Solar Cell for Electricity 3KW Off-grid Solar Energy Generator System for Home

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100 watt
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10000 watt/month

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Product Description:

 156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Physical characteristics

Dimension 

156mm X 156 mm ±0.5mm

Wafer Thickness 

200um ±30um

Front(-) 

Four 1.1mm wide bus bars(silver) with distance 39mm,

Acid texturized surface with blue silicon nitride AR coating.

Back(+)

2.4mm wide silver/aluminum soldering pads, aluminum back surface field.

Product Pictures

 

Solar Cell for Electricity 3KW Off-grid Solar Energy Generator System for Home

Solar Cell for Electricity 3KW Off-grid Solar Energy Generator System for Home

Solar Cell for Electricity 3KW Off-grid Solar Energy Generator System for Home 

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Q:What is the harm of silicon chip into the fingers?
The silicon rod into silicon wafer after printed, someone with bare hands touched the wafer, because the chemical composition of the finger is very complex, in the cleaning process is not removed, causing subsequent corrosion is not uniform, the more to the more obvious after section
Q:What does TTV mean in silicon wafer production?
TTV, of course, the smaller the better. TTV is a measure of the quality of the silicon wafer is a very important indicator of process control, steel wire inspection, roundness is exceeded, the life of the guide wheel is up, the fixture is a problem, etc..
Q:Why integrated circuits can be etched on silicon
Integrated circuit (integrated circuit) is a kind of micro electronic device or component. With certain techniques, the transistor, required a circuit of resistance, capacitance and inductance components and interconnect wiring together, produced in a small or a few bits of the semiconductor wafer or substrate, and then encapsulated in a tube shell, a micro structure required for the circuit function; all of them element in the structure has formed a whole, so that the electronic components to miniaturization, low power consumption, high reliability and intelligent a huge step forward. It is represented by the letter "IC" in the circuit. The inventor of the integrated circuit is Jack Kilby (based on Ge) and the (silicon based (Si) integrated circuit). Most of the semiconductor industry today is based on silicon integrated circuit.A new type of semiconductor device developed in the late 1950s of 60s. It is through oxidation, photolithography, epitaxy, diffusion, evaporation of aluminum and semiconductor manufacturing process, the connecting wire between the required circuit has a certain function of the semiconductor, resistors, capacitors and other components and they are integrated in a small piece of silicon wafer, and then welding electronic devices are encapsulated in a casing. The outer shell of the utility model is provided with a round shell type, a flat type or a double line type. IC technology includes chip manufacturing technology and design technology, mainly in the processing equipment, processing technology, packaging testing, mass production and design innovation ability.
Q:Seeking for the video: manual insert silicon wafer single crystal insert method
After the water is put into the plug, each time the number of slices can not be more than fifty pieces, the number of chips too easy to fall damaged silicon. If the chip is not cleaned in time to allow the silicon chip in the water bubble, but the bubble can not be more than an hour
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma wafer cleaning parameters:Residual plasma cleaning method of particles 1, silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow; the use of either gas from the 02, Ar, N2; gas washing process parameters set process: the chamber pressure of 10-40 mTorr, process gas flow 100-500sccm time, 1-5s; process parameters of starting process is: the chamber pressure of 1040 mTorr, process gas flow on the electrode 100-500sccm, power 250-400W, time 1-10s.2, as described in the plasma cleaning method, the invention is characterized in that the gas used is 23, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 15 mTorr, process gas flow 300sccm, time 3S; process parameters of starting process is: the chamber pressure of 15 mTorr, process gas flow on the electrode 300sccm, power 300W, time Ss.4, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 10-20 mTorr, process gas flow 100-300sccm, time 1-5s; process parameters of starting process is: the chamber pressure of 10-20 mTorr, process gas flow on the electrode 100-300sccm, power 250-400W, when Lu 1-5s.
Q:I would like to ask the solar cell (silicon) production process is the principle of how
Silicon wafer detectionSilicon wafer is the carrier of solar cell, the quality of silicon wafer directly determines the conversion efficiency of solar cell. This procedure is mainly used to measure the technical parameters of silicon wafer on line. These parameters mainly include the surface roughness of the silicon wafer, the lifetime of the minority, the resistivity, the P/N type and the micro crack. The device is divided into four parts: automatic loading and unloading, silicon wafer transmission, system integration part and. The silicon photovoltaic detector on the silicon wafer surface roughness were detected, and the size and appearance of diagonal parameter detection chip; micro crack detection module is used to detect silicon micro cracks; another two detecting module, one online test module to test wafer resistivity and wafer type, another module for lifetime test wafer. The detection of the diagonal and micro cracks of the silicon wafer is needed before the sub lifetime and resistivity measurement. Wafer inspection equipment can automatic loading and unloading, and substandard products in a fixed position, so as to improve the detection accuracy and efficiency.
Q:How to make monocrystalline silicon solar cells
Wafer inspectionSilicon wafer is the carrier of solar cell, the quality of silicon wafer directly determines the conversion efficiency of solar cell. This procedure is mainly used to measure the technical parameters of silicon wafer on line. These parameters mainly include the surface roughness of the silicon wafer, the lifetime of the minority, the resistivity, the P/N type and the micro crack. The device is divided into four parts: automatic loading and unloading, silicon wafer transmission, system integration part and. The silicon photovoltaic detector on the silicon wafer surface roughness were detected, and the size and appearance of diagonal parameter detection chip; micro crack detection module is used to detect silicon micro cracks; another two detecting module, a [url=] module [/url] online test mainly test wafer resistivity and wafer type, on the other a module for lifetime test wafer. The detection of the diagonal and micro cracks of the silicon wafer is needed before the sub lifetime and resistivity measurement. Wafer inspection equipment can automatic loading and unloading, and substandard products in a fixed position, so as to improve the detection accuracy and efficiency.
Q:What is the specific way to clean the silicon wafer suede concrete steps
LED epitaxial wafer process:Over the past decade, in order to develop high brightness blue light-emitting diode, all over the world, the relevant research personnel are fully invested. The commercialization of products such as blue and green light-emitting diode two LED and laser diode LD application of the - III - V elements of the potential. In the current commercial LED materials and technology extension, red and green light emitting diodes are mainly epitaxy growth method of liquid phase epitaxy, and yellow, orange light emitting diode is still in vapor phase epitaxial growth method to grow P GaAs GaAsP materials.In general, the growth of GaN requires a very high temperature to interrupt the NH3 of the N-H solution, on the other hand, the kinetic simulation also learned that NH3 and MO Gas will react to produce no volatile by-products.
Q:What is a silicon wafer for unidirectional and bidirectional cutting? What is the difference between the two?
Bidirectional cutting line cutting, (1) from the line wheel line network and enter the waste wire wheel (2) after a certain length reverse line wheel released by the waste reverse into the line network into the line wheel (3) repeat from the line wheel into the wire and into the process of waste wire wheelBut the length of 1 is greater than 2
Q:What's the difference between a silicon wafer and a battery?
Silicon chip, is a large piece of silicon, cut into a filmSolar cell, the mainstream is the silicon wafer made of crystalline silicon solar cells, or other solar cells: thin film solar cells, amorphous silicon solar energy, solar cells and so on

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