PACKAGING MATERIAL FOR ELECTRONICS

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Product Description:

NO.

Item

Unit

Test standard and result

1

Metal layer resistance

Ohm/sq

<100

2

Metal layer optical transmission

Optical density

40%-70%

3

Surface resistivity

Ohm/sq

108-1011

4

Time for static removal

5000-0V

<0.01 sec FTMS 101 B Method 4046

5

Puncture resistance

P.S.I

ASTM  D3420      >100

7

MVTR

gm/100in-2/24hrs

ASTM  E  96      <0.2

8

Oxygen Barrier

CC/100in-2/24hrs

ASTM  D  3985    <0.5

9

Hot sealing temperature

F

250-375F

10

Seal strength

N/15mm

25.2

Usage

1. The kind of bag can keep static-sensitive components away from the potential static danger to the largestextent. Its special four -layer structure can create such effect as an inductivecover to separate the goods inside from the static field.

2. Furthermore, the inner layer is made from ethane which can remove the static and avoid static generation inside thebag

3. In addition, this kind of hot seal bagis transparent, so the goods inside can be easily recognized from outside. Andthe surface resistance: 108-1011

4. Applicable to pack electronic productswhich are sensitive to static, such as PC board, IC integrated circuit ,CDdriver, HD

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