Monocrystalline Silicon Wafer, Solar Wafer, 156*156mm

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100 Pcs PCS
Supply Capability:
700 MW/Per Year PCS/month

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Specification of Mono Silicon Wafer

 

We can provide you solar wafer 156*156mm Mono Wafers for your raw materials choice.

Product name  Mono Wafer
 Conductive type  P type
 Square size wafer(mm)  156×156±0.5 
 Resistivity 1~3 ohm
 Corner(mm) 150±0.5;165±0.5 
  195±0.5;200±0.5
 Thickness (μm) 200±20 
 Total thickness(um) ≤ 30     
Resistivity range(Ωcm) 1-3
 Doping elements Boron
 Orientation (100)±1° 
Carbon content(atoms/cc) ≤1.0E+17 
 Oxygen content(atoms/cc) ≤1.0E+18 
 Lifetime(μs) ≥10 
 Surface quality  No crack, gap, missing Angle, perforated, silicon fell and stress
  Warping degrees(warp/μm) ≤50 
  Neighbouring vertical degree 90±0.5° 
Side damage(mm)   ≤0.5mm(length)×0.3mm(width)(not more than 2 per wafer)
Line mark(μm) ≤15

Usage and Applications of Mono Wafers

Mono Solar Wafer mainly used in Mono Solar Cells with reliable quality and trustful efficiency performance. Our Mono Wafers should be your best choice for raw materials.

 

Packaging & Delivery of Mono Wafers

Carton Box Package and Deliver by air. Mono Wafers should be avoid of sunshine, moist, and water.

 

Factory Picture of Mono Wafers

 

 Solar Wafers

 

Package Picture of Mono Wafers

 Solar Wafers

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Q:Why integrated circuits can be etched on silicon
Integrated circuit (integrated circuit) is a kind of micro electronic device or component. With certain techniques, the transistor, required a circuit of resistance, capacitance and inductance components and interconnect wiring together, produced in a small or a few bits of the semiconductor wafer or substrate, and then encapsulated in a tube shell, a micro structure required for the circuit function; all of them element in the structure has formed a whole, so that the electronic components to miniaturization, low power consumption, high reliability and intelligent a huge step forward. It is represented by the letter "IC" in the circuit. The inventor of the integrated circuit is Jack Kilby (based on Ge) and the (silicon based (Si) integrated circuit). Most of the semiconductor industry today is based on silicon integrated circuit.A new type of semiconductor device developed in the late 1950s of 60s. It is through oxidation, photolithography, epitaxy, diffusion, evaporation of aluminum and semiconductor manufacturing process, the connecting wire between the required circuit has a certain function of the semiconductor, resistors, capacitors and other components and they are integrated in a small piece of silicon wafer, and then welding electronic devices are encapsulated in a casing. The outer shell of the utility model is provided with a round shell type, a flat type or a double line type. IC technology includes chip manufacturing technology and design technology, mainly in the processing equipment, processing technology, packaging testing, mass production and design innovation ability.
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
Wire cutting equipment, NTC, HCT these two brands are relatively large
Q:Silicon rod / wafer processing production
The monocrystalline silicon processed into silicon polished wafer processes: crystal growth, cutting, grinding, flat or rolling diameter V groove processing, chamfering, grinding slice polishing, cleaning, corrosion - Packaging: the purpose is to cut off the head and tail of the monocrystalline silicon removal and exceed customer specifications of the parts will be segmented into monocrystalline silicon slicing device can handle the length of cut specimen resistivity measurement of oxygen content in silicon rods. Cut off equipment: in the park outside the park by cutting or cutting machine mainly imported materials cutting machine: blade od grinding: because the surface diameter of the monocrystalline silicon and uneven diameter than the diameter specification final polishing wafer, the outer diameter of rolling mill can accurately obtain diameter. Outer diameter grinding equipment: grinding flat edge or V type groove processing: refers to the designated position and processing, with the specific direction of the crystal silicon on the flat side or V. Processing equipment: grinding machines and X - RAY diffractometer. Slice: a single crystal silicon rod is cut into a thin wafer with an exact geometric size.
Q:How many watts can a piece of silicon produce
The content of silicon in the earth's crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Because silicon is one of the most abundant elements in the earth, the solar battery that destined to enter the mass market (mass market) products, reserves of advantage is to become one of the reasons the main photovoltaic silicon materials.
Q:How many times is the resistance of the same size silicon
Silicon is one of the largest and most widely used semiconductor materials, and its output and consumption mark the level of a country's electronics industry.
Q:After cutting a few chips, mortar density is getting lower and lower
Iron powder and silica fume more and more, the density should be more and more big, unless it is your water content is higher and higher
Q:How to detect the surface finish of photovoltaic silicon wafers, what equipment?
Physical examination of the surface roughness on the line, whether it can be cleaned with chemical or optical
Q:What are some of the silicon wafer factory
The following is a silicon production company series positions distribution table, you can refer to the 1 equipment management department manager deputy manager of electrical equipment equipment maintenance engineer mechanical equipment maintenance Engineer Association and insurance technician equipment management maintenance team leader electric operation monitor operation duty electrician maintenance electrician maintenance mechanic subtotal
Q:The purpose and means of chemical etching of silicon wafers?
Corrosion is to create suede, was not intended to be clean, but cleaning agents will inevitably etch the surface damage layer of wafer line after cutting in the solar industry is a must, because it can produce suede.
Q:Solar silicon wafer cutting fluid can burn explosion?
Silicon in a weak base and water will slowly release hydrogen
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