156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

Ref Price:
Loading Port:
China main port
Payment Terms:
TT OR LC
Min Order Qty:
100 watt
Supply Capability:
10000 watt/month

OKorder Service Pledge

Quality Product

Order On-line Tracking

Timely Delivery

OKorder Service Pledge

Credit Rating

Credit Services

Credit Purchasing

Share to:

Product Description:

 156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

our cells special features

1. High conversion efficiencies resulting in superior power output performance

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.For 156P poly cells with high efficiency in photovoltaic conversion 16.3%-17.5%.

6.Low inverse current, high shunt resistance and high dependability.

7. Our poly cells efficiency include: 17%-18%.

Product Pictures

 

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel 

Send a message to us:

Remaining: 4000 characters

- Self introduction

- Required specifications

- Inquire about price/MOQ

Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
Solving measures:A. guide slot check slot is uniform, and to compensate for the loss according to the situation of the slot wheel.When the A. is set to zero, the position of the guide line is controlled.B. standard viscose operation. When the surface of the silicon block is bonded with the guide bar, the utility model can be used to check whether the guide strip is bent, and whether the glue is evenly applied, so that there is no gap between the guide strip and the silicon block after the bonding guide strip is arranged.In the process of using the C. guide wheel, the utility model is used to detect the guide groove of the guide wheel on a regular basis, and the depth and the angle of the guide groove are observed.
Q:Consult the difference between silicon and battery
Silicon wafer is generally refers to the silicon ingot with diamond wire or just cut into pieces,
Q:Is the thickness of solar cell silicon wafer certain? Specifically how much
140-230 bar, see the specific requirements, most of the requirements of 200
Q:The problem of integrated circuit fabrication is how to realize the functions of capacitors, resistors and transistors on a single chip
You can look at the aspects of the integrated circuit manufacturing process, integrated circuit design belongs to the back end of these of course, this is not considered in the field of integrated circuit design
Q:What is the meaning of a cleaning in a semiconductor silicon wafer process? RCA?
(2) HF (DHF):HF (DHF) from 20 to 25 DEG C DHF can remove the natural oxide film on the surface of silicon wafer, therefore, the metal attached to the natural oxide film will be dissolved into the cleaning solution, and DHF can inhibit the formation of oxide film. Therefore, it is easy to remove Al, Fe, Zn, Ni and other metals on the surface of silicon wafer, and DHF can also remove the metal hydroxide attached to the natural oxide film. When cleaning with DHF, the silicon on the surface of the silicon wafer is not corroded when the natural oxide film is corroded.
Q:How is the silicon chip integrated circuit?
Based on TTL series integrated circuit as an example, from silicon to process integrated circuit: cut off from a monocrystalline silicon chip, polished - polishing - oxidation - lithography - diffusion - epitaxial buried layer - oxidation - oxidation - diffusion - isolation lithography lithography - base diffusion - oxidation lithography - emitter diffusion vacuum aluminizing - sintering (ohmic contact lithography) - at the initial test procedure is done.
Q:How do we use the scanning electron microscope
Most of the samples prepared by silicon wafer were dispersed on the surface of silicon wafer after the dispersion of nano particles. The test results and this kind of sample is silicon pretreatment, the main drying and sample dispersion and sample, the majority of small particle size, easy to agglomerate, take the solution can take the middle or upper clear liquid
Q:How is the wafer appearance caused? The performance of the chip half white, a class of black! Seek help!
You should be the color difference problem is caused by the mortar temperature cutting room temperature and workshop temperature also influenced to reduce this effect only from the cleaning rod to minimize the time spent between, this is the enthusiasm of the staff problem
Q:Ultrasonic cleaning cleaning silicon?
Yes, but it is said to be the frequency of the 1MHz cleaning machine. Is not an ordinary low-frequency 100K below the frequency of cleaning machine.
Q:What is a silicon wafer
Silicon is an important material in the IC fabrication, through photolithography and ion implantation on the silicon wafer and other means, can be made into various semiconductor devices made of silicon chip. With amazing computational capabilities. The development of science and technology promotes the development of semiconductor. Development of automation and computer technology, this makes the silicon chip (integrated circuit) high technology product cost has been reduced to a very low degree. This makes the silicon wafer has been widely used in aerospace, industry, agriculture and national defense, and even crept into every family.

1. Manufacturer Overview

Location
Year Established
Annual Output Value
Main Markets
Company Certifications

2. Manufacturer Certificates

a) Certification Name  
Range  
Reference  
Validity Period  

3. Manufacturer Capability

a)Trade Capacity  
Nearest Port
Export Percentage
No.of Employees in Trade Department
Language Spoken:
b)Factory Information  
Factory Size:
No. of Production Lines
Contract Manufacturing
Product Price Range