Solar Cell High Quality A Grade Cell Polyrystalline 5v 15.6%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 15.6%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 15.6%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:What is a good solar wafer testing equipment?
PL-- detection of micro cracks, black spots, black and other issuesWafer sorting - Detection AOI, PN, resistivity, thickness, lifetime, stria depth
Q:The purpose and means of chemical etching of silicon wafers?
What are the means of chemical etching of silicon: 1 acid corrosion of 2 alkaline corrosion
Q:What are the difficulties of silicon wafer cutting?
1, the impurity line caused by impurities in polycrystalline silicon ingot, slicing process can not completely remove the lead line on a silicon wafer.2, scratch line caused by mortar in large SIC particles or caking mortar. In the process of cutting, SIC particles stuck in between steel wire and silicon can not overflow, cause.Forms: including the whole line and half line marks, concave line, shiny, more narrow than the other.
Q:There is a micro structure on the side of the silicon wafer
For solar cells destined to enter the market market (mass) products, the advantages of reserves is also one of the main reasons for the silicon photovoltaic materials.
Q:What is the role of the semiconductor wafer
, in fact, is still relatively soft, before the back of the plasma ETCH will generally have a step UVbake, reinforcement) from the center to the outside of the proliferation of a circle around, until completely flat
Q:One hundred watts of solar panels to how many pieces of silicon wafers, 156 of single crystals and polycrystalline
This is not with the number of pieces, crystal silicon solar cell has a feature that is a 0.48-0.6V, called 0.5V, how much you want to V, you can use serial or parallel connection to achieve
Q:The significance of silicon wafer heat treatment
Heat treatment at 650 DEG C, under the condition of rapid cooling (that is, rapidly over the temperature of 450 DEG C), the thermal donor can be eliminated. That is, we can observe that the resistivity of N sample is high, and the resistivity of P sample is low.Precipitation: 800-1200 DEG C, on behalf of temperature 1050 degrees CHeat treatment at 1050 DEG C, will bring oxygen precipitation, and the formation of defects caused by precipitation defects.Restore: > 1200
Q:After the completion of the silicon chip will appear in the shadow of the white spots or what is the situation? How to solve
There is a shadow or a spot to prove that there is an uneven phenomenon in the cleaning process
Q:The meaning of various names
Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough wafer in doping some impurities, such as P, B and so on, to change its resistance, thus had low resistance, high resistance, heavily doped term coated can be understood as the extension of Epi, according to the specific requirements of the device semiconductor is made of wafer, is usually used in high-end IC and special IC, such as Si on insulator (SOI). In the production process of IC wafer
Q:Silicon chip cutting, NTC442 machine, a knife can cut the number of slices
This and your slot.. The stick / slot cutting root number number = *.

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