Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2

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Product Description:

Brief Introduction

 

- Up to 20.0% efficiency, one of the highest performing mono crystalline cells on the market

- Three bus bars boosts current collection over the entire cell area, leading to higher fill factors 

- Blue anti-reflecting coating allows more sunlight be captured and converted to electricity

- Finer, closer fingers improves charge collections for improved energy yield

- Lower light-induced degradation leads to greater power output over the entire module lifetime

- All solar cells are tightly classified to optimize output of module

- Maximum yield and longevity due to hotspot prevention

- Premium appearance results in a highly uniform and aesthetically appealing module

 

 

Specification

- Product Mono-crystalline silicon solar cell 

- Dimension 156 mm x 156 mm ± 0.5 mm 

- Thickness 200 μm ± 30 μm 

- Front 1.5 ± 0.1 mm busbar (silver)

- Silicon nitride antireflection coating 

- Back 3.0 mm continuous soldering pads (silver)

- Back surface field (aluminum)

 

 

 Electric performance parameters 

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2

- Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

- Imin : at 0.5 V


 Light Intensity Dependence

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2

 

 Soldering Ability

 

- Peel Strength: > 1.0 N/mm (Pull soldered ribbon from busbar in 5 mm/s of 180°)

 

 

 Dimension Figure

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2


Quick Response

- Any time and anywhere, reply clients' email and solve all problems happen in the work  at the first time.

- Remove clients doubts and offer the best solution at the first time.

- Give our clients the lastest news of the photovoltaic, update the newest stock informtion.

 

 

 Production and Quality Control

- Precision cell efficiency sorting procedures

- Stringent criteria for color uniformity and appearance

- Reverse current and shunt resistance screening

- ISO9001,ISO14001 and OHSAS 18001,TUV Certificated


Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.2



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.






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Q:Why do you want to make the wafer bigger?
Because each layer is insulated by silicon dioxide, it is equivalent to a capacitor structure. The larger the span, the greater the capacity of the wiring. The higher the frequency, the more serious side effects such as the integral effect of the long distance transmission. Basically thought GHz must use the following line width.18 technology. Chip size also affects power consumption. With the same mask and the same operating frequency, the smaller the line width, the smaller the voltage. The power consumption is proportional to the square of the voltage. Want to pursue low power you have to honestly narrow the line width. The semiconductor industry in the world are going to kill red eye, if we do not have shortcut yiwofeng to dive in.
Q:What are the difficulties of silicon wafer cutting?
During the cutting process, the wafer quality and rate of finished products played a major role in the grain type, viscosity of silicon carbide powder cutting fluid and particle size, the viscosity of mortar, mortar flow, steel wire speed and wire tension and workpiece feed speed.TTV: and TTV stria stria and is a headache in the wafer processing, from time to time there will be a knife, impossible to guard against. TTV is when the knife into the line, and is easy to appear in the time line bow.
Q:After the velvet or the original silicon
Sand cutting is the case, it is silicon cutting related issues,
Q:Why do they make so many transistors on silicon in an integrated circuit
Small size, low power consumption! This is the advantage of IC ah.
Q:What is the thickness of the semiconductor wafer used today?
0.670mm or so. The wafer must be thinned, otherwise the loss of the dicing knife is very large, and it is necessary to draw two knives
Q:Why can silicon chips store information? Even if it is a miniature circuit, unplug the power will be no electricity
The principle of the board as you say, the power can be changed according to the requirements of the crystal in the electronic case, the power will not stop after the move, but also as the pawn as the preservation of information,
Q:The significance of silicon wafer heat treatment
What will the resistivity change after heat treatmentBecause oxygen is the introduction of single crystal silicon at about 1400 DEG C, so the manufacturing process in general device temperature range (less than 1200 C), with the gap state of oxygen is in a saturated state, thermal cycling in the process of oxygen impurity in these devices due to the lower solid solubility will produce oxygen precipitation. Generally speaking, the higher the concentration of oxygen, the easier the oxygen precipitation is, the more oxygen precipitation is formed. On the contrary, the less oxygen precipitation. Especially when the oxygen concentration is less than a certain value (5 x 1017 / cm 3), the formation of oxygen precipitates is hardly observed.
Q:Solar silicon wafer cutting fluid can burn explosion?
2, the glass can not be used as the bearing plate of the crystal rod, if the use of graphite plate, grinding down the silicon powder containing a certain amount of graphite, it is difficult to deal with the recovery of silica fume3, can only be used for single crystal cutting4, the cost of the problem, and now the price of diamond wire fell faster, diamond wire cutting costs should be close to the cost of cutting free abrasive
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
General loss of about 40%, the general thickness of about 190um silicon, cutting seam in 120um
Q:Why integrated circuits are rectangular and the silicon chips are round
The disk that you see is a wafer. This disk is not only the production of a chip, but N multiple chips are produced in this disk.

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