Solar Cell High Quality A Grade Cell Polyrystalline 5v 16.6%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 16.6%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Polyrystalline 5v 16.6%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:What does TTV mean in silicon wafer production?
TTV is "total thickness variation" acronym or abbreviation, meaning total thickness variation, total thickness deviation.There is a method to measure the consistency of the thickness of silicon wafer, which is called the total thickness deviation (TTV)
Q:Why do monocrystalline silicon chamfer? Polysilicon film?
There are many single crystal chamfer.Single crystals are generally large chamfer, there is a single crystal process decision. There is a single crystal silicon rod is cut out, in order to make full use of the silicon rod, appear large chamfer; and polycrystalline is generally small chamfer, is to reduce the crack edge of the silicon wafer, the external stress of the silicon wafer or cell rupture. Polycrystalline battery will also appear large chamfer, those are generally small chamfer of the battery, found that there is a problem after the cut into large chamfer.
Q:What is the silicon wafer, the specific definition of what?
Silicon wafers are the raw materials for making transistors and integrated circuits
Q:What is the difference between the purpose of wafer cleaning and the cleaning of silicon material, what is the difference between the acid used
The silicon wafer cleaning is also known as the production of wool, chemical etching of silicon wafer surface, so that the light area
Q:What are some of the silicon wafer factory
2 raw materials for deputy director, assistant director of the workshop material sorting and packaging materials packaging materials sorting operator monitor corrosion monitor cleaning cleaning raw materials warehousing operator member subtotal deputy director of the 3 crystal sandblasting operator workshop director assistant assistant statistician crystal crystal pulling monitor operator cut cut monitor operator subtotal
Q:Seeking for the video: manual insert silicon wafer single crystal insert method
I'll tell you how to find the tab! First bring gloves put water, the water level must be submerged inserted cassette cleaning or oxidation film will not wash clean
Q:What is the specific way to clean the silicon wafer suede concrete steps
LED epitaxial wafer process:Over the past decade, in order to develop high brightness blue light-emitting diode, all over the world, the relevant research personnel are fully invested. The commercialization of products such as blue and green light-emitting diode two LED and laser diode LD application of the - III - V elements of the potential. In the current commercial LED materials and technology extension, red and green light emitting diodes are mainly epitaxy growth method of liquid phase epitaxy, and yellow, orange light emitting diode is still in vapor phase epitaxial growth method to grow P GaAs GaAsP materials.In general, the growth of GaN requires a very high temperature to interrupt the NH3 of the N-H solution, on the other hand, the kinetic simulation also learned that NH3 and MO Gas will react to produce no volatile by-products.
Q:How to avoid or reduce the fragmentation of thin silicon wafers without wax polishing?
I don't know how your employees operateYou can put a small bubble in the insertion box below if it is convenient. Can play a buffer role
Q:Silicon wafer cleaning after the two sides of the upper and lower grille also has a basket of flowers (Bai Yin)
I used to solve this problem for several months before the DOE experiment to solve, so it is very difficult, and there is no relationship with the bubble, and now the cleaning process does not need to bubble
Q:What is a silicon wafer cutting edge material?
The cutting edge of silicon wafer is the cutting edge of the cutting machine. The utility model is mainly used for cutting silicon wafer and semiconductor wafer, and is one of the three consumable materials of silicon wire cutting at present

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