Monosolicion Solar Cells Poly 156mm*156mm
Typical electrical characteristics
Data under standard testing conditions(STC): 1,000W/m2, AM1.5, 25℃, Pmax: Positive power tolerance.
Typical teperature coefficients
- Q:Geometric parameters and testing of silicon wafer
- Wafer inspection the main test items are: side, diagonal, chamfer, thickness, TTV, line, chipping, cracks, warping, oil, resistivity, lifetime.
- Q:Pure curiosity why silicon wafer is round
- Journey~woo~'s response: Yeah, why are they made of round bars?...... Sometimes it's a little inconvenient to design the channelRod like the natural shape of production.
- Q:How to deal with silicon wafer annealing
- Another fact: if the same "complement", can be understood as: oxygen from the surface after the removal of impurities, near the surface of the reduced defects is also reduced, the mean free path of carrier mobility increases, also increases, which leads to the decrease of resistivity.
- Q:1 megawatts of solar energy need how many wafers
- 1 WP silicon chip, which is 1000000WPDo not know what you want to know? Detailed point!
- Q:How do we use the scanning electron microscope
- Most of the samples prepared by silicon wafer were dispersed on the surface of silicon wafer after the dispersion of nano particles. The test results and this kind of sample is silicon pretreatment, the main drying and sample dispersion and sample, the majority of small particle size, easy to agglomerate, take the solution can take the middle or upper clear liquid
- Q:Why not use N type silicon crystal silicon battery
- Can use N type silicon chip, the current SUN POWER battery slice, is the use of N type silicon wafer production, conversion efficiency is very high, but the price is not cheap.At present, most of the domestic manufacturers do not have the production of battery N battery pack, it should be a cost problem.
- Q:What is the role of silicon wafer annealing furnace, what specific requirements
- I want to be the temperature to more than 1 thousand degrees, and then clean the furnace
- Q:I would like to ask the solar cell (silicon) production process is the principle of how
- Two, the surface of cashmereThe preparation of single crystal silicon wafer is the use of anisotropic etching of silicon on the surface of the silicon per square centimeter to form several million square pyramidal structure, namely, the Pyramid structure. Due to the multiple reflection and refraction of incident light on the surface, the absorption of light is increased, and the short circuit current and conversion efficiency are improved. Anisotropic etching of silicon in alkaline solution liquid is usually hot, available alkali sodium hydroxide, potassium hydroxide, lithium hydroxide and ethylenediamine etc.. Most of them were prepared by using dilute sodium hydroxide solution with a concentration of about 1%, and the corrosion temperature was 70-85. In order to obtain a uniform texture, but also in the solution add alcohols such as ethanol and isopropanol as complexing agent to accelerate the corrosion of silicon. In the preparation of velvet, the silicon chip must be first surface corrosion, alkaline or acidic etching solution to about 20 ~ 25 m, corrosion in the face, the general chemical cleaning. After surface preparation of silicon wafers are not suitable for long-term storage in the water, in order to prevent contamination, should be spread as soon as possible.
- Q:How to do on the silicon wafer
- 1, observation and analysisFirst check the pollution level of the battery plate to be cleaned before cleaning. If it is mild pollution - no particles, only dust. It is recommended that we do the washing and scrubbing alone. This will not only save, save manpower and material resources, but also to extend the surface of the battery board to maintain a certain degree of brightness. Increase its life!
- Q:The meaning of various names
- Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer is produced
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