Solar Cell High Quality A Grade Cell Polyrystalline 5v 17.8%

Ref Price:
Loading Port:
Shanghai
Payment Terms:
TT OR LC
Min Order Qty:
1000 pc
Supply Capability:
100000 pc/month

OKorder Service Pledge

Quality Product

Order On-line Tracking

Timely Delivery

OKorder Service Pledge

Credit Rating

Credit Services

Credit Purchasing

Share to:

Product Description:

Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.8%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.8%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


Send a message to us:

Remaining: 4000 characters

- Self introduction

- Required specifications

- Inquire about price/MOQ

Q:How to make a resistor on a silicon chip (integrated circuit)
The site is general one-sided, to consult the detailed understanding of literature, over the wall out to find it, say one thirty,
Q:Geometric parameters and testing of silicon wafer
Monocrystalline silicon chip has side length 125mm, 156mm, and 125 of the large diagonal diagonal 156mm and small chamfer diagonal 165mm,Polycrystalline silicon chip to the side of the main 156mm, diagonal 219.2mm.Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
Q:How to avoid or reduce the fragmentation of thin silicon wafers without wax polishing?
I don't know how your employees operateYou can put a small bubble in the insertion box below if it is convenient. Can play a buffer role
Q:What are the aspects of silicon wafer testing?
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;
Q:What is the silicon wafer, the specific definition of what?
Silicon wafer, which is an important material for making integrated circuits, can be made into various semiconductor devices by photolithography and ion implantation.
Q:What is the harm of silicon chip into the fingers?
It is best to take out as soon as possible, otherwise easy to infection,
Q:Is a wafer a silicon wafer and a wafer?
Ion implantation, etc., can be made into various semiconductor devices
Q:Silicon wafer cleaning after the two sides of the upper and lower grille also has a basket of flowers (Bai Yin)
You don't think about it, because it's not a simple process parameter, what is the material, is a comprehensive problem of Chemical Physics
Q:How to extract silicon from silicon wafers
Chamfer: the annealed silicon wafer is trimmed into an arc shape, which can prevent the wafer edge from cracking and lattice defect, and increase the flatness of the epitaxial layer and the photoresist layer. In this process, the silica fume is produced by water leaching to produce waste water and silicon slag. [1]
Q:After wafer cleaning, how to change the film?
Name compositionEffectSPMH2SO4: H2O2: H2ORemoval of heavy organic matter, but it is difficult to remove organic matter when it is very seriousDHFHF: (H2O2): H2OCorrosion of the surface oxide layer to remove metal contaminationAPM (SC1) NH4OH: H2O2: H2O can remove particles, some organic matter and some metals, this solution will increase the surface roughness of silicon waferHPM (SC2) HCl: (H2O2): H2O is mainly used to remove metal contamination

1. Manufacturer Overview

Location
Year Established
Annual Output Value
Main Markets
Company Certifications

2. Manufacturer Certificates

a) Certification Name  
Range  
Reference  
Validity Period  

3. Manufacturer Capability

a)Trade Capacity  
Nearest Port
Export Percentage
No.of Employees in Trade Department
Language Spoken:
b)Factory Information  
Factory Size:
No. of Production Lines
Contract Manufacturing
Product Price Range