Solar Cell High Quality A Grade Cell Polyrystalline 5v 17.2%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.2%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 17.2%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:8 inch monocrystalline silicon area?
8 inch silicon wafer, refers to the diameter of 8 inches,1 inches =25.4mm=2.54cm
Q:The microprocessor integrates the computer with what is on a small silicon chip
Arithmetic unit, a computer that performs arithmetic and logic operations. The basic operation of the device, including addition, subtraction, multiplication, division of the four operations, and, or, not, XOR logic operations, as well as the shift, comparison and transfer operations, also known as arithmetic logic unit (ALU).
Q:The production of silicon units do front-line production workers harmful to the body
Please also note: as long as it is in the production of factory work, there are more or less some occupation hazards, such as peripheral equipment operation noise, dust production, if the production site without the necessary protective equipment is also possible occupation disease.So my answer is only from the perspective of occupational protection.
Q:Wafer size6 inches and 8 inches only refers to the diameter of monocrystalline silicon?
In addition, because the four corners of the monocrystalline silicon wafer is a curved arc so there is such a standard:The chord length (mm) is the arc length x096 inch x09 28.24~31.30x096.5 inch x0910.93~13.54x098 inch x0920.46~23.18The diameter (mm) is the length of the diagonalx096 inch x09150.0 + 0.5x096.5 inch x09165.0 + 0.5x098 inch x09200.0 + 0.5I don't know whether you understand it or not. Welcome to ask me again!
Q:How to make monocrystalline silicon solar cells
Surface fleeceThe preparation of single crystal silicon wafer is the use of anisotropic etching of silicon on the surface of the silicon per square centimeter to form several million square pyramidal structure, namely, the Pyramid structure. Due to the multiple reflection and refraction of incident light on the surface, the absorption of light is increased, and the short circuit current and conversion efficiency are improved. Anisotropic etching of silicon in alkaline solution liquid is usually hot, available alkali sodium hydroxide, potassium hydroxide, lithium hydroxide and ethylenediamine etc.. Most of them were prepared by using dilute sodium hydroxide solution with a concentration of about 1%, and the corrosion temperature was 70-85. In order to obtain a uniform texture, but also in the solution add alcohols such as ethanol and isopropanol as complexing agent to accelerate the corrosion of silicon. In the preparation of velvet, the silicon chip must be first surface corrosion, alkaline or acidic etching solution to about 20 ~ 25 m, corrosion in the face, the general chemical cleaning. After surface preparation of silicon wafers are not suitable for long-term storage in the water, in order to prevent contamination, should be spread as soon as possible.
Q:What is the role of the semiconductor wafer
, in fact, is still relatively soft, before the back of the plasma ETCH will generally have a step UVbake, reinforcement) from the center to the outside of the proliferation of a circle around, until completely flat
Q:Monocrystalline silicon processing technology
Most photovoltaic equipment suppliers buy chip wire. They generally grow silicon ingots or silicon blocks and process silicon materials into wafers, which are eventually sold to photovoltaic cell manufacturers for the production of batteries. The installed capacity of the industry's most successful application of B5 wire materials company HCT system more than 500 units, is a benchmark in the field of photovoltaic chip products.conclusionIn the field of photovoltaic technology, wire reduces wafer thickness and reduce the material loss in the cutting process, thereby reducing the power consumption of the solar silicon materials. (therefore, wire saw technology to reduce the cost per watt of solar energy and eventually to achieve grid parity has played a crucial role. The latest and most advanced wire technology brings a lot of innovation, improve the productivity and the thinner silicon wafers to reduce the consumption of silicon materials.
Q:What is the surface hardness of monocrystalline silicon and polycrystalline silicon wafers
At this time, the hardness and elastic modulus of the oxide layer on the surface of monocrystalline silicon wafer were measured, which were about 10.2 GPa and 140.3 GPa, respectively. When the contact depth is about 32 ~ 60NM, silicon wafer contact stiffness and contact depth into a non linear relation between the hardness and elastic modulus increased sharply with the contact depth, show that the hardness and elastic modulus of monocrystalline silicon oxide film surface layer is affected by the matrix material.
Q:How to detect the surface finish of photovoltaic silicon wafers, what equipment?
Roughness, flatness, or cleanliness? But you have to choose optical instruments. I just don't know what you're asking for.
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The resistivity changes after annealing, as if it is mainly about the high resistivity of the oxygen donor.

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