Solar Cell High Quality A Grade Cell Poly/Monocrystalline 5v

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Poly/Monocrystalline 5v


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Poly/Monocrystalline 5v

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:How to avoid or reduce the fragmentation of thin silicon wafers without wax polishing?
I don't know how your employees operateYou can put a small bubble in the insertion box below if it is convenient. Can play a buffer role
Q:Why the resistivity of silicon wafer is high and low
If the thermistor is more normal. For example, when you hold your hands
Q:The microprocessor integrates the computer with what is on a small silicon chip
The controller (English Name: controller) is a master device in accordance with the resistance change circuit wiring and a predetermined sequence change or control circuit to control the value of motor starting, speed control, braking and reverse.It consists of the program counter, the instruction register, the instruction decoder, the timing generator and the operation controller. It is the "decision making mechanism", which is to coordinate and direct the operation of the whole computer system.
Q:What's the connection between silicon wafer and wafer
The bigger the chip the smaller the less waste the less the cost. His direct use is of course on Si for mixed metal precipitation until different packaging lithography, as raw materials for the preparation of electronic manufacturing
Q:What are some of the silicon wafer factory
2 raw materials for deputy director, assistant director of the workshop material sorting and packaging materials packaging materials sorting operator monitor corrosion monitor cleaning cleaning raw materials warehousing operator member subtotal deputy director of the 3 crystal sandblasting operator workshop director assistant assistant statistician crystal crystal pulling monitor operator cut cut monitor operator subtotal
Q:Solar silicon wafer cutting fluid can burn explosion?
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume3, can only be used for single crystal cutting4, the cost of the problem, and now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive
Q:Monocrystalline silicon processing technology
Most photovoltaic equipment suppliers buy chip wire. They generally grow silicon ingots or silicon blocks and process silicon materials into wafers, which are eventually sold to photovoltaic cell manufacturers for the production of batteries. The installed capacity of the industry's most successful application of B5 wire materials company HCT system more than 500 units, is a benchmark in the field of photovoltaic chip products.conclusionIn the field of photovoltaic technology, wire reduces wafer thickness and reduce the material loss in the cutting process, thereby reducing the power consumption of the solar silicon materials. (therefore, wire saw technology to reduce the cost per watt of solar energy and eventually to achieve grid parity has played a crucial role. The latest and most advanced wire technology brings a lot of innovation, improve the productivity and the thinner silicon wafers to reduce the consumption of silicon materials.
Q:Why do they make so many transistors on silicon in an integrated circuit
For digital integrated circuits, mainly used for logic operations, and, or, not by the most basic logic constitute a complex logic. Computers are now so complex that they require a lot of transistors.For analog integrated circuits, mainly used to amplify the signal, such as your phone Wifi and other received signals are very weak, you want to use transistor amplifier.
Q:What is the meaning of a cleaning in a semiconductor silicon wafer process? RCA?
() SPM:H2SO4 /H2O2 120 to 150 DEG C SPM has a high oxidation capacity, can be dissolved in the metal oxidation solution, and the oxidation of organic matter to generate CO 2 and H2O. The use of SPM to clean silicon wafers can remove heavy organic contaminants and some metals on the surface of silicon wafer, but it is difficult to remove organic matter when organic matter is particularly serious.
Q:The metal in the silicon wafer
By 1960, the scale of industrial production had been in this way. Silicon rectifier and thyristor has prompted the silicon material production jumped in the first semiconductor material. With the development of silicon epitaxial single crystal technology and silicon planar technology in 60s, it not only makes silicon transistor manufacturing technology mature, but also promotes the rapid development of integrated circuits. In early 80s the world's polysilicon production reached 2500 tons. Silicon is one of the promising materials for solar cells. The technology of producing solar cells with polycrystalline silicon has been mature; amorphous silicon films have been developed rapidly. Chemical element silicon. Electrically active impurities phosphorus and boron should be less than 0.4ppb and 0.1ppb in qualified semiconductor and polysilicon. A certain amount of electroactive impurities should be added to the single crystal to obtain the required conductivity and resistivity. Heavy metals such as copper, gold, iron and nonmetal are very harmful impurities. The carbon content in silicon is higher than that of 1ppm. When the carbon content is over 3ppm, the harmful effect is more significant. Oxygen content in silicon is very high. Oxygen is both beneficial and harmful. The content of oxygen in Czochralski silicon is within the range of 5 to 40ppm, and the oxygen content of the fused silica can be less than 1ppm.

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