High Current Solar Cell 16.6% Polycrystalline Silicon Solar Cell Price

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Product Description:

4 Bus Bars 156*156 17.6% efficiency poly solar cell 

PHYSICAL CHARACTERISTICS

 

Dimension:  156mm x 156mm ± 0.5mm

Wafer Thickeness:  180um+20um and 200um+20um

Front(-)                  Four 1.2mm silver busbar

                               Silicon nitride blue anti-reflection coating

                             

Back(+)                 aluminum back surface field
                                1.75mm(silver)  wide segment soldering pads

High Current Solar Cell 16.6% Polycrystalline Silicon Solar Cell Price


 Typical Electrical Characteristics

 

Efficiency

W(Pmpp)

V(Umpp)

A(Impp)

V(Uoc)

A(Isc)

17.4-17.5

4.234

0.517

8.231

0.622

8.759

17.5-17.6

4.259

0.519

8.243

0.623

8.769

17.7-17.8

4.283

0.521

8.256

0.625

8.779

17.8-17.9

4.307

0.523

8.268

0.626

8.788

17.9-18.0

4.332

0.525

8.281

0.627

8.798

18.0-18.1

4.380

0.529

8.306

0.629

8.808

18.1-18.2

4.405

0.531

8.318

0.632

8.818

18.2-18.3

4.429

0.533

8.331

0.633

8.837

18.3-18.4

4.453

0.535

8.344

0.634

8.847

18.4-18.5

4.478

0.537

8.356

0.636

8.856

18.5-18.6

4.502

0.539

8.369

0.637

8.866

 

 

 

 


Efficiency

W(Pmpp)

V(Umpp)

A(Impp)

V(Uoc)

A(Isc)

20.90-21.00

5.06

0.557

9.007

0.653

9.688

20.80-20.90

5.04

0.556

9.062

0.652

9.683

20.70-20.80

5.02

0.554

9.055

0.651

9.684

20.60-20.70

4.99

0.552

9.033

0.651

9.672

20.50-20.60

4.97

0.550

9.002

0.650

9.673

20.40-20.50

4.94

0.548

9.012

0.649

9.674

20.30-20.40

4.92

0.546

9.009

0.649

9.655

20.20-20.30

4.89

0.543

9.012

0.648

9.634

20.10-20.20

4.87

0.541

8.998

0.648

9.617

20.00-20.10

4.85

0.540

8.977

0.647

9.600



*Data under standard testing conditional (STC):1,000w/m2,AM1.5, 25°C , Pmax:Positive power tolerance.

 

3 Bus Bars 156*156 17.4% efficiency poly solar cell 

Dimension:  156 mm x 156 mm ± 0.5 mm

Wafer Thickeness: 156 mm x 156 mm ± 0.5 mm


High Current Solar Cell 16.6% Polycrystalline Silicon Solar Cell Price

Typical Electrical Characteristics:

 

Efficiency code16601680170017201740176017801800182018401860
Efficiency (%)16.616.817.017.217.417.617.818.018.218.418.6
Pmax       (W)4.044.094.144.194.234.284.334.384.434.484.53
Voc          (V)0.6120.6150.6180.6210.6240.6270.6290.630.6330.6350.637
Isc           (A)8.428.468.518.568.618.658.698.738.778.818.84
Imp         (A)7.917.998.088.168.228.278.338.388.438.488.53

* Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

* Imin : at 0.5 V


Production:

High Current Solar Cell 16.6% Polycrystalline Silicon Solar Cell Price



Package:


High Current Solar Cell 16.6% Polycrystalline Silicon Solar Cell Price



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.




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Q:After the completion of the silicon chip will appear in the shadow of the white spots or what is the situation? How to solve
Whether or not fully diluted before drying. I couldn't see the actual product.
Q:Geometric parameters and testing of silicon wafer
Monocrystalline silicon chip has side length 125mm, 156mm, and 125 of the large diagonal diagonal 156mm and small chamfer diagonal 165mm,Polycrystalline silicon chip to the side of the main 156mm, diagonal 219.2mm.Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
Q:How to convert photovoltaic silicon MW
156 single crystal (chamfer 200) area: 238.95125 single crystal (chamfer 165) area: 154.831MW=1 * (10 negative) W
Q:What can be used to adjust its viscosity
Polyethylene glycol and water soluble, I believe this may help you solve the problem
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
But a good silicon chip is not available. Because the bare silicon wafer is not easy to damage and difficult to connect. This is a process of binding, the so-called binding is bound to use a very fine gold wire from the silicon chip lead wire, received on the metal pipe, and then use the non-conductive plastic to bind the chip sealed. We generally see transistors, chips, etc. are packaged, you simply can not see the inside of the core. Of course is also useful in metal or ceramic chip shell, such as the two or three level of some high power tubes, military grade components etc., but because the metal and ceramic package cost is relatively high, so most of the circuit or engineering plastic package.PCB is a printed circuit board, is what we call the board. The copper wire and the welding of various components and chips. The manufacturing of printed circuit board, you should check the information bar, then I talk today what also don't want to do
Q:After cutting a few chips, mortar density is getting lower and lower
There are a lot of things that could happen1 lubricant is not qualified2 too many bubbles in the recycle bin3 mortar selection4, the operation speed is too fast5 wafer density is not uniform (the lowest possible)Try not to contact
Q:Why integrated circuit electronic devices should be integrated on silicon
Another image, that is, the integrated circuit is a combination of some electronic components and wiring, no insulation and insulation as a support. It is achieved by adding bias and other techniques to isolate.And for why it's cheaper to use silicon, it's not because of its semiconductor nature that it uses it. The formation of P and N, a multi hole, a multi electron, and thus the role of different doping. GaAs expensive, but the performance is good, mostly for high-speed circuits and military aspects.
Q:Light doped and heavily doped silicon wafers
Otherwise, the light is mixed, N++/P++ said heavy doping, no plus is light, thank you
Q:After wafer cleaning, how to change the film?
Name compositionEffectSPMH2SO4: H2O2: H2ORemoval of heavy organic matter, but it is difficult to remove organic matter when it is very seriousDHFHF: (H2O2): H2OCorrosion of the surface oxide layer to remove metal contaminationAPM (SC1) NH4OH: H2O2: H2O can remove particles, some organic matter and some metals, this solution will increase the surface roughness of silicon waferHPM (SC2) HCl: (H2O2): H2O is mainly used to remove metal contamination
Q:How many times is the resistance of the same size silicon
Silicon is an important semiconductor material, chemical element symbol Si, the silicon used in the electronic industry should have high purity and excellent electrical and mechanical properties

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