High compact laminate wall panel

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Testing report of ghysical performance
testing itemtechnical requirementtesting resulttesting method
thermal conductivity
(core material/W(m*k)

≤0.040W(m*k)0.024GB/T 10297-1998
compressive strength,kpa≥30kpa52.7JG149-2003
water absorption,%≤424%415%JG149-2003
density of the panel
(three layers),kg/sqm
≥1.7*1001.821*100GB/T 6343-1995
bending resistance
under 0.5KN,mm
≤18.313.3GB/T 9341-2000
cementation strength,Mpa>0.10.18JG149-2003
smog resistance(h)/no spot of erosion,
no color change
GB 5938-1986
weather resistance(h)/no damage on surface,color
changes on level 4-5
GB/T 17657-1999
oxygen index, %>2626.1GB/T 2046-1993
horizontal burning
of PU
everage burning time
77GB/T 8332-1987
everage burning area
37GB/T 8332-1987
wind resistance

Insulation performance comparison
testing itemsgypsum boardcommon outer wallsandwich panel
thermal conductivity0.50.150.018
the comparison of thickness27.8cm8.34cm1.0cm

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