Product Description:
185W Solar Energy System Solar Panel Monocrystalline Silicon Solar Cells
Main Characteristic
17.6%-18% High Efficiency A Grade 125mm Monocrystalline Solar Cells
1.First-class production technology and packaging technology.
2.Adopting the world's leading technology of silicon and polycrystalline silicon cells, power density, peak hours more battery power, higher conversion efficiency.
3.Beautiful, stable, easy to take down the anodic aluminum frame electric degrees and has a wind-resistant, anti-snow function.
Eff(%) | 18.00- 18.10 | 18.10- 18.20 | 18.20- 18.30 | 18.30- 18.40 | 18.40- 18.50 | 18.50- 18.60 | 18.60- 18.70 | 18.70- 18.80 | 18.80- 18.90 | 18.9- 19.0 | 19.1- 19.1 | 19.1- 19.2 |
Pm(W) | 4.30 | 4.33 | 4.35 | 4.37 | 4.40 | 4.42 | 4.44 | 4.47 | 4.49 | 4.52 | 4.54 | 4.56 |
Isc(A) | 8.71 | 8.73 | 8.76 | 8.77 | 8.78 | 8.82 | 8.83 | 8.85 | 8.86 | 8.88 | 8.9 | 8.93 |
Im(A) | 8.19 | 8.21 | 8.24 | 8.26 | 8.30 | 8.33 | 8.35 | 8.39 | 8.42 | 8.45 | 8.47 | 8.51 |
Voc(V) | 0.630 | 0.631 | 0.632 | 0.633 | 0.634 | 0.634 | 0.635 | 0.636 | 0.637 | 0.637 | 0.638 | 0.64 |
Vm(V) | 0.527 | 0.528 | 0.529 | 0.531 | 0.531 | 0.532 | 0.534 | 0.534 | 0.535 | 0.536 | 0.537 | 0.538 |
FF(%) | 78.6 | 78.7 | 78.8 | 79．0 | 79.2 | 79.3 | 79.5 | 79.6 | 79.8 | 80 | 80 | 80 |
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1. Shipment shall be made only after PAYMENT is received.
2. Please do inform us your DETAILED ADDRESS AND CONTACT INFOMATION before shipment.
3. Shipment shall be made in THREE WORKING DAYS.
- Q:What are the aspects of silicon wafer testing?
- Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
- Q:What is the cutting fluid for solar wafer cutting?
- MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
- Q:What is the silicon area of the 125 diagonal of a single crystal of 160?
- 160 refers to the diagonal length of the chamfer, you draw a map can be calculated, the specific algorithm is:
- Q:What is a silicon chip used for?What does it have to do with semiconductors.What are the components on the PCB board with silicon?
- But a good silicon chip is not available. Because the bare silicon wafer is not easy to damage and difficult to connect. This is a process of binding, the so-called binding is bound to use a very fine gold wire from the silicon chip lead wire, received on the metal pipe, and then use the non-conductive plastic to bind the chip sealed. We generally see transistors, chips, etc. are packaged, you simply can not see the inside of the core. Of course is also useful in metal or ceramic chip shell, such as the two or three level of some high power tubes, military grade components etc., but because the metal and ceramic package cost is relatively high, so most of the circuit or engineering plastic package.PCB is a printed circuit board, is what we call the board. The copper wire and the welding of various components and chips. The manufacturing of printed circuit board, you should check the information bar, then I talk today what also don't want to do
- Q:Why silicon wafers are made in watts! There are several specifications for silicon wafers!
- A - (Si) amorphous silicon cells usually use high frequency glow discharge method to decompose the silane gas. Due to the low deposition temperature, the film can be deposited on glass, stainless steel plate, ceramic plate and flexible plastic sheet with a thickness of about 1 m, which is easy to large area (05rn * l.0m), and the cost is low. The structure of P in is adopted. In order to improve the efficiency and improve the stability, sometimes also made of three layers of P in multilayer laminated structure, or insert some transition layer. Its commercial production continued to grow, with an annual output capacity of 45MW / A, 10MW production line has been put into production, the global market volume of about 10 million per month, ranking first in the thin film battery. The development of integrated a - Si solar battery components, the use of the effective area of laser cutting is more than 90%, small area conversion efficiency increased to 14.6%, a large production of 8 to 10%, the highest efficiency of the laminated structure is 21%. Research and development trend is to improve the characteristics of the film, the precise design of photocell structure and control the thickness of each layer, improve the interface between the layers of state, in order to achieve high efficiency and high stability.
- Q:Consult the difference between silicon and battery
- From the silicon wafer to the battery piece needs to undergo the process of making wool, and the single crystal silicon wafer is generally made of alkali. Therefore, the appearance of monocrystalline silicon battery is black, and the appearance of polycrystalline silicon sheet is dark blue.
- Q:Mainly want to understand its physical principles and processing technology, thank you
- What we're talking about is charging or discharging a capacitor,The capacitance of the electricity is not easy to put the end, in theory, is to be able to 100 years, in fact, and there are different, which is why some of the memory card for a long time on the bad reasonProcessing technology is not easy to say, anyway, there is no level in China, the study did not useProbably and CPU processing technology is the same
- Q:How to make the photoresist and silicon substrate adhesion better
- By the way, if there is a reflection of the bottom, then you need to coat a layer of BARC, and then at coat PR.Hope can help you.
- Q:Is a wafer a silicon wafer and a wafer?Please try to speak more popular, can be said to be made of silicon wafers do
- Ion implantation, etc., can be made into various semiconductor devices
- Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon. What are the most commonly used methods. Loss big? Thank you
- Wire cutting equipment, NTC, HCT these two brands are relatively large
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