Solar Cell High Quality A Grade Cell Monorystalline 5v 17.8%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 17.8%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 17.8%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:Manufacturers of solar wafers belong to the photovoltaic industry which specific industry classification below
Photovoltaic involves a lot, but the company makes silicon chips in terms of, so if the use of photovoltaic culvert cover, too general, I need a detailed classification of the industry, and then go to the specific industry analysis
Q:Why do you want to make the wafer bigger?
The cost of the chip is directly related to the area. On the same chip, the more chips can be carved, the lower the price of the chip. Because silicon chips are inevitably produced defects (such as impurities, etc.). The larger the area of a chip, the higher the probability of the collision, and the higher the proportion of the whole wafer. A chip to do one hundred chips, a defect is 1\%. If only do ten, out of a defect is 10\%. An extreme example is the large CCD, professional camera or digital camera with the CCD is 23.7x15.6mm, light by the light area of 370 square millimeters, quickly catch up with the area of the high-end RISC processor
Q:What's the connection between silicon wafer and wafer
Just make full use of solar silicon semiconductor optical electrical / thermal conversion characteristics can be said to be the physical characteristics of a simple application, even now, do you use the Internet fiber to your computer to the Internet, there is a light receiver in your side, just because the wavelength of fiber can be much shorter than natural light so more energy so we do not have large silicon wafer as a light receiver are possible, and other materials such as APD in sphalerite semiconductor applications on PIN-diode
Q:How to convert photovoltaic silicon MW
1MW=100 myriabit125*125 film general single chip 2.3W--2.8W156*156 film general single chip 3.6W-4.2WSilicon chip number =100W divided by Monolithic Power
Q:Why integrated circuits can be etched on silicon
First of all, the general circuit of the insulator, just a carrier, it plays the role of support and insulation. As for the integrated circuit, the bottom layer is called the substrate (generally P type semiconductor), is to participate in the work of integrated circuits. CMOS process, so the Nmos substrate are connected together, are the same substrate.Another image, that is, the integrated circuit is a combination of some electronic components and wiring, no insulation and insulation as a support. It is achieved by adding bias and other techniques to isolate.
Q:Who is the best silicon chip dryer?
Silicon wafer drying machine is the Wuxi automation technology to do, that is, before the design of the Song Jiang Yang, now is an upgraded version of the. Easy to use.
Q:The production of silicon units do front-line production workers harmful to the body
Please also note: as long as it is in the production of factory work, there are more or less some occupation hazards, such as peripheral equipment operation noise, dust production, if the production site without the necessary protective equipment is also possible occupation disease.So my answer is only from the perspective of occupational protection.
Q:How to avoid or reduce the fragmentation of thin silicon wafers without wax polishing?
The wax free polishing template can ensure the free rotation of the silicon wafer in the groove of the template,
Q:What is a silicon wafer for unidirectional and bidirectional cutting? What is the difference between the two?
Bidirectional cutting line cutting, (1) from the line wheel line network and enter the waste wire wheel (2) after a certain length reverse line wheel released by the waste reverse into the line network into the line wheel (3) repeat from the line wheel into the wire and into the process of waste wire wheelBut the length of 1 is greater than 2
Q:After the completion of the silicon chip will appear in the shadow of the white spots or what is the situation? How to solve
Whether or not fully diluted before drying. I couldn't see the actual product.

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