Solar Cell High Quality A Grade Cell Monorystalline 5v 18.0%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:After cutting a few chips, mortar density is getting lower and lower
Iron powder and silica fume more and more, the density should be more and more big, unless it is your water content is higher and higher
Q:Why should the wafer cut side, cut out edge Jiaosha
To determine the crystal, cutting the adhesive carbon or glass, mounted on the fixed equipment.In simple terms is to determine the crystal direction, in order to facilitate future cutting, design graphics to consider this point, and then ask a little deeper, it is necessary to look at the book.Transistors in general with 111 sides, MOS general 110The reason for this is related to doping, corrosion and other post production, but also the activity of different layers of electrons is different, potential energy is not the same.
Q:How to make a resistor on a silicon chip (integrated circuit)
Method for making the Baidu transistor circuit.Simply by laser, and method of mixed batch chemical piling up complex circuit
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The silicon wafer contact material uses the quartz material, does not contact the metal material
Q:What is the meaning of the wafer (100), the crystal orientation index or the crystal plane index
It's the wrong markIt should be pointed outCrystal growth direction
Q:Why do monocrystalline silicon chamfer? Polysilicon film?
After the wafer after cutting edge surface with corners burr edge collapse even cracks or other defects, the edge of rough surface. In order to increase the mechanical strength of silicon slice edge surface, reduce particle pollution, will be the edge grinding in a circular arc shape or a trapezoid
Q:Why the resistivity of silicon wafer is high and low
For example, after heating resistance and cooling, more or less there will be changes in the normal temperature change, is allowed error.
Q:Solar silicon wafer cutting fluid can burn explosion?
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume3, can only be used for single crystal cutting4, the cost of the problem, and now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
But a good silicon chip is not available. Because the bare silicon wafer is not easy to damage and difficult to connect. This is a process of binding, the so-called binding is bound to use a very fine gold wire from the silicon chip lead wire, received on the metal pipe, and then use the non-conductive plastic to bind the chip sealed. We generally see transistors, chips, etc. are packaged, you simply can not see the inside of the core. Of course is also useful in metal or ceramic chip shell, such as the two or three level of some high power tubes, military grade components etc., but because the metal and ceramic package cost is relatively high, so most of the circuit or engineering plastic package.PCB is a printed circuit board, is what we call the board. The copper wire and the welding of various components and chips. The manufacturing of printed circuit board, you should check the information bar, then I talk today what also don't want to do
Q:The meaning of various names
Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough wafer in doping some impurities, such as P, B and so on, to change its resistance, thus had low resistance, high resistance, heavily doped term coated can be understood as the extension of Epi, according to the specific requirements of the device semiconductor is made of wafer, is usually used in high-end IC and special IC, such as Si on insulator (SOI). In the production process of IC wafer

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