Silicon Wafer Resistivity
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Why integrated circuits are rectangular and the silicon chips are round
- Chip makers use a number of processes to integrate the integrated circuit on the circle. And an integrated circuit with more than a dozen or even hundreds of chips. After the completion of the results according to India to cut it, cut into small pieces of a small square. Then the small silicon chip is packaged with other materials and pins into an integrated circuit chip.s
How much is the thickness of the silicon wafer
- Around 0.670mm. Wafer must be thinned, otherwise the loss of dicing knifes
How much a piece of silicon on the board
- Crystalline silicon solar cell has a characteristic, that is a piece of 0.48-0.6V, accustomed to call 0. 5V, how many V you want, can be connected in series or in parallel to achieve. As for power, according to the W=UI formula can be drawn,s
Why do they make so many transistors on silicon in an integrated circuit
- Small size, low power consumption! This is the advantage of IC ah.s
Why silicon wafers are made in watts!
- Including single crystal 125*125 150 single crystal 125*125 165 single crystal 156*156 diagonal diagonal 200 diagonal polycrystalline 125*125 polycrystalline 156*156 crystal silicon solar cell crystal silicon solar cell with monocrystalline silicon and polycrystalline silicon two categories, with P (or n) silicon substrate by phosphorus (or boron diffusion) to form Pn form production, production technology is mature, is the dominant photovoltaic products on the market. The buried layer electrode, surface passivation, enhanced light trapping, dense grid technology, optimization of back electrode and contact electrode technology, improve the collection efficiency of carrier materials, optimization of anti elbow membrane, concave convex surface, high reflective back electrode, the photoelectric conversion efficiency is greatly improved.s
Monocrystalline silicon processing technology
- Cut diameterFine cutting lines mean lower kerf loss, that is to say with a piece of silicon can produce more silicon. However, the cutting line is thinner and more prone to fracture.loadThe total area of each cut is equal to the area of the wafer X the number of silicon blocks per cut X the number of chips per silicon block.Cutting speedThe cutting table cuts the speed of the web through the cutting line, which is largely determined by the cutting line moving speed, the motor power and the cutting wire tension.Easy maintenanceNeed to replace the wire cutting line and grinding slurry in cutting, maintain faster, higher overall productivity.Producers must balance these factors to maximize productivity. Higher cutting speed and greater load will increase the tension of the cutting line and increase the risk of breakage. Since all the chips on the same silicon chip are cut at the same time, as long as there is a cutting line broken, all the chips have to be discarded. However, it is not advisable to use a thicker and stronger cutting line, which reduces the number of wafers produced per cut and increases the consumption of silicon materials.s
1 megawatts of solar energy need how many wafers
- 1 WP silicon chip, which is 1000000WPDo not know what you want to know? Detailed point!s
How to do on the silicon wafer
- 3, water cleaningThis step is very important! Do not wash the water in order to save trouble after the end of washing. Rinse the small dust, particles, and other debris washed off during the scrubbing process.s
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