Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0

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Product Description:

Brief Introduction

 

- Up to 20.0% efficiency, one of the highest performing mono crystalline cells on the market

- Three bus bars boosts current collection over the entire cell area, leading to higher fill factors 

- Blue anti-reflecting coating allows more sunlight be captured and converted to electricity

- Finer, closer fingers improves charge collections for improved energy yield

- Lower light-induced degradation leads to greater power output over the entire module lifetime

- All solar cells are tightly classified to optimize output of module

- Maximum yield and longevity due to hotspot prevention

- Premium appearance results in a highly uniform and aesthetically appealing module

 

 

Specification

- Product Mono-crystalline silicon solar cell 

- Dimension 156 mm x 156 mm ± 0.5 mm 

- Thickness 200 μm ± 30 μm 

- Front 1.5 ± 0.1 mm busbar (silver)

- Silicon nitride antireflection coating 

- Back 3.0 mm continuous soldering pads (silver)

- Back surface field (aluminum)

 

 

 Electric performance parameters 

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0

- Testing conditions: 1000 W/m2, AM 1.5, 25 °C, Tolerance: Efficiency ± 0.2% abs., Pmpp ±1.5% rel.

- Imin : at 0.5 V


 Light Intensity Dependence

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0

 

 Soldering Ability

 

- Peel Strength: > 1.0 N/mm (Pull soldered ribbon from busbar in 5 mm/s of 180°)

 

 

 Dimension Figure

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0


Quick Response

- Any time and anywhere, reply clients' email and solve all problems happen in the work  at the first time.

- Remove clients doubts and offer the best solution at the first time.

- Give our clients the lastest news of the photovoltaic, update the newest stock informtion.

 

 

 Production and Quality Control

- Precision cell efficiency sorting procedures

- Stringent criteria for color uniformity and appearance

- Reverse current and shunt resistance screening

- ISO9001,ISO14001 and OHSAS 18001,TUV Certificated


Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0

Mono Solar Cells156mm*156mm in Bulk Quantity Low Price Stock 18.0



FAQ:

1. Q: Do you have your own factory?

   A: Yes, we have. Our factory located in Jiangsu

2. Q: How can I visit your factory?
    A: Before you visit,please contact us.We will show you the route or arrange a car to pick you up.
3. Q: Do you provide free sample?
    A: Commenly we provide paid sample.

4. Q: Could you print our company LOGO on the nameplate and package?

   A: Yes, we accept it.And need an Authorization Letter from you.

5. Q: Do you accept custom design on size?

   A: Yes, if the size is reasonable.

6. Q: How can I be your agent in my country?

   A: Please leave feedback. It's better for us to talk about details by email.

7. Q: Do you have solar project engineer who can guide me to install system?

   A: Yes, we have a professional engineer team. They can teach you how to install a solar system.






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Q:P type and N type monocrystalline silicon chip difference?
The doping of phosphorus in monocrystalline silicon is N type, the more the phosphorus is, the more free electrons, the stronger the conductivity, the lower the resistivity;
Q:The process for steel wire cutting silicon factory, we use HCTB5 wire, you can do?
Mortar free multi wire cuttingMortar free type multi wire cutting, cutting and cutting sand coexist in the grinding fluid, resulting in low cutting efficiency; and the high viscosity of the coolant and cutting sand and high value of cutting raw materials mixed together, separation is difficult, resulting in the waste of raw materials and environmental pollution.Diamond wire cuttingThe preparation technology of diamond wire belongs to the technology of consolidation abrasive particles. Fixed abrasive wire cutting way between the consolidation in the wire on the abrasive and workpiece material cutting based on the principle of two body wear, abrasive particles directly on the workpiece, which belongs to a kind of rigid cutting method, greatly improves the cutting efficiency.
Q:How to do on the silicon wafer
2, wash, scrubWhen the need for deep cleaning if found on the surface of particles or not sure. Then you must first rinse, rinse off the particles and then scrub. Why scrub? Because the washing operation can only go out of the surface of floating dust particles. Especially particulate matter. The effect can be said to be very perfect. But there is a certain viscosity or due to the chemical reaction produced by pollutants is not very thorough. If the terms of the development of the passage of time will no longer be able to clean up these pollutants.
Q:The production of silicon units do front-line production workers harmful to the body
You are asking whether this problem is more harmful to the body is broad, if you ask whether they produce toxic substances will wafer production process, I can tell you: the wafer production involves no chemical reaction, no poison produced.
Q:Why the resistivity of silicon wafer is high and low
For example, after heating resistance and cooling, more or less there will be changes in the normal temperature change, is allowed error.
Q:Seeking for the video: manual insert silicon wafer single crystal insert method
After the water is put into the plug, each time the number of slices can not be more than fifty pieces, the number of chips too easy to fall damaged silicon. If the chip is not cleaned in time to allow the silicon chip in the water bubble, but the bubble can not be more than an hour
Q:Process flow of wafer wafer ultrasonic cleaning machine?
Plasma wafer cleaning parameters:Residual plasma cleaning method of particles 1, silicon wafer surface, which comprises the following steps: firstly, gas flushing process, and then the gas plasma glow; the use of either gas from the 02, Ar, N2; gas washing process parameters set process: the chamber pressure of 10-40 mTorr, process gas flow 100-500sccm time, 1-5s; process parameters of starting process is: the chamber pressure of 1040 mTorr, process gas flow on the electrode 100-500sccm, power 250-400W, time 1-10s.2, as described in the plasma cleaning method, the invention is characterized in that the gas used is 23, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 15 mTorr, process gas flow 300sccm, time 3S; process parameters of starting process is: the chamber pressure of 15 mTorr, process gas flow on the electrode 300sccm, power 300W, time Ss.4, plasma cleaning method, which is characterized in that the process parameters of gas flushing process is: the chamber pressure of 10-20 mTorr, process gas flow 100-300sccm, time 1-5s; process parameters of starting process is: the chamber pressure of 10-20 mTorr, process gas flow on the electrode 100-300sccm, power 250-400W, when Lu 1-5s.
Q:For solar wafer cutting diamond wire, what are the characteristics?
There are several kinds of electroplated diamond wire, resin bonded diamond wire and mechanical pressing diamond wire. The general application of electroplating diamond wire is mainly due to its good wear resistance and heat resistance, diamond particles are not easy to fall off.Advantages: 1. Compared with the free abrasive cutting, the diamond wire cutting has a higher grinding speed, that is, higher production efficiency.2, silicon wafer yield is higher.3, cutting fluid consumption less, can reduce environmental pollution problems.Disadvantages: 1, the silicon wafer surface has obvious line, to see whether the customer can accept.
Q:Why do you use a concentrated sulfuric acid and hydrogen peroxide to wash silicon?
Because of the use of sand when the recovery of mortar used too much, resulting in increased viscosity and organic impurities
Q:What does TTV mean in silicon wafer production?
Thickness variation of TTV: wafer. Generally speaking, the thickness of silicon wafer has no effect on the quality of silicon wafer. The only thing that really works in a silicon chip is a thin layer of silicon, and the rest is supported

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