Connect-Inter Ribbon-Machine welding

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Connect-Inter Ribbon-Machine welding

Copper base: T2 copper tape slitting
Copper substrate resistivity: ρ ≤ 0.0172Ωmm2 / m
Solder Composition: 62% Sn36% Pb2% Ag; 60% Sn40% Pb; 96.5% Sn3.5% Ag (Bi optional).
The thickness of the tin layer: 10μm-40μm, sided uniform
deviation: ≤ 0.008
deviation: ≤ 0.005mm.
Elongation: the soft state ≥ 20%; semi-soft state ≥ 15%.
Product specifications: width 4mm, 5 mm, 6mm; thickness 0.15mm-0.3mm.

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