Monocrystalline Silicon Wafer, Solar Wafer, 156*156mm

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100 Pcs PCS
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700 MW/Per Year PCS/month

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Specification of Mono Silicon Wafer


We can provide you solar wafer 156*156mm Mono Wafers for your raw materials choice.

Product name  Mono Wafer
 Conductive type  P type
 Square size wafer(mm)  156×156±0.5 
 Resistivity 1~3 ohm
 Corner(mm) 150±0.5;165±0.5 
 Thickness (μm) 200±20 
 Total thickness(um) ≤ 30     
Resistivity range(Ωcm) 1-3
 Doping elements Boron
 Orientation (100)±1° 
Carbon content(atoms/cc) ≤1.0E+17 
 Oxygen content(atoms/cc) ≤1.0E+18 
 Lifetime(μs) ≥10 
 Surface quality  No crack, gap, missing Angle, perforated, silicon fell and stress
  Warping degrees(warp/μm) ≤50 
  Neighbouring vertical degree 90±0.5° 
Side damage(mm)   ≤0.5mm(length)×0.3mm(width)(not more than 2 per wafer)
Line mark(μm) ≤15

Usage and Applications of Mono Wafers

Mono Solar Wafer mainly used in Mono Solar Cells with reliable quality and trustful efficiency performance. Our Mono Wafers should be your best choice for raw materials.


Packaging & Delivery of Mono Wafers

Carton Box Package and Deliver by air. Mono Wafers should be avoid of sunshine, moist, and water.


Factory Picture of Mono Wafers


 Solar Wafers


Package Picture of Mono Wafers

 Solar Wafers

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Q:What is the harm of silicon chip into the fingers?
It is best to take out as soon as possible, otherwise easy to infection,
Q:What is a good solar wafer testing equipment?
To develop solar energy, we must overcome two key challenges: cost and yield." In the solar panel manufacturing process, from the front to the back, from the crystal rod, wafer, chip to the module, any one of the links in error, will affect the number of solar panel products. Therefore, the solar cell needs to be able to monitor every step of the process in the production process of detection tools. QCROBOT also has many successful cases in this field.
Q:Is there anyone who knows how to choose a good glue
But the viscosity is so small. You can use UV or instant glue, curing is relatively fast.
Q:After the velvet or the original silicon
The complaint can be suppliers, with hydrofluoric acid washed off after processed velvet
Q:What is the cutting fluid for solar wafer cutting?
MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
Q:One hundred watts of solar panels to how many pieces of silicon wafers, 156 of single crystals and polycrystalline
Whereas it is high. If we do not consider the area, the same power, the electricity generated is the same, with high conversion rate and low exchange rate independent of all aspects of life, of course, there will be some impact. So I do not know clearly? I is a professional manufacturer of solar photovoltaic, do not understand what I can find. If you can.
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The resistivity changes after annealing, as if it is mainly about the high resistivity of the oxygen donor.
Q:After wafer cleaning, how to change the film?
Name compositionEffectSPMH2SO4: H2O2: H2ORemoval of heavy organic matter, but it is difficult to remove organic matter when it is very seriousDHFHF: (H2O2): H2OCorrosion of the surface oxide layer to remove metal contaminationAPM (SC1) NH4OH: H2O2: H2O can remove particles, some organic matter and some metals, this solution will increase the surface roughness of silicon waferHPM (SC2) HCl: (H2O2): H2O is mainly used to remove metal contamination
Q:What is a silicon wafer for unidirectional and bidirectional cutting? What is the difference between the two?
The cutting line is cut in one direction, and the wire is cut into the waste wire wheel from the discharge wheel
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
General loss of about 40%, the general thickness of about 190um silicon, cutting seam in 120um
Our company is a world class resources and green energy developer, operator and supplier with its engagement in green energy development, integration and operation. We strives to offer highly efficient, eco-friendly, economical and reliable energy solutions through an integrated and diversified energy industrial chain. In adherence to the philosophy of bringing green power to life, the Group stays committed to continuously providing high-quality energy and services for a better living environment. Under approaches of people-oriented, excellence-foremost, value-creation and harmony-pursuant, our Group is determined to become a respected world-class green energy conglomerate.

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