156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

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Product Description:

 156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

our cells special features

1. High conversion efficiencies resulting in superior power output performance

2.Outstanding power output even in low light or high temperature conditions

3.Optimized design for ease of soldering and lamination

4.Long-term stability,reliability and performance

5.For 156P poly cells with high efficiency in photovoltaic conversion 16.3%-17.5%.

6.Low inverse current, high shunt resistance and high dependability.

7. Our poly cells efficiency include: 17%-18%.

Product Pictures

 

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel

156x156 A Grade B Grade PV Silicon Solar Cell for Solar Panel 

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Q:Geometric parameters and testing of silicon wafer
Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
Q:The production of silicon units do front-line production workers harmful to the body
Please also note: as long as it is in the production of factory work, there are more or less some occupation hazards, such as peripheral equipment operation noise, dust production, if the production site without the necessary protective equipment is also possible occupation disease.So my answer is only from the perspective of occupational protection.
Q:How much harm silicon on the human body
Silicon is a semiconductor material, if it is to detect the bare silicon wafer, then there is no harm
Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
Silicon wafer wire cutting will appear thick sheet, for the following reasons:1, the whole chip thickness:The A. guide slot is not uniform. Wafer thickness = slot steel wire diameter -4 times (SIC) D50, according to the requirements of wafer thickness required, you can calculate the best slot. In addition, because in the cutting process, steel wire wear, steel wire diameter decreases, and the port changed from round to oval, so the guide slot should be compensated according to the loss situation, to ensure the uniformity of wafer thickness.
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma wafer cleaning parameters:Residual plasma cleaning method of particles 1, silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow; the use of either gas from the 02, Ar, N2; gas washing process parameters set process: the chamber pressure of 10-40 mTorr, process gas flow 100-500sccm time, 1-5s; process parameters of starting process is: the chamber pressure of 1040 mTorr, process gas flow on the electrode 100-500sccm, power 250-400W, time 1-10s.2, as described in the plasma cleaning method, the invention is characterized in that the gas used is 23, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 15 mTorr, process gas flow 300sccm, time 3S; process parameters of starting process is: the chamber pressure of 15 mTorr, process gas flow on the electrode 300sccm, power 300W, time Ss.4, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 10-20 mTorr, process gas flow 100-300sccm, time 1-5s; process parameters of starting process is: the chamber pressure of 10-20 mTorr, process gas flow on the electrode 100-300sccm, power 250-400W, when Lu 1-5s.
Q:How to detect the surface finish of photovoltaic silicon wafers, what equipment?
Roughness, flatness, or cleanliness? But you have to choose optical instruments. I just don't know what you're asking for.
Q:Polished silicon wafers can be most SEM substrates
There are many kinds of polishing, mechanical polishing, chemical polishing, electrolytic polishing, ultrasonic polishing, fluid polishing, magnetic abrasive polishing!Beijing there throwing a new type of practical technology, science and technology can improve the Liz polishing efficiency and so on.
Q:How to extract silicon from silicon wafers
Annealing: double position hot oxidation furnace after nitrogen purging, infrared heating to 300~500 DEG C, silicon wafer surface and oxygen react, so that the surface of silicon dioxide protection layer.
Q:How many times is the resistance of the same size silicon
Silicon is one of the largest and most widely used semiconductor materials, and its output and consumption mark the level of a country's electronics industry.
Q:Why do you choose a silicon chip as a chip?
B is byte, B is bitIn the circuit, an output can output a high and a low, the high level is 1, the low level is 0, then the output is a bit, which is the smallest one memory cellThe output of the circuit is controlled by the gate, and the gate is controlled by a voltage,So, there will be a gate capacitance, capacitance, electricity, the output is 1, no electricity, the output is 0, tens of thousands of and 1 is a memory of the file, it may be a MP3, a movie...

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