Solar Silicon Wafer

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IC grade mono silicon wafer
1.Used in various discrete devices
2.High Purity 11N
3.Growth Method :CZ

IC grade mono silicon wafer

IC grade mono silicon wafer
Growth methodCZ
GradePrime grade
Diameter100±0.4mm / 125±0.5mm / 150±0.5mm
Oxygen Content18 New PPMA
Carborn Content1 New PPMA
Thickness200um, or according to your requirement
OthersTTV10um, Bow35um,Warp35um
SurfaceFrond side polished,back side etched.
PackagePacked in cassette,and sealed in vacuum bag,25pcs/cassette.
PriceAccording to your specification,especially resistivity and thickness

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Q:What's the difference between a silicon wafer and a battery?
Silver aluminum printing products called battery!The silicon chip is the raw material for the production of the battery chip, and the silicon chip is conductive!
Q:What is the cutting fluid for solar wafer cutting?
MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
Q:Polished silicon wafers can be most SEM substrates
In other words, only nano materials will consider the use of polished silicon wafer sample carrier. Micron submicron level, waste, direct double-sided conductive adhesive tape can be.
Q:I would like to ask the solar cell (silicon) production process is the principle of how
Silicon wafer detectionSilicon wafer is the carrier of solar cell, the quality of silicon wafer directly determines the conversion efficiency of solar cell. This procedure is mainly used to measure the technical parameters of silicon wafer on line. These parameters mainly include the surface roughness of the silicon wafer, the lifetime of the minority, the resistivity, the P/N type and the micro crack. The device is divided into four parts: automatic loading and unloading, silicon wafer transmission, system integration part and. The silicon photovoltaic detector on the silicon wafer surface roughness were detected, and the size and appearance of diagonal parameter detection chip; micro crack detection module is used to detect silicon micro cracks; another two detecting module, one online test module to test wafer resistivity and wafer type, another module for lifetime test wafer. The detection of the diagonal and micro cracks of the silicon wafer is needed before the sub lifetime and resistivity measurement. Wafer inspection equipment can automatic loading and unloading, and substandard products in a fixed position, so as to improve the detection accuracy and efficiency.
Q:Why should the wafer cut side, cut out edge Jiaosha
In a word, the standard combination of the main alignment and the alignment of the wafer will tell the user what type of conductivity it is and what it isWant to help you, hope to adopt
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
But a good silicon chip is not available. Because the bare silicon wafer is not easy to damage and difficult to connect. This is a process of binding, the so-called binding is bound to use a very fine gold wire from the silicon chip lead wire, received on the metal pipe, and then use the non-conductive plastic to bind the chip sealed. We generally see transistors, chips, etc. are packaged, you simply can not see the inside of the core. Of course is also useful in metal or ceramic chip shell, such as the two or three level of some high power tubes, military grade components etc., but because the metal and ceramic package cost is relatively high, so most of the circuit or engineering plastic package.PCB is a printed circuit board, is what we call the board. The copper wire and the welding of various components and chips. The manufacturing of printed circuit board, you should check the information bar, then I talk today what also don't want to do
Q:What are the difficulties of silicon wafer cutting?
3, with line (intensive line): because the grinding ability of mortar mortar or not slicing machine loop system, caused by the silicon dense line region.4, because the hydraulic cutting machine: dislocation line clamping device surface residual glue mortar and other foreign matter or pallet, causing the hydraulic device and the plate can not be completely clamped, and plate screw loosening, resulting.
Q:The meaning of various names
Need some wafer to test the state of the art production equipment, such as particle, etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used to group together with the normal production process to test the quality condition of a process, such as the CVD film thickness. Production equipment in the maintenance or repair immediately after. Production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, this type of wafer is called dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as certain machine wafer must process to a certain number the problem with dummy wafer. And some machine must be a form of dummy run in the process of a certain number of wafer, otherwise the process can not guarantee the quality and so on and so on many of the wafer are Dummy. can be called a wafer chip can be basically regarded as a dummy.Dummy wafer, control, block and so on are usually recyclable
Q:What is the thickness of the semiconductor wafer used today?
0.670mm or so. The wafer must be thinned, otherwise the loss of the dicing knife is very large, and it is necessary to draw two knives
Q:What is the silicon wafer, the specific definition of what?
Silicon wafers are the raw materials for making transistors and integrated circuits

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