Solar Cell High Quality A Grade Cell Polyrystalline 5v 17.8%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.8%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.8%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:What is the cutting fluid for solar wafer cutting?
Solar wafer cuttingThe nine day of the moon is 1 | browse 4555Posted on 2011-03-08 14:06 best answerWire cutting equipment in Sweden, Japan, and domestic equipment;Sweden's MB and HCT devices are a little better;B, HCT, NTC and Ernst & Young wire cutting machine in the silicon wafer cutting silicon wafer cutting fluid and mortar requirementsLabel: cutting machine wire cutting machine silicon solar energyIn recent years, Chinese solar wafer cutting industry booming in Japan in 2008, another solar wafer multi wire cutting machine brand - Ernst & young, also started in the domestic debut, and big cost savings card, that technology has many advantages, more advanced. However, from the point of view of the effect of the use of domestic users, and NTC and MB and HCT in Switzerland, Ernst & Young in China there is a clear case of acclimatized.
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
General loss of about 40%, the general thickness of about 190um silicon, cutting seam in 120um
Q:After the velvet or the original silicon
After the wafer is not cleaned clean, you should be monocrystalline wafers
Q:Wafer cutting will appear thick sheet, I would like to ask what the reasons are
B. cut is not set before zero. The correct method is to set the zero (in HCT machine tool as an example): crystal rod loading machine, manual reduction worktable makes four ingot guiding strips just contact wire touch screen and click on the main interface with zero button, then slow the stage to -1.5mm real position and named set zero cutting number. If the zero position is set properly, the guide bar to the contact wire, the cutting after the start of steel wire due to friction tension instability, resulting from the start to create the knife into the chip thickness.
Q:Why do they make so many transistors on silicon in an integrated circuit
Small size, low power consumption! This is the advantage of IC ah.
Q:The purpose and means of chemical etching of silicon wafers?
After slicing and grinding, the surface of silicon wafer has a layer of damage and pollution due to processing stress
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Solar silicon wafer surface plasma cleaning processResidual plasma cleaning method of particles on silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow. The plasma cleaning method for removing particles of silicon surface easy control, thorough cleaning, no residual reactants, the process gas, non-toxic, low cost, small amount of labor, work efficiency high.
Q:Light doped and heavily doped silicon wafers
Is divided into light heavy doping, which is related to the amount of doping
Q:Pure curiosity why silicon wafer is round
Why does the silicon grown in the melt not directly cut into square, it is not easy to put it......Rub... In order to reduce costs ah.
Q:What is the difference between silicon wafer P111 and P100
Crystal growth direction<111><100><110>The coordinate system is set up in the crystal cell

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