Shenzhen Factory High Brightness SMD5730 LED Chip

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General Introduction

Shenzhen Factory High Brightness SMD5730 LED Chip

 

Feature

A)Size(mm):5.7*3.0*0.9

 

B)Emitting Angle:120 degree

 

C) Soldering Method: re-flow soldering

 

D)RoHS compliant

 

E)Dice Material: InGaN

 

F)Suitable for all SMT assembly and solder process.

 

Application

 

A) Optical indicator

 

B) Indoor lighting

 

C) Interior automotive lighting

 

D) Backing for LED,switch and symbol,display

 

E) Light pipe application

 

F) Advertisement

 

Specification

Part No.DiceLence TypeCRILuminous flux Viewing Angle 
Min.Max.MinMax2θ 1/2
5730W450-1B0White(InGaN)Yellow Diffused70874045120
5055
5560

 

Electro-optical characteristics at Ta=25°C

 

ParameterSymbolMin.TypeMax.UnitsTest conditions
Forward VoltageVF2.83.03.6VIF=150mA
Reverse CurrentIR— —— —10μAVR=5V
Color CoordinatesX— —0.371— —— —IF=150mA
Y— —0.37— —— —IF=150mA
Color TemperatureTC400042004500KIF=60mA

 

Electro-optical characteristics at Ta=25°C

PowerSymbolRatingUnits
Power DissipationPd500mW
DC Forward CurrentIF150mA
Peak Forward Current[1]IFP200mA
Reverse VoltageVR5V
Eletrostatic Discharge(HBM)ESD1000V
Operating TemperatureTopr—40-+85°C
Storage TemperatureTstg—40-+100°C

 

 Application notes

 A) The LEDs should be kept at 30°C or less and 90@ RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packing with absorbent material(sillica gel) is recommended.

 B) The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldred within 24 hours(1days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material(sillica gel). It is also recommennded to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again or it need to rebake before using next time.

 

Notes

Baking condition:temperature 70°C±5°C;humidity:less than 10%RH

 

Our Services

Reply your inquiry in 24 working hours

Customized design is available,OEM and ODM are welcomed

Delivery the goods to our customer all over the world with speed and precision

Offer customer the lowest price with high quality product.

 

Q:LED package and LED SMD LED lamp, what is the difference? Will the release agent be used in that part?
Packaging is for TOP series LED, that is, the type of plastic molding. The patch is based on the PCB circuit board for molding. Mold release agent is used in molding.
Q:What are the storage requirements of SMT patch LED (LED)?
Moisture-proof packing- anti SMD LED in the transport and storage of moisture absorption, SMD LED shall be placed in sealed moisture-proof bag, inside put damp proof agent for protection, and placed the humidity humidity SMD display card packaging bag.
Q:Notes on patch LED
Storage bags are sealed and stored at a temperature of <40 DEG C.
Q:What is the difference between SMT LED packaging with silicone and epoxy resin transparent package? What is the market situation of these two types of packaging?
To package with epoxy SMD beads are used in a lot of outdoor display, because the epoxy adhesive with good adhesion to all better PPI support in outdoor use, our high quality and inexpensive epoxy epoxy call for samples
Q:What is the principle used in SMD LED lamp, should pay attention to what the problem?
Table 1, contact electrostatic protection LED product should be covered with protective electric tape, and its reliable grounding; 2, personnel shall wear groundstrap in contact with LED (best for cable, protective gloves, anti-static ring) allows better wear anti-static clothing, anti-static shoes and static electricity cap; 3, the application in the process of exposure to LED equipment must be reliable grounding, such as iron, shearing machine, bending machine and welding equipment. Conditional still can install plasma fan to eliminate electrostatic; 4, in use or when designing electronic circuit, must consider the harm that excessive current has to LED
Q:LED patches have several ways of welding. Which ones can be reflow? What can be done by eutectic welding? Is the welding of viscose and lens material is required?
Chip and stent welding methods are: eutectic welding, silver glue fixed, resin insulation and fixed silicone rubber insulation fixedWelding beads: reflow soldering, hot plate welding and manual soldering.
Q:How does the LED placement lamp distinguish the positive and negative poles? There is no sign on the light. Thank you
The light emitting diode is fixed regardless of color. The light emitting diode 1, line: foot length is positive, the negative is short. The electrodes inside the tube can also be carefully observed, while the smaller ones are positive and the large ones, similar to the bowl, are negative. 2, SMD: overlooking the side with the color line is negative, the other side is positive.
Q:How can I install the patch LED lamp belt on the wood chip casting board? With double-sided glue will be hot, and can not use the clip on the screw, what should I do?
With double-sided adhesive, the temperature will not be very high. So it won't fall either. That's how I got it. It took me more than half a year, and I didn't have any problems
Q:Does anyone know what the current rating of a white high brightness LED patch is? Where can I find out?
LED high power and low power, small white rated current and LED wafer, such as a chip is 20MA two 40MA.... High power 0.5W, 100-150MA, 1W, 350MA current rating in the relevant product specifications
Q:Led lamp and Led patch two what is the difference between ah, the feeling is a patch of long service life, whether or not? 5-10 meters pan area lighting lamp selection Everbright shaped or patch shape?
If you take a large area light, to see that the lighting requirements, functional lighting, or lighting atmosphere, or ordinary lighting, which is to be considered, the two optical (lens) can bring you the light angle planning.

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