6 Inch Multi Solar Cell -- 156 x 156 mm

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100 watt
Supply Capability:
10000 watt/month

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Product Description:

6 Inch Multi Solar Cell -- 156 x 156 mm

FEATURES
`Long Service Life
`High Efficiency Solar Cells
`Special Aluminum Frame Design
`High Transmission, Low Iron Tempered Glass
`Advanced Cell Encapsulation

Solar Module Specifications

  Mono 80W—100W

Module

Type (36 Series)

Encapsulation

Glass/EVA/Cells/EVA/TPT

Parameters

SNM-M80(36)

SNM-M85(36)

SNM-M90(36)

SNM-M95(36)

SNM-M100(36)

Max power

Pm(W)

80W

85W

90W

95W

100W

Tolerance

+/-3%

Open circuit voltage

Voc(V)

21.2

21.8

21.8

22.3

22.6

Short circuit current

Isc(A)

4.84

5.00

5.30

5.44

5.68

Max. power voltage

Vmp(V)

17.5

18.0

18.0

18.5

18.5

Max. power current

Imp(A)

4.57

4.72

5.00

5.14

5.40

Dimensions

(L*W*H)

1200x540x35mm

Net Weight

(kg)

9

Max. system voltage

(V)

1000VDC

Operate Temp. Scope

-40/+85'C

Resistance

227g steel ball fall down from 1m height and 120m/s wind

Warranty

Pm is no less 90% in 10 years and no less 80% in 25 years

STC

(Standard Test Condition: 1000W/m2, AM1.5, and 25'C)

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6 Inch Multi Solar Cell -- 156 x 156 mm

6 Inch Multi Solar Cell -- 156 x 156 mm

6 Inch Multi Solar Cell -- 156 x 156 mm

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Q:Is the thickness of solar cell silicon wafer certain? Specifically how much
The rest is just the substrate, it doesn't work. Do not understand, then you can look at the film thickness of the battery, you will understand.
Q:What is a semiconductor silicon device tester
Then, the image point set circuit is used to realize the isolation of the electrical components and the connecting wires, and the insulation and the insulation of the insulation are not connected with the insulation
Q:What are the raw materials of silicon wafers
Silicon transistorSemiconductor materials can be divided into silicon and germanium transistors. According to the polarity of the transistor can be divided into germanium NPN transistor, germanium PNP transistor, silicon NPN transistor and silicon PNP transistor.
Q:How to deal with silicon wafer annealing
Silicon wafer annealing process, is a part of the process. According to a certain procedure, the process of heating and cooling..;
Q:Consult the difference between silicon and battery
From the silicon wafer to the battery piece needs to undergo the process of making wool, and the single crystal silicon wafer is generally made of alkali. Therefore, the appearance of monocrystalline silicon battery is black, and the appearance of polycrystalline silicon sheet is dark blue.
Q:Why can silicon chips store information? Even if it is a miniature circuit, unplug the power will be no electricity
So when you need to save the power. As you say the iron, can be used to save the information - the tape is the use of micro magnets to record
Q:How many watts can a piece of silicon produce
The content of silicon in the earth's crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Because silicon is one of the most abundant elements in the earth, the solar battery that destined to enter the mass market (mass market) products, reserves of advantage is to become one of the reasons the main photovoltaic silicon materials.
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
However, in order to manufacture semiconductor components and integrated circuits (IC). Pure silicon wafers have to be created and then used in a variety of processes, such as etching, doping, etc., to make conductive semiconductor circuits on silicon wafers. This process can achieve the level of precision represents the level of semiconductor manufacturing processes, such as the computer's CPU is the number of microns with the manufacture of technology. Because the process is more precise, in the same size of silicon, can make a number of more circuits, that is to achieve a higher degree of integration. At the same time, because the distance between the circuit is small, the length of the wire is short, the required working voltage is lower, the power consumption can be reduced, and the operating speed can be increased.
Q:Ultrasonic cleaning cleaning silicon?
3, the silicon wafer cleaning is very important in semiconductor manufacturing process, and the cleaning plate is the most difficult of all cleaning process. Due to the use of silicon ultrasonic cleaning machine, penetration through the physical, the pollution particles from the wafer surface, through mechanical and chemical corrosion of ultrasonic cleaning, the final removal of pollution particles, reached the purpose of wafer cleaning.
Q:What are the aspects of silicon wafer testing?
Silicon chips have side length 125mm, 156mm, and 125 of the large chamfer diagonal 156mm and small chamfer diagonal 165mm, polycrystalline silicon chip to the side of the 156mm based, diagonal 219.2mm.

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