XPS Extruded Polystyrene board,XPS Insulation board, Styrofoam

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Loading Port:
Tianjin
Payment Terms:
TT OR LC
Min Order Qty:
1000 m²
Supply Capability:
10000 m²/month

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Product Description:

Quick Details

Type:

XPS Boards

Place of Origin:


Brand Name:


Model Number:

xps 250

Thickness:

25mm-60mm

Color:

Light yellow / Blue /Green

Width:

600mm / 1200mm

Length:

1200mm-3000mm(or any)

Edge Shape:

SL SS T&G

Surface:

Withskin / Roughing / Embossing





Packaging & Delivery

Packaging Detail:Poly Bag
Delivery Detail:5-15 Working days

Specifications

XPS extruded polystyrene board,XPS Insulation board, Styrofoam 
1. Without any CFC/HCFC/HFC 
2. Eco-friendly 
3.25mm-50mm

Feininger XPS Foam Board:

 

XPS extruded polystyrene board,XPS Insulation board, Styrofoam  

  1. Stable performance and anti-aging: The extruded polystyrene (XPS) insulation boards can be used 35-50 years.

  2. Resistance to compression: compared with other thermal insulation material(200Kpa for EPS), it has better compressive strength(around 300Kpa), which make it the ideal solution for heavy domestic or industrial loads

  3. Water resistance: Polyfoam is almost 100% closed cell and as such is unaffected by moisture

  4. Lightweight: volume optimization and easy to handle

  5. Resistance to deformation

  6. Resistance to impact

  7. Versatile: the closed cell structure and density of Polyfoam allow specific edge details and surface finishes to be cut into the boards to make them as fit for the job as possible. Moreover, Polyfoam can be cut into almost any shape 
    100% ozone friendly

  8. Recyclable: Polyfoam  can be 100% recyclied 

Technical Data Sheet:

Item

Unit

Property Index

With Skins

X150

X200

X250

X300

X350

X400

X450

X500

Compressive Strength

KPA

≥150

≥200

≥250

≥300

≥350

≥400

≥450

≥500

Water Absorption,

%(by volume)

≤1.5

≤1.0

dipped in water for 96h

Moisture Permeability, 23°C±1°C,RH 50%±5%

Ng/(m.s.Pa)

≤3.5

≤3.0

≤2.0

Heat

Insulation

Heat Resistance

Thickness25mm

10°C

25°C

(m2·K)/W

≥0.89

≥0.83

≥0.93

≥0.86

Heat Conductivity

Average Temp.

10°C

25°C

W/(m·K)

≤0.028

≤0.030

≤0.027

≤0.029

DimensionalStability   70°C±2°C, 48h

%

≤2.0

≤1.5

≤1.0



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