Shenzhen Factory High Brightness SMD5730 LED Chip

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General Introduction

Shenzhen Factory High Brightness SMD5730 LED Chip





B)Emitting Angle:120 degree


C) Soldering Method: re-flow soldering


D)RoHS compliant


E)Dice Material: InGaN


F)Suitable for all SMT assembly and solder process.




A) Optical indicator


B) Indoor lighting


C) Interior automotive lighting


D) Backing for LED,switch and symbol,display


E) Light pipe application


F) Advertisement



Part No.DiceLence TypeCRILuminous flux Viewing Angle 
Min.Max.MinMax2θ 1/2
5730W450-1B0White(InGaN)Yellow Diffused70874045120


Electro-optical characteristics at Ta=25°C


ParameterSymbolMin.TypeMax.UnitsTest conditions
Forward VoltageVF2.83.03.6VIF=150mA
Reverse CurrentIR— —— —10μAVR=5V
Color CoordinatesX— —0.371— —— —IF=150mA
Y— —0.37— —— —IF=150mA
Color TemperatureTC400042004500KIF=60mA


Electro-optical characteristics at Ta=25°C

Power DissipationPd500mW
DC Forward CurrentIF150mA
Peak Forward Current[1]IFP200mA
Reverse VoltageVR5V
Eletrostatic Discharge(HBM)ESD1000V
Operating TemperatureTopr—40-+85°C
Storage TemperatureTstg—40-+100°C


 Application notes

 A) The LEDs should be kept at 30°C or less and 90@ RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packing with absorbent material(sillica gel) is recommended.

 B) The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldred within 24 hours(1days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material(sillica gel). It is also recommennded to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again or it need to rebake before using next time.



Baking condition:temperature 70°C±5°C;humidity:less than 10%RH


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