Solar Cell High Quality A Grade Cell Monorystalline 5v 18.8%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.8%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.8%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:Why do you want to make the wafer bigger?
So the price of a light on the CCD. Because the yield is very low. Astronomical telescopes or military reconnaissance equipment used on the larger size of CCD (such as 4, 8 inches or even 12 inches CCD) is simply astronomical. Looking for a piece of silicon wafer that is close to zero defect is probably a vast project. And the speed of the chip is also affected by the area. The larger the area, the greater the span of the wiring, the greater the frequency of interference and signal
Q:How is the wafer appearance caused? The performance of the chip half white, a class of black! Seek help!
If it is dry in the air, it should be prevented from drying before cutting!
Q:Why should the wafer cut side, cut out edge Jiaosha
To determine the crystal, cutting the adhesive carbon or glass, mounted on the fixed equipment.In simple terms is to determine the crystal direction, in order to facilitate future cutting, design graphics to consider this point, and then ask a little deeper, it is necessary to look at the book.Transistors in general with 111 sides, MOS general 110The reason for this is related to doping, corrosion and other post production, but also the activity of different layers of electrons is different, potential energy is not the same.
Q:What is the role of the semiconductor wafer
The main role of the glue is coated with photoresist coated flat, the use of high-speed rotation of the centrifugal force
Q:How to calculate the conversion efficiency of monocrystalline silicon
The algorithm is as follows:Solar cell efficiency = (open circuit voltage * short-circuit voltage * fill factor) / (battery area * light amplitude) *100%Light intensity - AM1.5 as the standard, that is 1000W/m2
Q:Why do you use a concentrated sulfuric acid and hydrogen peroxide to wash silicon?
But it is best not to use, the use of water under normal conditions and these two kinds of things can be caustic clean silicon, 100% recycled mortar is not the problem, but this requires tens of thousands of cost and appropriate design, I am clean
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma cleaning relates to the field of etching technology, and fully satisfies the removal of residual surface of silicon wafer after etching processKeep particle cleaningBackground technologyIn the etching process, the particles come from many sources: etching gas such as Cl2, HBr, CF4 etc. are corrosive, etching after the end will have a certain number of particles on the surface of the silicon wafer reaction chamber; a quartz cover will produce quartz particles in plasma bombardment; reaction chamber liner (liner) also metal particles will be produced in the etching process for long time. The surface residual silicon etching after particles block conductive connection, cause damage to the device. Therefore, the control of particles is very important in the etching process.
Q:Is a wafer a silicon wafer and a wafer?
It is the raw material of the semiconductor industry, which is called silicon wafer after cutting
Q:The last time you gave me the answer to the silicon chip, I learned a lot
Mineral name: corundum.Hard brittle materialChemical composition: Al 2 O 3; can contain Fe, Ti, Cr, V, Mn and other elements.Crystalline state.Crystal system: three party system;
Q:Monocrystalline silicon processing technology
Wafer thickness is also a factor in productivity, as it relates to the number of wafers produced by each silicon block. The ultrathin wafer presents additional challenges to the wire technology, because the production process is much more difficult to. In addition to the mechanical brittleness of silicon wafers, if the wire sawing process no precise control, slight crack and bending will have negative effects on product yield. The system must be of ultra-thin silicon wire technology, linear cutting line speed and pressure, and precise control of cutting coolant.Regardless of the thickness of the silicon wafer, crystal silicon solar cell manufacturers have made great demands on the quality of the silicon wafer. The wafer cannot have surface damage (minor cracks, wire mark), morphology defects (bending, convex, uneven thickness) to minimize additional back-end processing such as polishing and other requirements to a minimum. Current situationIn order to meet the market for lower cost and higher productivity, a new generation of wire must improve the cutting speed, the use of silicon longer so as to improve the cutting load. Thinner cutting lines and thinner silicon chips increase productivity, while advanced process control can manage cutting line tension to keep the cutting line firm.

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