4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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10000 watt/month
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Product Description:

4W A Grade 156.75*156.75mm Polycrystalline Solar Cell

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

Long Service Life
High Efficiency Solar Cells
Special Aluminum Frame Design
High Transmission, Low Iron Tempered Glass
Advanced Cell Encapsulation

APPLICATIONS
Solar power stations
Rural electrification, Small home power systems
Power supply for traffic, security, gas industry
12V and 24V battery charging system
Other industrial and commercial application
 

Typical I-V curve

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

Warranties

6Inch 2BB  Polycrystalline Multi Solar Cells Mono Solar Cell

For c-Si panel: 25years output warranty for no less than 80% of performance, 10 years output warranty for no less than  90% of performance. Free from material and workmanship defects within 5 years.

For a-Si panel: 20 years output warranty for no less than 80% of performance, 10 years output warranty for no less than 90% of performance. Free from material and workmanship defects within 2 years.

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Q:What are the difficulties of silicon wafer cutting?
During the cutting process, the wafer quality and rate of finished products played a major role in the grain type, viscosity of silicon carbide powder cutting fluid and particle size, the viscosity of mortar, mortar flow, steel wire speed and wire tension and workpiece feed speed.TTV: and TTV stria stria and is a headache in the wafer processing, from time to time there will be a knife, impossible to guard against. TTV is when the knife into the line, and is easy to appear in the time line bow.
Q:After wafer cleaning, how to change the film?
Name compositionEffectSPMH2SO4: H2O2: H2ORemoval of heavy organic matter, but it is difficult to remove organic matter when it is very seriousDHFHF: (H2O2): H2OCorrosion of the surface oxide layer to remove metal contaminationAPM (SC1) NH4OH: H2O2: H2O can remove particles, some organic matter and some metals, this solution will increase the surface roughness of silicon waferHPM (SC2) HCl: (H2O2): H2O is mainly used to remove metal contamination
Q:What is the difference between silicon wafer P111 and P100
If the crystal is body centered cubic lattice, the crystal orientation through the cube on the diagonal atoms
Q:What is the role of the semiconductor wafer
The main role of the glue is coated with photoresist coated flat, the use of high-speed rotation of the centrifugal force
Q:Why do you choose a silicon chip as a chip?
What we're talking about is charging or discharging a capacitor,The capacitance of the electricity is not easy to put the end, in theory, is to be able to 100 years, in fact, and there are different, which is why some of the memory card for a long time on the bad reasonProcessing technology is not easy to say, anyway, there is no level in China, the study did not useProbably and CPU processing technology is the same
Q:Why do they make so many transistors on silicon in an integrated circuit
Small size, low power consumption! This is the advantage of IC ah.
Q:Development trend of monocrystalline silicon wafer
LDK LDK is committed to the development of a solar polysilicon materials, ingots and silicon chip R & D, production, sales as one of the world's leading PV enterprises". In the field of polysilicon, polysilicon LDK LDK project to establish a closed-loop circulation system of the most advanced production technology, and all components of waste will be recycled, not only cost savings, but also protect the environment, to solve the biggest bottleneck in polysilicon production technology. After the project is put into production, the cost control will be far beyond the current level of production in China to reach the international advanced level. This will be China's most promising in the environment, scale, cost, quality and other aspects of the overall success of the silicon material project. By 2009, LDK LDK is expected to become the world's leading production capacity of the largest, most technologically advanced, most environmentally friendly process of polysilicon and solar wafer production base. The first practical photovoltaic slicing machine was born in 1980s, it originated from the research and work of Dr. Charles Hauser. Dr. Charles Hauser is the founder of the Swiss HCT slicing system, which is now the predecessor of the application materials company PWS precision silicon wafer processing system division. These machines use a cutting line with a slurry to complete the cutting action. Today, the main structure of the silicon ingot and wafer cutting machine is still based on the original Charles Dr. Hauser machine, but the processing load and cutting speed has been significantly improved.
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
Common cutting methods for diamond wire cutting and sand cutting
Q:The relationship between the weight and the power of solar wafers!
The thickness of the silicon wafer is unchanged and the weight is unchanged:156*156,8 inch polycrystalline silicon chip efficiency reached 16%, single-chip power of 3.89W.This can be pushed: the thickness of the silicon wafer is 180, the efficiency is up to 16%, and the consumption of the single silicon is 3.89w*7g/w=27.23g.When the thickness of silicon wafer is 180, and the weight of silicon wafer is unchanged, the conversion rate of polycrystalline silicon chip is up to 18%, and the chip power is 156*156*0.18/1000=4.38WThis can be pushed: the thickness of the silicon wafer is 180, the weight of the silicon wafer is unchanged, and the conversion rate of the polycrystalline silicon sheet is up to 18%, and the polysilicon consumption per watt is 27.23/4.38=6.2g
Q:How to do on the silicon wafer
The general use of ultrasonic and pre cleaning (pickling) can be solved

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