Solar Cell High Quality A Grade Cell Polyrystalline 5v 16.8%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 16.8%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 16.8%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?
Mortar free multi wire cuttingMortar free type multi wire cutting, cutting and cutting sand coexist in the grinding fluid, resulting in low cutting efficiency; and the high viscosity of the coolant and cutting sand and high value of cutting raw materials mixed together, separation is difficult, resulting in the waste of raw materials and environmental pollution.Diamond wire cuttingThe preparation technology of diamond wire belongs to the technology of consolidation abrasive particles. Fixed abrasive wire cutting way between the consolidation in the wire on the abrasive and workpiece material cutting based on the principle of two body wear, abrasive particles directly on the workpiece, which belongs to a kind of rigid cutting method, greatly improves the cutting efficiency.
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
However, in order to manufacture semiconductor components and integrated circuits (IC). Pure silicon wafers have to be created and then used in a variety of processes, such as etching, doping, etc., to make conductive semiconductor circuits on silicon wafers. This process can achieve the level of precision represents the level of semiconductor manufacturing processes, such as the computer's CPU is the number of microns with the manufacture of technology. Because the process is more precise, in the same size of silicon, can make a number of more circuits, that is to achieve a higher degree of integration. At the same time, because the distance between the circuit is small, the length of the wire is short, the required working voltage is lower, the power consumption can be reduced, and the operating speed can be increased.
Q:What are the reasons for the phenomenon of monocrystalline silicon chip
Preventive measures are in the ultra clean environment, indirect or direct contact with the silicon process, can not have any metal objects, especially stainless steel, is determined not to appear. There's a silicon chip! It is necessary to ensure the cleanliness of the chemical cleaning liquid, and the ratio is correct. Otherwise, it will also appear on the surface of the silicon wafer. Check polishing machine polishing head, calibration pressure. Also, there can not be bad to the silicon wafer, belonging to scrap wafers, shall be returned to the original factory to find the reasons.
Q:How is the wafer appearance caused? The performance of the chip half white, a class of black! Seek help!
You should be the color difference problem is caused by the mortar temperature cutting room temperature and workshop temperature also influenced to reduce this effect only from the cleaning rod to minimize the time spent between, this is the enthusiasm of the staff problem
Q:What are some of the silicon wafer factory
4 polycrystalline casting workshopassistantIngot casting and painting team leaderPolycrystalline operatorCrucible spray, auxiliarySubtotal5 cutting workshop directorDeputy directorassistantCut the monitorRoll monitorCutting and grinding operation staffMulti line monitorMulti line operatorViscose monitorViscose operatorMortar mixerMortar mixing operatorRecorderConsignorSubtotal
Q:Why is it not easy to use high resistance on the silicon chip integrated circuit
It is not easy to use high resistance on silicon wafer because of the resistance on silicon wafer,
Q:For solar wafer cutting diamond wire, what are the characteristics?
The diamond wire saw is referred to as diamond wire, diamond wire, are the different names of one thing, because it is the thread sawing, all wire - sometimes called is a steel wire electroplating a layer of diamond particles consolidation.
Q:How to extract silicon from silicon wafers
Slice: cut a single crystal silicon rod into a thin wafer with an exact geometry. In this process, the silica fume is produced by water leaching to produce waste water and silicon slag.
Q:What is a semiconductor silicon device tester
First of all the circuit insulator carrier plays a supporting role in the insulation layer of the circuit is called the substrate (like P type semiconductor) to participate in the work of the collection circuit to take the CMOS process Nmos substrate are connected with the substrate
Q:How many times is the resistance of the same size silicon
Silicon is an important semiconductor material, chemical element symbol Si, the silicon used in the electronic industry should have high purity and excellent electrical and mechanical properties

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