Solar Cell High Quality A Grade Cell Monorystalline 5v 18.2%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.2%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.2%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:Hydrogen passivation mechanism of hydrogen fluoride HF in silicon wafer RCA cleaning process
0.5 ~ 1min in order to achieve the effect of removing the damage layer, at this timeCorrosion rate can reach 6 to 10um/min.In the polishing process to remove the damage layer on the basis to try to reduce, to prevent corrosion of the wafer was too thin.
Q:The significance of silicon wafer heat treatment
What will the resistivity change after heat treatmentBecause oxygen is the introduction of single crystal silicon at about 1400 DEG C, so the manufacturing process in general device temperature range (less than 1200 C), with the gap state of oxygen is in a saturated state, thermal cycling in the process of oxygen impurity in these devices due to the lower solid solubility will produce oxygen precipitation. Generally speaking, the higher the concentration of oxygen, the easier the oxygen precipitation is, the more oxygen precipitation is formed. On the contrary, the less oxygen precipitation. Especially when the oxygen concentration is less than a certain value (5 x 1017 / cm 3), the formation of oxygen precipitates is hardly observed.
Q:What is the price of monocrystalline silicon
The current price of silicon wafer recycling depends on the quality of the silicon wafer.
Q:For solar wafer cutting diamond wire, what are the characteristics?
There are several kinds of electroplated diamond wire, resin bonded diamond wire and mechanical pressing diamond wire. The general application of electroplating diamond wire is mainly due to its good wear resistance and heat resistance, diamond particles are not easy to fall off.Advantages: 1. Compared with the free abrasive cutting, the diamond wire cutting has a higher grinding speed, that is, higher production efficiency.2, silicon wafer yield is higher.3, cutting fluid consumption less, can reduce environmental pollution problems.Disadvantages: 1, the silicon wafer surface has obvious line, to see whether the customer can accept.
Q:Is a wafer a silicon wafer and a wafer?
It is the raw material of the semiconductor industry, which is called silicon wafer after cutting
Q:I would like to ask the solar cell (silicon) production process is the principle of how
Two, the surface of cashmereThe preparation of single crystal silicon wafer is the use of anisotropic etching of silicon on the surface of the silicon per square centimeter to form several million square pyramidal structure, namely, the Pyramid structure. Due to the multiple reflection and refraction of incident light on the surface, the absorption of light is increased, and the short circuit current and conversion efficiency are improved. Anisotropic etching of silicon in alkaline solution liquid is usually hot, available alkali sodium hydroxide, potassium hydroxide, lithium hydroxide and ethylenediamine etc.. Most of them were prepared by using dilute sodium hydroxide solution with a concentration of about 1%, and the corrosion temperature was 70-85. In order to obtain a uniform texture, but also in the solution add alcohols such as ethanol and isopropanol as complexing agent to accelerate the corrosion of silicon. In the preparation of velvet, the silicon chip must be first surface corrosion, alkaline or acidic etching solution to about 20 ~ 25 m, corrosion in the face, the general chemical cleaning. After surface preparation of silicon wafers are not suitable for long-term storage in the water, in order to prevent contamination, should be spread as soon as possible.
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The silicon wafer contact material uses the quartz material, does not contact the metal material
Q:Light doped and heavily doped silicon wafers
Otherwise, the light is mixed, N++/P++ said heavy doping, no plus is light, thank you
Q:What is the role of the semiconductor wafer
The main role of the glue is coated with photoresist coated flat, the use of high-speed rotation of the centrifugal force
Q:How do we use the scanning electron microscope
After wiping with cotton wool, wash ear ball can be dried.Some of the words can be placed in alcohol solution ultrasonic cleaning, the effect is almost.

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