4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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Product Description:

4W A Grade 156.75*156.75mm Polycrystalline Solar Cell

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

Long Service Life
High Efficiency Solar Cells
Special Aluminum Frame Design
High Transmission, Low Iron Tempered Glass
Advanced Cell Encapsulation

APPLICATIONS
Solar power stations
Rural electrification, Small home power systems
Power supply for traffic, security, gas industry
12V and 24V battery charging system
Other industrial and commercial application
 

Typical I-V curve

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

Warranties

6Inch 2BB  Polycrystalline Multi Solar Cells Mono Solar Cell

For c-Si panel: 25years output warranty for no less than 80% of performance, 10 years output warranty for no less than  90% of performance. Free from material and workmanship defects within 5 years.

For a-Si panel: 20 years output warranty for no less than 80% of performance, 10 years output warranty for no less than 90% of performance. Free from material and workmanship defects within 2 years.

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Q:What is the specific way to clean the silicon wafer suede concrete steps
But when these two semiconductors are connected, they form a "P-N junction". When the current through the wire to the chip, the electron will be pushed to the P area, in the P area of the electron and hole compound, and then will be in the form of photon energy, which is the principle of LED luminescence. The wavelength of light is the color of light, which is determined by the material that forms the P-N junction. The utility model is a display screen which is used for displaying various information such as text, graphics, image, animation, quotation, video, video signal, etc. by controlling the display mode of the semiconductor light emitting diode.
Q:After wafer cleaning, how to change the film?
Quality solutionCleaning method(a) RCA cleaning:RCA pioneered by Werner Kern in the N.J.Princeton RCA laboratory in 1965, and hence the name.RCA cleaning is a typical wet chemical cleaning.RCA cleaning is mainly used for cleaning the surface film, organic particles and metal contamination.1, particle cleaningThe main APM removal of silicon surface particles (also known as SC1) cleaning solution (NH4OH + H2O2 + H2O) to APM in the cleaning. The cleaning solution, due to the effects of H2O2, the silicon surface has a layer of natural oxide film (SiO2), a hydrophilic surface and between silicon particles can soaking cleaning liquid, silicon surface the natural oxide film and a silicon wafer surface by NH4OH corrosion, the particles will fall into the cleaning solution. The corrosion rate and the particle removal amount of silicon surface, for removing particles, corrosion must be a certain amount. In the cleaning solution, because the potential of silicon surface is negative, and most of the particles are repulsive force to prevent the adsorption of particles to the silicon surface.
Q:Who is the best silicon chip dryer?
Silicon wafer drying machine is the Wuxi automation technology to do, that is, before the design of the Song Jiang Yang, now is an upgraded version of the. Easy to use.
Q:How to extract silicon from silicon wafers
Slice: cut a single crystal silicon rod into a thin wafer with an exact geometry. In this process, the silica fume is produced by water leaching to produce waste water and silicon slag.
Q:What is the thickness of the semiconductor wafer used today?
For integrated circuits: generally 4 inch wafer thickness of 0.520mm, the thickness of the 6 inch wafer
Q:How to calculate the conversion efficiency of monocrystalline silicon
Proportion of dark current - Irev>6 cell ratioThe proportion of low efficiency tablets - the proportion of P156Eff<14.5% batteries8 inch single crystal conversion rate of about 18.5%; a single conversion rate of about 9 inches in about 18.6%; quasi single crystal (large particles) probably about 18%; the new diamond wire cutting rate can be converted to about 18.92%.
Q:The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?
Product advantages of electroplated diamond wireCurrent line cutting methodInternal cuttingThe material utilization rate is only 40%~50%, and there are many defects, such as the wide kerf, the lower material, the poor precision of the surface shape, the depth of the surface damage layer and the size of the workpiece being machined.
Q:One hundred watts of solar panels to how many pieces of silicon wafers, 156 of single crystals and polycrystalline
As for the power, according to the W=UI formula can be obtained, since a single voltage is fixed, the resulting current size determines the power of a battery, the current per tablet produced is not fixed, with the conversion rate of the conversion rate, high current is large, the reverse is small; the same the power conversion rate is high, the area is small
Q:How to make monocrystalline silicon solar cells
Phosphate glassThe process is used for solar cell production in the manufacturing process, through chemical etching silicon that is immersed in hydrofluoric acid solution, complexes six fluorosilicic acid to produce chemical reaction to produce soluble phosphorus silicon glass layer, a diffusion system to remove the node after the formation of the surface of the silicon wafer. In the diffusion process, POCL3 reacts with O2 to form P2O5 on the surface of silicon wafer. P2O5 reacted with Si to produce SiO2 and phosphorus atoms, which form a layer of phosphorus containing SiO2 on the surface of the silicon wafer. Removing phosphorosilicate glass equipment is generally composed of a main body, a cleaning tank, manipulator, servo drive system, electric control system and the automatic mixing acid system components, the main power source of hydrofluoric acid, nitrogen, compressed air, water, wastewater and exhaust heat. Hydrofluoric acid is capable of dissolving silicon dioxide because of the reaction of hydrofluoric acid and silica to produce volatile four fluorinated silicon gas. If the hydrofluoric acid is too heavy, the reaction of four fluorinated silicon will further react with hydrofluoric acid to produce soluble complex and the material of the six fluorine acid.
Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
There is a gap between the guide bar and C. silicon block, cut after the start, with the steel wire operation, part of the guide bar is broken into wire, steel wire dislocation, because the steel line will instantly locate in the cutting process, thus causing the phenomenon of silicon chip thickness.D. guide groove wear serious. Guide for coating of polyurethane materials, cutting knife must guide groove root wear, wheel groove cutting process of cutting steel wire side, in the wheel groove due to sloshing around the lead sheet thickness.

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