Solar Cell High Quality A Grade Cell Monorystalline 5v 18.2%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.2%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.2%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:What is the cutting fluid for solar wafer cutting?
MB, HCT, NTC and other machines, the requirements of silicon cutting fluid and the proportion of silicon carbide powder is generally controlled at 1:0.92-0.95, mortar density in 1.630-1.635 can be cut quite ideal. Even if there is a greater proportion of proportion, and even mortar density of 1.67 or so will not have any problems, as long as the mortar viscosity control in 200--250 can be. But Ernst machine for mortar density is not higher than 1.57, that is to say 1.55-1.57. can control the viscosity of mortar at around 150, so the domestic silicon cutting fluid will appear in the 1.57 density with mortar, mortar viscosity may be less than 120, and if the mortar viscosity density to 150, more than 1.57, even more than 1.60. The viscosity of mortar is too large, directly will cause the machine alarm, actually influence deeper and may cause the film does not wash clean, burn, or heating of the motor, bearing on the machine itself is very wear.Therefore, the current domestic solar silicon cutting fluid, it is not very suitable for the Ernst & Young machine. The good news is that domestic users have found the defects of the machine, the machine began to replace the mortar pump from the original 0.75KW into 1.5KW, which may solve this problem.
Q:The last time you gave me the answer to the silicon chip, I learned a lot
Mohs hardness: 9.Density: 4 (+0.10, 0.05) g/cm 3.Optical characteristics: inhomogeneous body, one axis crystal, negative light.Color: strong. Blue: blue, green and blue; green: green, yellow and green; yellow: yellow, orange, orange orange; orange; pink: pink, purple, purple, purple and pink.Refractive index: 1.762 ~ 1.770 (+0.009, 0.005).Birefringence: 0.008 ~ 0.010.Ultraviolet fluorescence: Blue: long: no Xeon, orange; HF: no to weak, orange.Pink: long: strong, weak, orange orange; short wave.Orange: No, long wave strong, orange.Yellow: long: no to, red orange, orange red to orange: weak short wave.Color: purple, long wave: no Xeon, red; HF: no to weak, red.Colorless: no to medium, red to orange.
Q:Who is the best silicon chip dryer?
Silicon wafer drying machine is the Wuxi automation technology to do, that is, before the design of the Song Jiang Yang, now is an upgraded version of the. Easy to use.
Q:After the velvet or the original silicon
After the wafer is not cleaned clean, you should be monocrystalline wafers
Q:What is the role of the semiconductor wafer
The main role of the glue is coated with photoresist coated flat, the use of high-speed rotation of the centrifugal force
Q:The benefits of silicon chip
(1) classification of silicon steel sheetA and silicon steel sheet can be divided into two kinds: low silicon and high silicon. Low silicon silicon containing less than 2.8%, it has a certain mechanical strength, mainly used in the manufacture of motor, commonly known as dynamosheet; high silicon silicon content is 2.8%-4.8%, it has good magnetic properties, but more brittle, mainly used in the manufacture of transformer core, commonly known as the transformer silicon steel sheet. There is no strict limit in the actual use, the use of large silicon wafer manufacturing large motor. B, according to production and processing process can be divided into two kinds of hot rolling and cold rolling, cold rolling can be divided into grain orientation and grain orientation of the two. Cold rolled sheet of uniform thickness, good surface quality, high magnetic, therefore, with the development of industry, the trend of hot rolled sheet is cold rolled sheet has replaced (China has explicitly requested to stop the use of hot rolled silicon steel sheet, which is called "pre cold generation of heat")
Q:Is a wafer a silicon wafer and a wafer?
Ion implantation, etc., can be made into various semiconductor devices
Q:What is a silicon wafer
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer was produced. Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough within wafer doping some impurities, such as P, B etc.
Q:What is the role of silicon wafer annealing furnace, what specific requirements
The silicon wafer contact material uses the quartz material, does not contact the metal material
Q:How to deal with silicon wafer annealing
Why anneal? One reason is that silicon contains oxygen, oxygen has the role of absorbing impurities. The oxygen near the surface of the silicon wafer can be removed from the surface during annealing, so as to reduce the number of impurities near the surface. Facilitates device fabrication;Annealing has a certain influence on the resistivity and minority lifetime.For reference.

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