A Grade Polycrystalline Solar Cell 4.2W-4.3W

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Product Description:

A Grade Polycrystalline Solar Cell 4.2W-4.3W

Main Characteristic

17.6%-18% High Efficiency A Grade 125mm Monocrystalline Solar Cells

1.First-class production technology and packaging technology.
2.Adopting the world's leading technology of silicon and polycrystalline silicon cells, power density, peak hours more battery power, higher conversion efficiency.
3.Beautiful, stable, easy to take down the anodic aluminum frame electric degrees and has a wind-resistant, anti-snow function.

Features

17.6%-18% High Efficiency A Grade 125mm Monocrystalline Solar Cells

1.High transmissivity low-iron tempered glass, strong aluminium frame.

2.Manufactured according to international quality and Environment Management System (ISO9001, ISO14001).

3.Low voltage-temperature coefficient allows higher power output at high-temperature condition.

Product Pictures

 

A Grade Polycrystalline Solar Cell 4.2W-4.3W

A Grade Polycrystalline Solar Cell 4.2W-4.3W

 

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5) we design various of watt according to cuatomer!

6) We have the best customer service team!

7) We have excellent manufacturer solar panel warranty policy!

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Q:What is the harm of silicon chip into the fingers?
The silicon rod into silicon wafer after printed, someone with bare hands touched the wafer, because the chemical composition of the finger is very complex, in the cleaning process is not removed, causing subsequent corrosion is not uniform, the more to the more obvious after section
Q:Why do you want to make the wafer bigger?
The cost of the chip is directly related to the area. On the same chip, the more chips can be carved, the lower the price of the chip. Because silicon chips are inevitably produced defects (such as impurities, etc.). The larger the area of a chip, the higher the probability of the collision, and the higher the proportion of the whole wafer. A chip to do one hundred chips, a defect is 1\%. If only do ten, out of a defect is 10\%. An extreme example is the large CCD, professional camera or digital camera with the CCD is 23.7x15.6mm, light by the light area of 370 square millimeters, quickly catch up with the area of the high-end RISC processor
Q:Polished silicon wafers can be most SEM substrates
There are many kinds of polishing, mechanical polishing, chemical polishing, electrolytic polishing, ultrasonic polishing, fluid polishing, magnetic abrasive polishing!Beijing there throwing a new type of practical technology, science and technology can improve the Liz polishing efficiency and so on.
Q:Why should the wafer cut side, cut out edge Jiaosha
To determine the crystal, cutting the adhesive carbon or glass, mounted on the fixed equipment.In simple terms is to determine the crystal direction, in order to facilitate future cutting, design graphics to consider this point, and then ask a little deeper, it is necessary to look at the book.Transistors in general with 111 sides, MOS general 110The reason for this is related to doping, corrosion and other post production, but also the activity of different layers of electrons is different, potential energy is not the same.
Q:How much is the thickness of the silicon wafer
And two knives. We do DIP package, 4 inch wafer to thin to 0.300mm; 6 inch wafer to be reduced to about 0.320mm, error 0.020mm.
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The resistivity changes after annealing, as if it is mainly about the high resistivity of the oxygen donor.
Q:How many watts can a piece of silicon produce
A piece of silicon, has been able to integrate 160 thousand transistors. What a fine project! This is the crystallization of multidisciplinary collaborative efforts, is another milestone in the progress of science and technology.
Q:For solar wafer cutting diamond wire, what are the characteristics?
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume.3, can only be used for single crystal cutting.4, the cost problem. Now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive.
Q:After the completion of the silicon chip will appear in the shadow of the white spots or what is the situation? How to solve
Check the cleaning agent is uniform, cleaning time is appropriate
Q:Silicon chip cutting, NTC442 machine, a knife can cut the number of slices
This and your slot.. The stick / slot cutting root number number = *.

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