4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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Product Description:

4W A Grade 156.75*156.75mm Polycrystalline Solar Cell

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

Long Service Life
High Efficiency Solar Cells
Special Aluminum Frame Design
High Transmission, Low Iron Tempered Glass
Advanced Cell Encapsulation

APPLICATIONS
Solar power stations
Rural electrification, Small home power systems
Power supply for traffic, security, gas industry
12V and 24V battery charging system
Other industrial and commercial application
 

Typical I-V curve

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

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4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

4W S Grade 156.75*156.75mm Polycrystalline Solar Cell

 

Warranties

6Inch 2BB  Polycrystalline Multi Solar Cells Mono Solar Cell

For c-Si panel: 25years output warranty for no less than 80% of performance, 10 years output warranty for no less than  90% of performance. Free from material and workmanship defects within 5 years.

For a-Si panel: 20 years output warranty for no less than 80% of performance, 10 years output warranty for no less than 90% of performance. Free from material and workmanship defects within 2 years.

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Q:The significance of silicon wafer heat treatment
2, heat treatment of several temperature interval concept:Thermal donor: 350-550 degrees Celsius, 450 degrees Celsius450 C after heat treatment (or equivalent effect, such as the cooling of a single crystal in a furnace), the resistivity of the N type sample can be decreased and the resistivity of the P type sample is increased, as is the introduction of a certain number of donor phenomena. This is due to the temperature of the dissolved oxygen atoms in the formation of complex (SiO4) caused by the thermal donor, the resistivity of silicon and oxygen content of the four side is inversely proportional to.New donor: 550-800 DEG C, on behalf of the temperature of 650 degrees Celsius
Q:Why silicon wafers are made in watts!
Battery specifications good variety:103*103mm125*125mm150*150mm156*156mmThe longest seen is the single crystal 125*125mm polycrystalline 156*156mm according to the efficiency to determine the current efficiency of the battery chip is 16%--19%
Q:What are the difficulties of silicon wafer cutting?
1, the impurity line caused by impurities in polycrystalline silicon ingot, slicing process can not completely remove the lead line on a silicon wafer.2, scratch line caused by mortar in large SIC particles or caking mortar. In the process of cutting, SIC particles stuck in between steel wire and silicon can not overflow, cause.Forms: including the whole line and half line marks, concave line, shiny, more narrow than the other.
Q:Is there anyone who knows how to choose a good glue
The viscosity requirement is so small, why the curing time is so long, the general curing time is long anaerobic adhesive, or structural adhesive.
Q:Consult the difference between silicon and battery
And the battery slice is cut the silicon wafer cleaning, making, P/N knot, printing and so on after the results of the process, directly cut the silicon chip can not be used for power generation.
Q:Why do you choose a silicon chip as a chip?
B is byte, B is bitIn the circuit, an output can output a high and a low, the high level is 1, the low level is 0, then the output is a bit, which is the smallest one memory cellThe output of the circuit is controlled by the gate, and the gate is controlled by a voltage,So, there will be a gate capacitance, capacitance, electricity, the output is 1, no electricity, the output is 0, tens of thousands of and 1 is a memory of the file, it may be a MP3, a movie...
Q:The meaning of various names
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer is produced
Q:The relationship between the weight and the power of solar wafers!
Calculation:The thickness of 180 unchanged, unchanged weight of the 156 monocrystalline silicon, conversion efficiency of up to 20% cases,Monolithic Power: 156*156*0.2/1000=4.86WThe consumption per watt of monocrystalline silicon wafers is: 27.23g/4.86W=5.6g/w
Q:What is the cutting fluid for solar wafer cutting?
Because in the China multi wire cutting machine was first used in semiconductor cutting, so that only the Swiss MB and HCT, the Swiss system thinking line cutting machine with special emphasis on power and environmental protection, so that this kind of machine in the cutting process of mortar viscosity requirement is relatively high, the most direct embodiment is to use the cutting fluid is oily, reflected in the raw material cutting fluid is used to peg, otherwise, the power will be the formation of excess waste machine. NTC is the rise in the solar industry on the occasion, we seize the opportunity, to imitate the Swiss line cutting machine design and production, but the Swiss precision machine modified to virtually out of order, the rapid development of the pursuit of efficiency of solar wafer cutting industry, especially to the rise of China solar wafer cutting industry thus, China quickly occupied the market leader, the share reached 65%. However, the company has done a little better, although the power system and the power of the machine to reduce a lot, you can use the machine in the use of cutting fluid on the Swiss machine standards. Oily cutting fluid cutting efficiency and surface cut out of the film is generally better than the aqueous solution of cutting fluid, but the performance of Japanese light wire cutting machine, which he used oily fluid will cause a burden on his power, so Japanese developed this kind of water-based cutting fluid. Regardless of the cost or the use of the Japanese machine are more consistent, and easy to recycle. This NTC machine oil cutting fluid and water-based cutting fluid can be used.
Q:What is the surface hardness of monocrystalline silicon and polycrystalline silicon wafers
When the contact depth is above 60NM, silicon wafer contact stiffness and contact depth of a linear relationship between the hardness and elastic modulus remained unchanged, the measured value of hardness and elastic modulus of silicon, are about 12.5GPa and 165.6GPa.

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