Solar Cell High Quality A Grade Cell Monorystalline 5v 18.0%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 18.0%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:Hydrogen passivation mechanism of hydrogen fluoride HF in silicon wafer RCA cleaning process
When the concentration of NaOH is higher than 20%W/V, the corrosion rate depends mainly on the temperature of the solution, but not on the actual concentration of the alkali solution.Removal of surface oxide layer on silicon wafer by HF:
Q:What are the difficulties of silicon wafer cutting?
During the cutting process, the wafer quality and rate of finished products played a major role in the grain type, viscosity of silicon carbide powder cutting fluid and particle size, the viscosity of mortar, mortar flow, steel wire speed and wire tension and workpiece feed speed.TTV: and TTV stria stria and is a headache in the wafer processing, from time to time there will be a knife, impossible to guard against. TTV is when the knife into the line, and is easy to appear in the time line bow.
Q:What is the silicon area of the 125 diagonal of a single crystal of 160?
- 125 - (125*1.414-160) - =15344.4375mm - =153.444cm -Note: the chamfer angle is 45 degrees
Q:What is a silicon chip made of?
The silicon rod pulling ingot is finished, the silicon wafer, and then processed to solar cell sheet, processing factory is finished, then the solar street lamp assembly
Q:Why should the wafer cut side, cut out edge Jiaosha
To determine the crystal, cutting the adhesive carbon or glass, mounted on the fixed equipment.In simple terms is to determine the crystal direction, in order to facilitate future cutting, design graphics to consider this point, and then ask a little deeper, it is necessary to look at the book.Transistors in general with 111 sides, MOS general 110The reason for this is related to doping, corrosion and other post production, but also the activity of different layers of electrons is different, potential energy is not the same.
Q:What is the specific way to clean the silicon wafer suede concrete steps
LED (Light Emitting Diode), light emitting diode, referred to as LED, is a kind of power can be converted into visible light solid-state semiconductor devices, which can directly convert electricity into light. The heart of LED is a semiconductor chip, one end of which is attached to a support, one end is a negative electrode, and the other end is connected with the positive electrode of the power supply so that the whole chip is encapsulated by epoxy resin. The semiconductor chip is made up of two parts, one part is the P type semiconductor, in which the hole is dominant, the other end is the N type semiconductor.
Q:Monocrystalline silicon processing technology
Cut diameterFine cutting lines mean lower kerf loss, that is to say with a piece of silicon can produce more silicon. However, the cutting line is thinner and more prone to fracture.loadThe total area of each cut is equal to the area of the wafer X the number of silicon blocks per cut X the number of chips per silicon block.Cutting speedThe cutting table cuts the speed of the web through the cutting line, which is largely determined by the cutting line moving speed, the motor power and the cutting wire tension.Easy maintenanceNeed to replace the wire cutting line and grinding slurry in cutting, maintain faster, higher overall productivity.Producers must balance these factors to maximize productivity. Higher cutting speed and greater load will increase the tension of the cutting line and increase the risk of breakage. Since all the chips on the same silicon chip are cut at the same time, as long as there is a cutting line broken, all the chips have to be discarded. However, it is not advisable to use a thicker and stronger cutting line, which reduces the number of wafers produced per cut and increases the consumption of silicon materials.
Q:Why can silicon chips store information? Even if it is a miniature circuit, unplug the power will be no electricity
The principle of the board as you say, the power can be changed according to the requirements of the crystal in the electronic case, the power will not stop after the move, but also as the pawn as the preservation of information,
Q:Polished silicon wafers can be most SEM substrates
There are many kinds of polishing, mechanical polishing, chemical polishing, electrolytic polishing, ultrasonic polishing, fluid polishing, magnetic abrasive polishing!Beijing there throwing a new type of practical technology, science and technology can improve the Liz polishing efficiency and so on.
Q:What is a silicon wafer
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer was produced. Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough within wafer doping some impurities, such as P, B etc.

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