High Current Solar Cell 16.8% Polycrystalline Silicon Solar Cell Price

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Product Description:

4 Bus Bars 156*156 17.6% efficiency poly solar cell 

PHYSICAL CHARACTERISTICS

 

Dimension:  156mm x 156mm ± 0.5mm

Wafer Thickeness:  180um+20um and 200um+20um

Front(-)                  Four 1.2mm silver busbar

                               Silicon nitride blue anti-reflection coating

                             

Back(+)                 aluminum back surface field
                                1.75mm(silver)  wide segment soldering pads

High Current Solar Cell 16.8% Polycrystalline Silicon Solar Cell Price


 Typical Electrical Characteristics

 

Efficiency

W(Pmpp)

V(Umpp)

A(Impp)

V(Uoc)

A(Isc)

17.4-17.5

4.234

0.517

8.231

0.622

8.759

17.5-17.6

4.259

0.519

8.243

0.623

8.769

17.7-17.8

4.283

0.521

8.256

0.625

8.779

17.8-17.9

4.307

0.523

8.268

0.626

8.788

17.9-18.0

4.332

0.525

8.281

0.627

8.798

18.0-18.1

4.380

0.529

8.306

0.629

8.808

18.1-18.2

4.405

0.531

8.318

0.632

8.818

18.2-18.3

4.429

0.533

8.331

0.633

8.837

18.3-18.4

4.453

0.535

8.344

0.634

8.847

18.4-18.5

4.478

0.537

8.356

0.636

8.856

18.5-18.6

4.502

0.539

8.369

0.637

8.866

 

 

 

 


Efficiency

W(Pmpp)

V(Umpp)

A(Impp)

V(Uoc)

A(Isc)

20.90-21.00

5.06

0.557

9.007

0.653

9.688

20.80-20.90

5.04

0.556

9.062

0.652

9.683

20.70-20.80

5.02

0.554

9.055

0.651

9.684

20.60-20.70

4.99

0.552

9.033

0.651

9.672

20.50-20.60

4.97

0.550

9.002

0.650

9.673

20.40-20.50

4.94

0.548

9.012

0.649

9.674

20.30-20.40

4.92

0.546

9.009

0.649

9.655

20.20-20.30

4.89

0.543

9.012

0.648

9.634

20.10-20.20

4.87

0.541

8.998

0.648

9.617

20.00-20.10

4.85

0.540

8.977

0.647

9.600



*Data under standard testing conditional (STC):1,000w/m2,AM1.5, 25°C , Pmax:Positive power tolerance.

 

3 Bus Bars 156*156 17.4% efficiency poly solar cell 

Dimension:  156 mm x 156 mm ± 0.5 mm

Wafer Thickeness: 156 mm x 156 mm ± 0.5 mm


High Current Solar Cell 16.8% Polycrystalline Silicon Solar Cell Price

Typical Electrical Characteristics:

 

Efficiency code16601680170017201740176017801800182018401860
Efficiency (%)16.616.817.017.217.417.617.818.018.218.418.6
Pmax       (W)4.044.094.144.194.234.284.334.384.434.484.53
Voc          (V)0.6120.6150.6180.6210.6240.6270.6290.630.6330.6350.637
Isc           (A)8.428.468.518.568.618.658.698.738.778.818.84
Imp         (A)7.917.998.088.168.228.278.338.388.438.488.53

* Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

* Imin : at 0.5 V


Production:

High Current Solar Cell 16.8% Polycrystalline Silicon Solar Cell Price



Package:


High Current Solar Cell 16.8% Polycrystalline Silicon Solar Cell Price



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.




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Q:The purpose and means of chemical etching of silicon wafers?
After slicing and grinding, the surface of silicon wafer has a layer of damage and pollution due to processing stress
Q:What is the difference between the purpose of wafer cleaning and the cleaning of silicon material, what is the difference between the acid used
You say that the silicon wafer cleaning is not the same as that of the silicon material, and the silicon material is washed with hydrofluoric acid
Q:How to convert photovoltaic silicon MW
156 single crystal (chamfer 200) area: 238.95125 single crystal (chamfer 165) area: 154.831MW=1 * (10 negative) W
Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
Silicon wafer wire cutting will appear thick sheet, for the following reasons:1, the whole chip thickness:The A. guide slot is not uniform. Wafer thickness = slot steel wire diameter -4 times (SIC) D50, according to the requirements of wafer thickness required, you can calculate the best slot. In addition, because in the cutting process, steel wire wear, steel wire diameter decreases, and the port changed from round to oval, so the guide slot should be compensated according to the loss situation, to ensure the uniformity of wafer thickness.
Q:One hundred watts of solar panels to how many pieces of silicon wafers, 156 of single crystals and polycrystalline
As for the power, according to the W=UI formula can be obtained, since a single voltage is fixed, the resulting current size determines the power of a battery, the current per tablet produced is not fixed, with the conversion rate of the conversion rate, high current is large, the reverse is small; the same the power conversion rate is high, the area is small
Q:Why do you use a concentrated sulfuric acid and hydrogen peroxide to wash silicon?
Because of the use of sand when the recovery of mortar used too much, resulting in increased viscosity and organic impurities
Q:8 inch monocrystalline silicon area?
Generally refers to the round wafer, 8 inch refers to the diameter of 8 inches, "=2.54cm", the area of the circle you will ask for 1.
Q:P type and N type monocrystalline silicon chip difference?
The doping of phosphorus in monocrystalline silicon is N type, the more the phosphorus is, the more free electrons, the stronger the conductivity, the lower the resistivity;
Q:What is a silicon wafer
Silicon is an important material in the IC fabrication, through photolithography and ion implantation on the silicon wafer and other means, can be made into various semiconductor devices made of silicon chip. With amazing computational capabilities. The development of science and technology promotes the development of semiconductor. Development of automation and computer technology, this makes the silicon chip (integrated circuit) high technology product cost has been reduced to a very low degree. This makes the silicon wafer has been widely used in aerospace, industry, agriculture and national defense, and even crept into every family.
Q:What are the aspects of silicon wafer testing?
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;

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