
Min Order Qty:
100Pieces PCS
Supply Capability:
700 MW/Per Year PCS/month

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Specification of Mono Silicon Wafers


We can provide you solar wafer both156*156 and 125*125mm, Mono and Poly

Solar Wafers for your raw materials choice.

Product name  Mono Wafer
 Conductive type  P type
 Square size wafer(mm)  156×156±0.5 
 Resistivity range 1~3 ohm
 Corner(mm) 150±0.5;165±0.5 
 Thickness (μm) 200±20 
 Total thickness(um) ≤ 30     
Resistivity range(Ωcm) 1-3
 Doping elements Boron
 Orientation (100)±1° 
Carbon content(atoms/cc) ≤1.0E+17 
 Oxygen content(atoms/cc) ≤1.0E+18 
 Lifetime(μs) ≥10 
 Surface quality  No crack, gap, missing Angle, perforated, silicon fell and stress
  Warping degrees(warp/μm) ≤50 
  Neighbouring vertical degree 90±0.5° 
Side damage(mm)   ≤0.5mm(length)×0.3mm(width)(not more than 2 per wafer)
Line mark(μm) ≤15

Usage and Applications of Mono Solar Wafers

Mono Solar Wafers mainly used in Solar Cells with reliable quality and trustful efficiency performance. Our Wafers should be your best choice for raw materials.


Packaging & Delivery of Mono Solar Wafers

Carton Box Package and Deliver by air. It should be avoid of moist, water and shaking to protect the safety of Solar Cells.


Factory Picture of Mono Solar Wafers


 Solar Wafers


Package Picture of Mono Solar Wafers

 Solar Wafers

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Q:Why do monocrystalline silicon chamfer? Polysilicon film?
There are many single crystal chamfer.Single crystals are generally large chamfer, there is a single crystal process decision. There is a single crystal silicon rod is cut out, in order to make full use of the silicon rod, appear large chamfer; and polycrystalline is generally small chamfer, is to reduce the crack edge of the silicon wafer, the external stress of the silicon wafer or cell rupture. Polycrystalline battery will also appear large chamfer, those are generally small chamfer of the battery, found that there is a problem after the cut into large chamfer.
Q:I grew Ag particles on a silicon wafer, about a few hundred nanometers in size
Alcohol is usually placed inside, with ultrasonic cleaning instrument scattered about, the purpose is to make the particles do not reunite together.
Q:Is there anyone who knows how to choose a good glue
General epoxy resin structural adhesive, fully cured is 24 hours, the purpose of the product to achieve the best bonding strength. The curing time is shortened according to the curing accelerator of epoxy resin. The general market is the fastest solid 5 minutes, you can play a positioning effect. Does not affect operation.
Q:There is a micro structure on the side of the silicon wafer
For solar cells destined to enter the market market (mass) products, the advantages of reserves is also one of the main reasons for the silicon photovoltaic materials.
Q:How to convert photovoltaic silicon MW
1MW=100 myriabit125*125 film general single chip 2.3W--2.8W156*156 film general single chip 3.6W-4.2WSilicon chip number =100W divided by Monolithic Power
Q:How to calculate the conversion efficiency of monocrystalline silicon
The algorithm is as follows:Solar cell efficiency = (open circuit voltage * short-circuit voltage * fill factor) / (battery area * light amplitude) *100%Light intensity - AM1.5 as the standard, that is 1000W/m2
Q:Why is it not easy to use high resistance on the silicon chip integrated circuit
For boron diffusion resistance, its resistivity is determined by the use of a greater length / width ratio, which is subject to the limitations of process and wafer area
Q:For solar wafer cutting diamond wire, what are the characteristics?
The diamond wire saw is referred to as diamond wire, diamond wire, are the different names of one thing, because it is the thread sawing, all wire - sometimes called is a steel wire electroplating a layer of diamond particles consolidation.
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
However, in order to manufacture semiconductor components and integrated circuits (IC). Pure silicon wafers have to be created and then used in a variety of processes, such as etching, doping, etc., to make conductive semiconductor circuits on silicon wafers. This process can achieve the level of precision represents the level of semiconductor manufacturing processes, such as the computer's CPU is the number of microns with the manufacture of technology. Because the process is more precise, in the same size of silicon, can make a number of more circuits, that is to achieve a higher degree of integration. At the same time, because the distance between the circuit is small, the length of the wire is short, the required working voltage is lower, the power consumption can be reduced, and the operating speed can be increased.
Q:What is the meaning of the wafer (100), the crystal orientation index or the crystal plane index
The coordinate system is set up in the crystal cellIs the coordinate of the direction vector
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