156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

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Product Description:

 156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

our cells special features

1. High conversion efficiencies resulting in superior power output performance

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.For 156P poly cells with high efficiency in photovoltaic conversion 16.3%-17.5%.

6.Low inverse current, high shunt resistance and high dependability.

7. Our poly cells efficiency include: 17%-18%.

Product Pictures

 

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel 

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Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma wafer cleaning parameters:Residual plasma cleaning method of particles 1, silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow; the use of either gas from the 02, Ar, N2; gas washing process parameters set process: the chamber pressure of 10-40 mTorr, process gas flow 100-500sccm time, 1-5s; process parameters of starting process is: the chamber pressure of 1040 mTorr, process gas flow on the electrode 100-500sccm, power 250-400W, time 1-10s.2, as described in the plasma cleaning method, the invention is characterized in that the gas used is 23, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 15 mTorr, process gas flow 300sccm, time 3S; process parameters of starting process is: the chamber pressure of 15 mTorr, process gas flow on the electrode 300sccm, power 300W, time Ss.4, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 10-20 mTorr, process gas flow 100-300sccm, time 1-5s; process parameters of starting process is: the chamber pressure of 10-20 mTorr, process gas flow on the electrode 100-300sccm, power 250-400W, when Lu 1-5s.
Q:Pure curiosity why silicon wafer is round
Major manufacturers are trying to expand the cross-sectional area of monocrystalline silicon, not just to cut more wafers per wafer...It's a waste of a lot of material if it's easy.
Q:The significance of silicon wafer heat treatment
Heat treatment at 650 DEG C, under the condition of rapid cooling (that is, rapidly over the temperature of 450 DEG C), the thermal donor can be eliminated. That is, we can observe that the resistivity of N sample is high, and the resistivity of P sample is low.Precipitation: 800-1200 DEG C, on behalf of temperature 1050 degrees CHeat treatment at 1050 DEG C, will bring oxygen precipitation, and the formation of defects caused by precipitation defects.Restore: > 1200
Q:The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?
Mortar free multi wire cuttingMortar free type multi wire cutting, cutting and cutting sand coexist in the grinding fluid, resulting in low cutting efficiency; and the high viscosity of the coolant and cutting sand and high value of cutting raw materials mixed together, separation is difficult, resulting in the waste of raw materials and environmental pollution.Diamond wire cuttingThe preparation technology of diamond wire belongs to the technology of consolidation abrasive particles. Fixed abrasive wire cutting way between the consolidation in the wire on the abrasive and workpiece material cutting based on the principle of two body wear, abrasive particles directly on the workpiece, which belongs to a kind of rigid cutting method, greatly improves the cutting efficiency.
Q:Is there anyone who knows how to choose a good glue
The viscosity requirement is so small, why the curing time is so long, the general curing time is long anaerobic adhesive, or structural adhesive.
Q:The problem of integrated circuit fabrication is how to realize the functions of capacitors, resistors and transistors on a single chip
You can look at the aspects of the integrated circuit manufacturing process, integrated circuit design belongs to the back end of these of course, this is not considered in the field of integrated circuit design
Q:After cutting a few chips, mortar density is getting lower and lower
Iron powder and silica fume more and more, the density should be more and more big, unless it is your water content is higher and higher
Q:What's the difference between a silicon wafer and a battery?
Silver aluminum printing products called battery!The silicon chip is the raw material for the production of the battery chip, and the silicon chip is conductive!
Q:How to make a resistor on a silicon chip (integrated circuit)
Method for making the Baidu transistor circuit.Simply by laser, and method of mixed batch chemical piling up complex circuit
Q:The meaning of various names
Need some wafer to test the state of the art production equipment, such as particle, etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used to group together with the normal production process to test the quality condition of a process, such as the CVD film thickness. Production equipment in the maintenance or repair immediately after. Production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, this type of wafer is called dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as certain machine wafer must process to a certain number the problem with dummy wafer. And some machine must be a form of dummy run in the process of a certain number of wafer, otherwise the process can not guarantee the quality and so on and so on many of the wafer are Dummy. can be called a wafer chip can be basically regarded as a dummy.Dummy wafer, control, block and so on are usually recyclable

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