250W Solar Panels for Home Use Solar Power System

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10000 watt
Supply Capability:
20000000 watt/month

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Solar panel refers to a panel designed to absorb the sun's rays as a source of energy for generating electricity or heating. A PV module is a packaged, connected assembly of typically 6×10 solar cells. Solar PV panels constitute the solar array of a photovoltaic system that generates and supplies solar electricity in commercial and residential applications.


 Main Characteristic

1.Manufactured according to international quality and Environment Management

    System (ISO9001, ISO14001)

2. By the high transmittance, low iron tempered glass, anti-aging of the EVA(polyethylene - vinyl acetate), high-performance crystalline silicon solar cells, good Weather resistance TPT (fluoroplastics composite membrane) by pyramid , has a good Weather resistance and anti-UV, hail, water-proof capacity.

3.  OEM and customerized package are accepted

4. High efficiency crystalline silicon solar cells


Quality warranty

1.10 years limited warranty on material and workmanship

2. more than 90% power output in 10 years

3. more than 80% power output in 25 years


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250W Solar Panels for Home Use Solar Power System

250W Solar Panels for Home Use Solar Power System

250W Solar Panels for Home Use Solar Power System

250W Solar Panels for Home Use Solar Power System

250W Solar Panels for Home Use Solar Power System


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Q:How is the silicon chip integrated circuit?
Based on TTL series integrated circuit as an example, from silicon to process integrated circuit: cut off from a monocrystalline silicon chip, polished - polishing - oxidation - lithography - diffusion - epitaxial buried layer - oxidation - oxidation - diffusion - isolation lithography lithography - base diffusion - oxidation lithography - emitter diffusion vacuum aluminizing - sintering (ohmic contact lithography) - at the initial test procedure is done.
Q:What is the difference between the purpose of wafer cleaning and the cleaning of silicon material, what is the difference between the acid used
A technique used to reduce the reflectivity of silicon, which is cleaned only by hydrofluoric acid
Q:How many times is the resistance of the same size silicon
Silicon is an important semiconductor material, chemical element symbol Si, the silicon used in the electronic industry should have high purity and excellent electrical and mechanical properties
Q:Is solar silicon wafer often harmful to the body?
Thousands of years of evolution of organisms around the common substances are toxic to stimulate immune function.
Q:What is the cutting fluid for solar wafer cutting?
MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
Q:Why integrated circuits can be etched on silicon
Integrated circuit (integrated circuit) is a kind of micro electronic device or component. With certain techniques, the transistor, required a circuit of resistance, capacitance and inductance components and interconnect wiring together, produced in a small or a few bits of the semiconductor wafer or substrate, and then encapsulated in a tube shell, a micro structure required for the circuit function; all of them element in the structure has formed a whole, so that the electronic components to miniaturization, low power consumption, high reliability and intelligent a huge step forward. It is represented by the letter "IC" in the circuit. The inventor of the integrated circuit is Jack Kilby (based on Ge) and the (silicon based (Si) integrated circuit). Most of the semiconductor industry today is based on silicon integrated circuit.A new type of semiconductor device developed in the late 1950s of 60s. It is through oxidation, photolithography, epitaxy, diffusion, evaporation of aluminum and semiconductor manufacturing process, the connecting wire between the required circuit has a certain function of the semiconductor, resistors, capacitors and other components and they are integrated in a small piece of silicon wafer, and then welding electronic devices are encapsulated in a casing. The outer shell of the utility model is provided with a round shell type, a flat type or a double line type. IC technology includes chip manufacturing technology and design technology, mainly in the processing equipment, processing technology, packaging testing, mass production and design innovation ability.
Q:Why do you use a concentrated sulfuric acid and hydrogen peroxide to wash silicon?
But it is best not to use, the use of water under normal conditions and these two kinds of things can be caustic clean silicon, 100% recycled mortar is not the problem, but this requires tens of thousands of cost and appropriate design, I am clean
Q:After cutting a few chips, mortar density is getting lower and lower
Iron powder and silica fume more and more, the density should be more and more big, unless it is your water content is higher and higher
Q:Monocrystalline silicon processing technology
Wafer thickness is also a factor in productivity, as it relates to the number of wafers produced by each silicon block. The ultrathin wafer presents additional challenges to the wire technology, because the production process is much more difficult to. In addition to the mechanical brittleness of silicon wafers, if the wire sawing process no precise control, slight crack and bending will have negative effects on product yield. The system must be of ultra-thin silicon wire technology, linear cutting line speed and pressure, and precise control of cutting coolant.Regardless of the thickness of the silicon wafer, crystal silicon solar cell manufacturers have made great demands on the quality of the silicon wafer. The wafer cannot have surface damage (minor cracks, wire mark), morphology defects (bending, convex, uneven thickness) to minimize additional back-end processing such as polishing and other requirements to a minimum. Current situationIn order to meet the market for lower cost and higher productivity, a new generation of wire must improve the cutting speed, the use of silicon longer so as to improve the cutting load. Thinner cutting lines and thinner silicon chips increase productivity, while advanced process control can manage cutting line tension to keep the cutting line firm.
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
General loss of about 40%, the general thickness of about 190um silicon, cutting seam in 120um

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