Solar Mono Silicon Wafer for Solar Cell (156 and 125)

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China main port
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TT or LC
Min Order Qty:
10000 pc
Supply Capability:
1000000 pc/month

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Product Description:

 

1. Structure of  Solar Mono Silicon Wafer for Solar Cell (156 and 125)  Description

A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as acrystalline silicon, used in electronics for the

fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for

microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion

implantation,etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated

(dicing) and packaged.

 

2. Main Features of the  Solar Mono Silicon Wafer for Solar Cell (156 and 125)

• High quality Silicon wafer carrier box

• quartz glass wafer carrier from Taifulong Technology

 

3. Solar Mono Silicon Wafer for Solar Cell (156 and 125) Images

4. Solar Mono Silicon Wafer for Solar Cell (156 and 125) Specification

窗体顶端

Item窗体底端

N-type solar grade mono silicon wafer(125x125mm)

N-type solar grade mono silicon wafer(156x156mm)

Growth Method

CZ

CZ

Conductive Type

N-type

N-type

Dopant

Phos.

Phos.

Orientation

<100>±3°

<100>±3°

Resistivity

1 –3,3-6Ω•cm

1 –3,3-6 Ω•cm

Bulk Lifetime

1000μs

1000μs

Oxygen Content

0.1*1018 cm3

0.1*1018 cm3

Carbon Content

0.1*1017 /cm3

0.1*1017 /cm3

Dimension

125*125±0.5mm

156*156±0.5mm

Diagonal

150±0.5mm

200±0.5mm

Square Sides Angle

90±0.3°

90±0.3°

Thickness

200±20 um

200±20 um

TTV

25um

25um

Saw Mark

15um

15um

Warp

40um

40um

Chips

Depth<0.3mm;Length<0.5mm

Depth<0.3mm;Length<0.5mm,

less than 2chips per wafer

less than 2chips per wafer

Appearance

No Stain, No Pinhole and Cracks by Visual Inspection

No Stain, No Pinhole and Cracks by Visual Inspection

Dislocation Density

1000 pcs/cm2

1000 pcs/cm2

Package

Packed in Polyethylene foam box,400pcs/box

Packed in Polyethylene foam box,400pcs/box

窗体底端

 

 

5. FAQ of Solar Mono Silicon Wafer for Solar Cell (156 and 125)

Q1. How long can we receive the product after purchase?

A1.In the purchase of product within three working days, We will arrange the factory delivery as soon as possible. The pecific time of receiving is related to the state and position of customers

Q2. Can we visit your factory?

A2:Surely, I will arrange the trip basing on your business schedule.

Q3:Which payment terms can you accept?

A3:T/T,L/C,Moneygram,Paypal are available for us.

 

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Q:Is the thickness of solar cell silicon wafer certain? Specifically how much
The rest is just the substrate, it doesn't work. Do not understand, then you can look at the film thickness of the battery, you will understand.
Q:Why the resistivity of silicon wafer is high and low
If the thermistor is more normal. For example, when you hold your hands
Q:Is there anyone who knows how to choose a good glue
General epoxy resin structural adhesive, fully cured is 24 hours, the purpose of the product to achieve the best bonding strength. The curing time is shortened according to the curing accelerator of epoxy resin. The general market is the fastest solid 5 minutes, you can play a positioning effect. Does not affect operation.
Q:1 megawatts of solar energy need how many wafers
It depends on whether it is a single crystal or polycrystalline, I only know that polycrystalline is about 3.8 mw.
Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
B. cut is not set before zero. The correct method is to set the zero (in HCT machine tool as an example): crystal rod loading machine, manual reduction worktable makes four ingot guiding strips just contact wire touch screen and click on the main interface with zero button, then slow the stage to -1.5mm real position and named set zero cutting number. If the zero position is set properly, the guide bar to the contact wire, the cutting after the start of steel wire due to friction tension instability, resulting from the start to create the knife into the chip thickness.
Q:Consult the difference between silicon and battery
And the battery slice is cut the silicon wafer cleaning, making, P/N knot, printing and so on after the results of the process, directly cut the silicon chip can not be used for power generation.
Q:What are some of the silicon wafer factory
2 raw materials for deputy director, assistant director of the workshop material sorting and packaging materials packaging materials sorting operator monitor corrosion monitor cleaning cleaning raw materials warehousing operator member subtotal deputy director of the 3 crystal sandblasting operator workshop director assistant assistant statistician crystal crystal pulling monitor operator cut cut monitor operator subtotal
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 15 mTorr, process gas flow 300sccm, time 3S; process parameters of starting process is: the chamber pressure of 15 mTorr, process gas flow on the electrode 300sccm, power 300W, time Ss
Q:What is the meaning of the wafer (100), the crystal orientation index or the crystal plane index
The coordinate system is set up in the crystal cellIs the coordinate of the direction vector
Q:What's the difference between a silicon wafer and a battery?
Silver aluminum printing products called battery!The silicon chip is the raw material for the production of the battery chip, and the silicon chip is conductive!

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