Solar Silicon Wafer

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IC grade mono silicon wafer
1.Used in various discrete devices
2.High Purity 11N
3.Growth Method :CZ

IC grade mono silicon wafer

IC grade mono silicon wafer
Size4"/5"/6"
Growth methodCZ
GradePrime grade
Diameter100±0.4mm / 125±0.5mm / 150±0.5mm
Orientation<111>/<100>
TypeN-type/P-type
DopantP-type:Boron
N-type:Phos./As./Sb.
Purity11N(99.999999999%)
Oxygen Content18 New PPMA
Carborn Content1 New PPMA
Resistivity0.001Ω·cm                                                          
Thickness200um, or according to your requirement
OthersTTV10um, Bow35um,Warp35um
Particles0.3um@10PPW
SurfaceFrond side polished,back side etched.
MOQ100pcs
PackagePacked in cassette,and sealed in vacuum bag,25pcs/cassette.
PriceAccording to your specification,especially resistivity and thickness


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Q:What is the harm of silicon chip into the fingers?
It is best to take out as soon as possible, otherwise easy to infection,
Q:Is the thickness of solar cell silicon wafer certain? Specifically how much
140-230 bar, see the specific requirements, most of the requirements of 200
Q:Is there anyone who knows how to choose a good glue
But the viscosity is so small. You can use UV or instant glue, curing is relatively fast.
Q:How to calculate the conversion efficiency of monocrystalline silicon
Solar cell efficiency = (open circuit voltage * short-circuit voltage * fill factor) / (battery area * light amplitude) *100%Light intensity - AM1.5 as the standard, that is 1000W/m2Proportion of dark current - Irev>6 cell ratioThe proportion of low efficiency tablets - the proportion of P156Eff<14.5% batteries
Q:Why is it not easy to use high resistance on the silicon chip integrated circuit
In some places, the resistance of the epitaxial layer is adopted, and the resistance is N type, which has a lot of inconvenience in the circuit, and the numerical value is also very difficult to do
Q:The relationship between the weight and the power of solar wafers!
156*156,8 inch polysilicon chip Accounting: efficiency of 16%, the thickness of the silicon chip is 180, corresponding to the amount of polysilicon per watt on the map is 7G.
Q:The metal in the silicon wafer
Monocrystalline silicon or polycrystalline silicon chip to askSilicon is an important semiconductor material, chemical element symbol Si, the silicon used in the electronic industry should have high purity and excellent electrical and mechanical properties. Silicon is one of the largest and most widely used semiconductor materials, and its output and consumption mark the level of a country's electronics industry. In the research and production, silicon materials and silicon devices promote each other. In the Second World War, the use of silicon to produce high-frequency radar crystal detector. The purity of silicon is very low and not single crystal. In 1950, the first silicon transistor was developed to improve the interest of preparing high quality single crystal silicon. Czochralski silicon (CZ) was successfully used in 1952. In 1953, the crucible free zone melting (FZ) method was developed, which can be used for physical purification and single crystal pulling. In 1955, four pure silicon was produced by zinc reduction method, but it could not meet the requirement of manufacturing transistor. In 1956 of hydrogen reduction method of trichlorosilane. The amount of impurities in silicon and after a period of exploration after hydrogen reduction of trichlorosilane method has become a kind of main method.
Q:The benefits of silicon chip
(a) hot rolled silicon steel sheet for electrical purposes (GB5212-85)The hot rolled silicon steel sheet used for electrical engineering is made of soft magnetic alloy with low carbon content and low carbon steel, which is rolled into a sheet with thickness less than 1mm. Hot rolled silicon steel sheets for electrical purposes.Hot rolled silicon steel sheet according to the combination of silicon content can be divided into low silicon (Si = 2.8%) and high (Si = 4.8%) of silicon steel sheet two.(two) cold rolled silicon steel sheet for electrical purposes (GB2521-88)The silicon steel 0.8%-4.8% containing silicon steel is used as the material, which is formed by cold rolling.Two kinds of steel strip with grain orientation and grain orientation for cold rolled silicon steel sheet. The cold rolled electrical steel strip has the advantages of smooth surface, uniform thickness, high coefficient of lamination and good impact resistance, and has higher magnetic susceptibility and lower iron loss than the hot rolled steel strip. Instead of producing hot rolled motor or transformer with cold strip, its weight and volume can be reduced by 0%-25%. If the cold rolled oriented belt, better performance, use it instead of hot-rolled or cold-rolled low grade, can reduce the power consumption of the transformer 45%-50% transformer, and more reliable performance.For the manufacture of motors and transformers. In general, the grain oriented cold rolled strip is used as the state of the motor or welding transformer, and the grain oriented cold-rolled strip is used as the core of the power transformer, pulse transformer and magnetic amplifier.Plate size: thickness of 0.35, 0.50 and 0.65mm, the width is 800-1000mm, the length is less than or equal to 2.0m.
Q:What is the silicon area of the 125 diagonal of a single crystal of 160?
160 refers to the diagonal length of the chamfer, you draw a map can be calculated, the specific algorithm is:
Q:Why integrated circuit electronic devices should be integrated on silicon
Integrated circuit (integrated circuit) is a kind of micro electronic device or component. With certain techniques, the transistor, required a circuit of resistance, capacitance and inductance components and interconnect wiring together, produced in a small or a few bits of the semiconductor wafer or substrate, and then encapsulated in a tube shell, a micro structure required for the circuit function; all of them element in the structure has formed a whole, so that the electronic components to miniaturization, low power consumption, high reliability and intelligent a huge step forward. It is represented by the letter "IC" in the circuit. The inventor of the integrated circuit is Jack Kilby (based on Ge) and the (silicon based (Si) integrated circuit). Most of the semiconductor industry today is based on silicon integrated circuit.

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