Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

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Product Description:

Brief Introduction

 

- Up to 20.0% efficiency, one of the highest performing mono crystalline cells on the market

- Three bus bars boosts current collection over the entire cell area, leading to higher fill factors 

- Blue anti-reflecting coating allows more sunlight be captured and converted to electricity

- Finer, closer fingers improves charge collections for improved energy yield

- Lower light-induced degradation leads to greater power output over the entire module lifetime

- All solar cells are tightly classified to optimize output of module

- Maximum yield and longevity due to hotspot prevention

- Premium appearance results in a highly uniform and aesthetically appealing module

 

 

Specification

- Product Mono-crystalline silicon solar cell 

- Dimension 156 mm x 156 mm ± 0.5 mm 

- Thickness 200 μm ± 30 μm 

- Front 1.5 ± 0.1 mm busbar (silver)

- Silicon nitride antireflection coating 

- Back 3.0 mm continuous soldering pads (silver)

- Back surface field (aluminum)

 

 

 Electric performance parameters 

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

- Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

- Imin : at 0.5 V


 Light Intensity Dependence

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

 

 Soldering Ability

 

- Peel Strength: > 1.0 N/mm (Pull soldered ribbon from busbar in 5 mm/s of 180°)

 

 

 Dimension Figure

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0


Quick Response

- Any time and anywhere, reply clients' email and solve all problems happen in the work  at the first time.

- Remove clients doubts and offer the best solution at the first time.

- Give our clients the lastest news of the photovoltaic, update the newest stock informtion.

 

 

 Production and Quality Control

- Precision cell efficiency sorting procedures

- Stringent criteria for color uniformity and appearance

- Reverse current and shunt resistance screening

- ISO9001,ISO14001 and OHSAS 18001,TUV Certificated


Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 19.0



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.






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Q:How is the silicon chip integrated circuit?
The following procedures: scribing - sintering base - bonding - in - Test - Packaging - aging - testing - printing (laser or screen printing)
Q:Why integrated circuits can be etched on silicon
And for why it's cheaper to use silicon, it's not because of its semiconductor nature that it uses it. The formation of P and N, a multi hole, a multi electron, and thus the role of different doping. GaAs expensive, but the performance is good, mostly for high-speed circuits and military aspects.
Q:What is a good solar wafer testing equipment?
To develop solar energy, we must overcome two key challenges: cost and yield." In the solar panel manufacturing process, from the front to the back, from the crystal rod, wafer, chip to the module, any one of the links in error, will affect the number of solar panel products. Therefore, the solar cell needs to be able to monitor every step of the process in the production process of detection tools. QCROBOT also has many successful cases in this field.
Q:Manufacturers of solar wafers belong to the photovoltaic industry which specific industry classification below
Polysilicon for chemical, silicon wafer for machining, battery components for semiconductor processing
Q:What are the difficulties of silicon wafer cutting?
1, the impurity line caused by impurities in polycrystalline silicon ingot, slicing process can not completely remove the lead line on a silicon wafer.2, scratch line caused by mortar in large SIC particles or caking mortar. In the process of cutting, SIC particles stuck in between steel wire and silicon can not overflow, cause.Forms: including the whole line and half line marks, concave line, shiny, more narrow than the other.
Q:Why is it not easy to use high resistance on the silicon chip integrated circuit
For boron diffusion resistance, its resistivity is determined by the use of a greater length / width ratio, which is subject to the limitations of process and wafer area
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Solar silicon wafer surface plasma cleaning processResidual plasma cleaning method of particles on silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow. The plasma cleaning method for removing particles of silicon surface easy control, thorough cleaning, no residual reactants, the process gas, non-toxic, low cost, small amount of labor, work efficiency high.
Q:What is a silicon wafer
Si seed a specific crystal orientation (seeds, usually a small ingot) rod inserted into the molten state under Si, and slowly pull up the crystal and a seed crystal and the same column to be produced by controlling the process variables to pull the speed to control the crystal column the diameter can be cut into a crystal column. The small lot, wafer was produced. Crystal column ends can not be cut into available wafer parts can be called the head tail. Preliminary cutting out the wafer, usually can not be used as a rough surface, wafer production, and usually in the subsequent process of polishing, polishing the noun to which. According to the different requirements of wafer fabrication, usually need to rough within wafer doping some impurities, such as P, B etc.
Q:How to convert photovoltaic silicon MW
156 single crystal (chamfer 200) area: 238.95125 single crystal (chamfer 165) area: 154.831MW=1 * (10 negative) W
Q:How to deal with silicon wafer annealing
Another fact: if the same "complement", can be understood as: oxygen from the surface after the removal of impurities, near the surface of the reduced defects is also reduced, the mean free path of carrier mobility increases, also increases, which leads to the decrease of resistivity.

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