High Thermal Conductivity RTV Epoxy Potting Adhesive Glue

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Loading Port:
Guangzhou
Payment Terms:
TT OR LC
Min Order Qty:
10000 m.t.
Supply Capability:
50000 m.t./month

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Product Description:

Features 
1. Excellent adhesion, resistance to cracking 
2. Good toughness, high hardness 
3. Excellent electrical insulation properties, stability 
4. High thermal conductivity, low thermal expansion coefficient 
5. Higher Tg, can be used in the 150 ° C -180 ° C long-term 
6. Good waterproof, moisture resistance, low water absorption 
7. Flame retardant grade up to UL94 V-1 

Operation 
1. Mixing: Stirring A component evenly in the original package, then A, B components according to the Weight ratio of 7: 1 are weighed and mixed, then start to potting after mixing evenly. 
2. The B component may appear crystal or caking during storage ( this is normal), if the crystallization Need to placed in the oven at 80° C to melt before using(the containers should be in open state, in order to avoid the gas expansion, damage container), and Then cooling to room temperature before using, It does not affect its performance. 
3. If necessary, the device with good sealing can continue to vacuumize, is helpful to increase the Electrical properties of the device. 
4. The curing conditions: 80 ° C/2hrs or 25 ° C/24hrs. 
5. For the use of glue equipment please consult our marketing department. 

Package Storage 
A component: 14kg/ plastic bucket Keep in cool and ventilative place 
B component: 1kg/ bottle Temperature≤ 25° C, humidity≤ 50%RH 
Shelf life: 12 months both of A and B


Properties before curing

Part

E4215 A

E4215 B

Appearance

Black liquid

  Brown liquid

Viscosity, mPa.s(25°C)

25,000±5,000

100-300

Density,  g/cm3(25°C)

1.95±0.1

1.12±0.05

Mixture/mass ratio

A:B = 7: 1

Viscosity after mixing, mPa.s (25°C)

4000±500

Operation time  , hr(25°C)

1.2

Gel time  ,hr (25°C)

12

Properties after curing

Hardness, Shore D

≥90

Expansion coefficient    μm/(m,°C)

210

Thermal  conductivity    W/mK

1.1

Glass transition temperature    °C

135

Tensile-shear strength,  Mpa, Fe/ Fe

≥10

Dielectric strength    kV/mm(25°C )

≥20

Dissipation Factor (1MHz)(25°C)

0.09

Dielectric constant  (1 MHz) (25°C)

2.9

Volume resistance DC500V, Ω@cm

6.00E +15


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