Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

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Product Description:

Brief Introduction

 

- Up to 20.0% efficiency, one of the highest performing mono crystalline cells on the market

- Three bus bars boosts current collection over the entire cell area, leading to higher fill factors 

- Blue anti-reflecting coating allows more sunlight be captured and converted to electricity

- Finer, closer fingers improves charge collections for improved energy yield

- Lower light-induced degradation leads to greater power output over the entire module lifetime

- All solar cells are tightly classified to optimize output of module

- Maximum yield and longevity due to hotspot prevention

- Premium appearance results in a highly uniform and aesthetically appealing module

 

 

Specification

- Product Mono-crystalline silicon solar cell 

- Dimension 156 mm x 156 mm ± 0.5 mm 

- Thickness 200 μm ± 30 μm 

- Front 1.5 ± 0.1 mm busbar (silver)

- Silicon nitride antireflection coating 

- Back 3.0 mm continuous soldering pads (silver)

- Back surface field (aluminum)

 

 

 Electric performance parameters 

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

- Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

- Imin : at 0.5 V


 Light Intensity Dependence

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

 

 Soldering Ability

 

- Peel Strength: > 1.0 N/mm (Pull soldered ribbon from busbar in 5 mm/s of 180°)

 

 

 Dimension Figure

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0


Quick Response

- Any time and anywhere, reply clients' email and solve all problems happen in the work  at the first time.

- Remove clients doubts and offer the best solution at the first time.

- Give our clients the lastest news of the photovoltaic, update the newest stock informtion.

 

 

 Production and Quality Control

- Precision cell efficiency sorting procedures

- Stringent criteria for color uniformity and appearance

- Reverse current and shunt resistance screening

- ISO9001,ISO14001 and OHSAS 18001,TUV Certificated


Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.






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Q:How much harm silicon on the human body
If it is at least module, such as CVD PVD, there are some toxic gases
Q:Why integrated circuits are rectangular and the silicon chips are round
The disk that you see is a wafer. This disk is not only the production of a chip, but N multiple chips are produced in this disk.
Q:After wafer cleaning, how to change the film?
2, surface metal cleaning(1) HPM (SC22) cleaning (2) DHF cleaningMetal contamination of silicon surface has two kinds of adsorption and desorption mechanism: (1) compared with the negatively charged silicon high metal such as Cu, Ag, Au, from the silicon surface to capture electron on the surface of the silicon direct formation of chemical bonds. Has a high redox potential of the solution to obtain electrons from these metals, resulting in metal the ionized form dissolved in the solution, so that this type of metal removed from the silicon surface. (2) compared with the negatively charged silicon low metal, such as Fe, Ni, Cr, Al, Ca, Na, K can be easily ionized in solution and deposited on the silicon wafer surface natural oxide film or a chemical oxide film on these metals in dilute HF solution with a natural oxide film or a chemical oxide film is easily removed.3, organic cleaningThe removal of organic silicon surface cleaning fluid used is SPM.SPM with high oxidative capacity, metal oxide can be dissolved in solution, and the oxidation of organic compounds to produce CO2 and.SPM cleaning water can remove the surface of silicon wafer heavy organic contamination and some metal, but when organic contamination is heavy will make carbonization of organic matter and difficult to remove by SPM. After cleaning, the silicon surface residual sulfide, the sulfide particles is difficult to use to water wash out.
Q:Silicon rod / wafer processing production
At present, more than 98% of the electronic components are all made of monocrystalline silicon. Among them, the CZ method accounts for about 85%, and the other part is the FZ growth method. Monocrystalline silicon grown by the CZ method for the production of low power integrated circuit components. The FZ method is mainly used in the growth of monocrystalline silicon in high power electronic components. The CZ method is more commonly used than the FZ method in the semiconductor industry, mainly because of its high oxygen content provides the advantages of wafer strengthening.
Q:Why not use N type silicon crystal silicon battery
N type silicon wafer from the raw material price or quantity, and P type silicon wafer or some gap. This also led to the battery chip manufacturers for N battery has been in the laboratory stage, not mass production.Again, the P type battery is to take GA or boron, but the N type batteries into another material, I am not very clear, not engage in technology, huh, huh, huh, huh.The above information, I hope to help you.
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma cleaning relates to the field of etching technology, and fully satisfies the removal of residual surface of silicon wafer after etching processKeep particle cleaningBackground technologyIn the etching process, the particles come from many sources: etching gas such as Cl2, HBr, CF4 etc. are corrosive, etching after the end will have a certain number of particles on the surface of the silicon wafer reaction chamber; a quartz cover will produce quartz particles in plasma bombardment; reaction chamber liner (liner) also metal particles will be produced in the etching process for long time. The surface residual silicon etching after particles block conductive connection, cause damage to the device. Therefore, the control of particles is very important in the etching process.
Q:Why do they make so many transistors on silicon in an integrated circuit
This means that you do not understand the meaning of integrated circuitsI suggest you go online to see what is integrated circuit
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The silicon wafer contact material uses the quartz material, does not contact the metal material
Q:What are the aspects of silicon wafer testing?
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;
Q:How to do on the silicon wafer
The general use of ultrasonic and pre cleaning (pickling) can be solved

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