Solar Cell High Quality A Grade Cell Monorystalline 5v 17.2%

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Specifications

hot sale solar cell 
1.16.8%~18.25% high efficiency 
2.100% checked quality 
3.ISO9001/ISO14001/TUV/CE/UL 
4.stable performance 


We can offer you the best quality products and services, don't miss !

 

POLY6'(156*156)

Polycrystalline Silicon Solar cell

 

Physical  Characteristics   

 

Dimension:     156mm×156mm±0.5mm

Diagonal:          220mm±0.5mm

Thickness(Si):  200±20 μm

 

Front(-)                                                              Back(+)

Blue anti-reflecting coating (silicon nitride);            Aluminum back surface field;

1.5mm wide bus bars;                                            2.0mm wide soldering pads;

Distance between bus bars: 51mm .                     Distance between bus bars :51mm .

 

Electrical Characteristics 

Efficiency(%)

18.00

17.80

17.60

17.40

17.20

16.80

16.60

16.40

16.20

16.00

15.80

15.60

Pmpp(W)

4.33

4.29

4.24

4.19

4.14

4.09

4.04

3.99

3.94

3.90

3.86

3.82

Umpp(V)

0.530

0.527

0.524

0.521

0.518

0.516

0.514

0.511

0.509

0.506

0.503

0.501

Impp(A)

8.159

8.126

8.081

8.035

7.990

7.938

7.876

7.813

7.754

7.698

7.642

7.586

Uoc(V)

0.633

0.631

0.628

0.625

0.623

0.620

0.618

0.617

0.615

0.613

0.611

0.609

Isc(A)

8.709

8.677

8.629

8.578

8.531

8.478

8.419

8.356

8.289

8.220

8.151

8.083

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 17.2%


MONO5'(125*125mm)165

Monocrystalline silicon solar cell

 

Physical  Characteristics 

Dimension: 125mm×125mm±0.5mm

Diagonal: 165mm±0.5mm

Thickness(Si): 200±20 μm

 

Front(-)                                                                         Back(+)                                                                                                                                                                                                                                    

Blue anti-reflecting coating(silicon nitride);                        Aluminum back surface field;

1.6mmwide bus bars;                                                        2.5mm wide soldering pads;

Distance between bus bars: 61mm .                                Distance between bus bars :61mm .

 

Electrical Characteristics 

 

Efficiency(%)

19.40

19.20

19.00

18.80

18.60

18.40

18.20

18.00

17.80

17.60

17.40

17.20

Pmpp(W)

2.97

2.94

2.91

2.88

2.85

2.82

2.79

2.76

2.73

2.70

2.67

2.62

Umpp(V)

0.537

0.535

0.533

0.531

0.527

0.524

0.521

0.518

0.516

0.515

0.513

0.509

Impp(A)

5.531

5.495

5.460

5.424

5.408

5.382

5.355

5.328

5.291

5.243

5.195

4.147

Uoc(V)

0.637

0.637

0.636

0.635

0.633

0.630

0.629

0.629

0.628

0.626

0.626

0.625

Isc(A)

5.888

5.876

5.862

5.848

5.839

5.826

5.809

5.791

5.779

5.756

5.293

5.144

 

Solar Cell High Quality  A Grade Cell Monorystalline 5v 17.2%

 

FAQ:

Q:How can i get some sample?

A:Yes , if you want order ,sample is not a problem.

 

Q:How about your solar panel efficency?

A: Our product  efficency  around 17.25%~18.25%.

 

Q:What’s the certificate you have got?

A: we have overall product certificate of ISO9001/ISO14001/CE/TUV/UL


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Q:Geometric parameters and testing of silicon wafer
Silicon chips have side length 125mm, 156mm, and 125 of the large chamfer diagonal 156mm and small chamfer diagonal 165mm, polycrystalline silicon chip to the side of the 156mm based, diagonal 219.2mm.
Q:How much a piece of silicon on the board
Crystalline silicon solar cell has a characteristic, that is a piece of 0.48-0.6V, accustomed to call 0. 5V, how many V you want, can be connected in series or in parallel to achieve. As for power, according to the W=UI formula can be drawn,
Q:What are the reasons for the phenomenon of monocrystalline silicon chip
Preventive measures are in the ultra clean environment, indirect or direct contact with the silicon process, can not have any metal objects, especially stainless steel, is determined not to appear. There's a silicon chip! It is necessary to ensure the cleanliness of the chemical cleaning liquid, and the ratio is correct. Otherwise, it will also appear on the surface of the silicon wafer. Check polishing machine polishing head, calibration pressure. Also, there can not be bad to the silicon wafer, belonging to scrap wafers, shall be returned to the original factory to find the reasons.
Q:For solar wafer cutting diamond wire, what are the characteristics?
There are several kinds of electroplated diamond wire, resin bonded diamond wire and mechanical pressing diamond wire. The general application of electroplating diamond wire is mainly due to its good wear resistance and heat resistance, diamond particles are not easy to fall off.Advantages: 1. Compared with the free abrasive cutting, the diamond wire cutting has a higher grinding speed, that is, higher production efficiency.2, silicon wafer yield is higher.3, cutting fluid consumption less, can reduce environmental pollution problems.Disadvantages: 1, the silicon wafer surface has obvious line, to see whether the customer can accept.
Q:Consult the difference between silicon and battery
Silicon wafer is generally refers to the silicon ingot with diamond wire or just cut into pieces,
Q:After the velvet or the original silicon
After the wafer is not cleaned clean, you should be monocrystalline wafers
Q:What is the meaning of a cleaning in a semiconductor silicon wafer process? RCA?
RCA cleaning is to use the RCA method to clean.RCA is a typical and commonly used wet chemical cleaning method:
Q:The metal in the silicon wafer
The properties of silicon have excellent electrical properties. The band gap is moderate, and is 1.21 ev. Higher carrier mobility, the electron mobility is 1350 cm / sec / V /, hole mobility is 480 cm / sec / v. The resistivity at room temperature (300K) up to 2.3 x 10 - Europe - cm wide, doped resistivity can be controlled in 10 - to 10 - Europe - cm, can meet the needs of manufacturing various devices. The minority carrier lifetime of the single crystal silicon is longer than that in a few tens of microseconds to 1 milliseconds. Larger thermal conductivity. The chemical property is stable, and is easy to form a stable thermal oxidation film. It can be used to realize the surface passivation and protection of the PN junction in the fabrication of planar silicon devices, and the metal oxide semiconductor structure can be formed to produce MOS field effect transistors and integrated circuits. The properties of the PN junction has good characteristics, so that the silicon device has the advantages of high pressure, the reverse leakage current, high efficiency, long service life, good reliability, good heat conduction, and in the 200 - high temperature operation etc..
Q:How many times is the resistance of the same size silicon
Silicon is one of the largest and most widely used semiconductor materials, and its output and consumption mark the level of a country's electronics industry.
Q:What is the cutting fluid for solar wafer cutting?
Because in the China multi wire cutting machine was first used in semiconductor cutting, so that only the Swiss MB and HCT, the Swiss system thinking line cutting machine with special emphasis on power and environmental protection, so that this kind of machine in the cutting process of mortar viscosity requirement is relatively high, the most direct embodiment is to use the cutting fluid is oily, reflected in the raw material cutting fluid is used to peg, otherwise, the power will be the formation of excess waste machine. NTC is the rise in the solar industry on the occasion, we seize the opportunity, to imitate the Swiss line cutting machine design and production, but the Swiss precision machine modified to virtually out of order, the rapid development of the pursuit of efficiency of solar wafer cutting industry, especially to the rise of China solar wafer cutting industry thus, China quickly occupied the market leader, the share reached 65%. However, the company has done a little better, although the power system and the power of the machine to reduce a lot, you can use the machine in the use of cutting fluid on the Swiss machine standards. Oily cutting fluid cutting efficiency and surface cut out of the film is generally better than the aqueous solution of cutting fluid, but the performance of Japanese light wire cutting machine, which he used oily fluid will cause a burden on his power, so Japanese developed this kind of water-based cutting fluid. Regardless of the cost or the use of the Japanese machine are more consistent, and easy to recycle. This NTC machine oil cutting fluid and water-based cutting fluid can be used.

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