Solar Cell High Quality A Grade Cell Monorystalline 5v 18.0%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:How is the silicon chip integrated circuit?
Based on TTL series integrated circuit as an example, from silicon to process integrated circuit: cut off from a monocrystalline silicon chip, polished - polishing - oxidation - lithography - diffusion - epitaxial buried layer - oxidation - oxidation - diffusion - isolation lithography lithography - base diffusion - oxidation lithography - emitter diffusion vacuum aluminizing - sintering (ohmic contact lithography) - at the initial test procedure is done.
Q:Why integrated circuits can be etched on silicon
Integrated circuit (integrated circuit) is a kind of micro electronic device or component. With certain techniques, the transistor, required a circuit of resistance, capacitance and inductance components and interconnect wiring together, produced in a small or a few bits of the semiconductor wafer or substrate, and then encapsulated in a tube shell, a micro structure required for the circuit function; all of them element in the structure has formed a whole, so that the electronic components to miniaturization, low power consumption, high reliability and intelligent a huge step forward. It is represented by the letter "IC" in the circuit. The inventor of the integrated circuit is Jack Kilby (based on Ge) and the (silicon based (Si) integrated circuit). Most of the semiconductor industry today is based on silicon integrated circuit.A new type of semiconductor device developed in the late 1950s of 60s. It is through oxidation, photolithography, epitaxy, diffusion, evaporation of aluminum and semiconductor manufacturing process, the connecting wire between the required circuit has a certain function of the semiconductor, resistors, capacitors and other components and they are integrated in a small piece of silicon wafer, and then welding electronic devices are encapsulated in a casing. The outer shell of the utility model is provided with a round shell type, a flat type or a double line type. IC technology includes chip manufacturing technology and design technology, mainly in the processing equipment, processing technology, packaging testing, mass production and design innovation ability.
Q:What is the harm of silicon chip into the fingers?
The silicon rod into silicon wafer after printed, someone with bare hands touched the wafer, because the chemical composition of the finger is very complex, in the cleaning process is not removed, causing subsequent corrosion is not uniform, the more to the more obvious after section
Q:What is the silicon area of the 125 diagonal of a single crystal of 160?
- 125 - (125*1.414-160) - =15344.4375mm - =153.444cm -Note: the chamfer angle is 45 degrees
Q:How to make the photoresist and silicon substrate adhesion better
A thin layer of HMDS (hexamethyldisilazane) can be applied on the bottom layer of the silicon wafer, and then coated with PR, the main function of the solvent is to make the surface structure of the SIO2 of the silicon chip to be changed from hydrophilicity to hydrophobicity
Q:Why silicon wafers are made in watts!
A - (Si) amorphous silicon cells usually use high frequency glow discharge method to decompose the silane gas. Due to the low deposition temperature, the film can be deposited on glass, stainless steel plate, ceramic plate and flexible plastic sheet with a thickness of about 1 m, which is easy to large area (05rn * l.0m), and the cost is low. The structure of P in is adopted. In order to improve the efficiency and improve the stability, sometimes also made of three layers of P in multilayer laminated structure, or insert some transition layer. Its commercial production continued to grow, with an annual output capacity of 45MW / A, 10MW production line has been put into production, the global market volume of about 10 million per month, ranking first in the thin film battery. The development of integrated a - Si solar battery components, the use of the effective area of laser cutting is more than 90%, small area conversion efficiency increased to 14.6%, a large production of 8 to 10%, the highest efficiency of the laminated structure is 21%. Research and development trend is to improve the characteristics of the film, the precise design of photocell structure and control the thickness of each layer, improve the interface between the layers of state, in order to achieve high efficiency and high stability.
Q:There is a micro structure on the side of the silicon wafer
It is a milestone in the progress of science and technology that 160 thousand transistors have been integrated on a large grain of silicon.
Q:The meaning of various names
Need some wafer to test the state of the art production equipment, such as particle, etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used to group together with the normal production process to test the quality condition of a process, such as the CVD film thickness. Production equipment in the maintenance or repair immediately after. Production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, this type of wafer is called dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as certain machine wafer must process to a certain number the problem with dummy wafer. And some machine must be a form of dummy run in the process of a certain number of wafer, otherwise the process can not guarantee the quality and so on and so on many of the wafer are Dummy. can be called a wafer chip can be basically regarded as a dummy.Dummy wafer, control, block and so on are usually recyclable
Q:Light doped and heavily doped silicon wafers
Is divided into light heavy doping, which is related to the amount of doping
Q:The relationship between the weight and the power of solar wafers!
156*156,8 inch polysilicon chip Accounting: efficiency of 16%, the thickness of the silicon chip is 180, corresponding to the amount of polysilicon per watt on the map is 7G.

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