A Grade Polycrystalline Solar Cell 4.2W-4.3W

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Product Description:

A Grade Polycrystalline Solar Cell 4.2W-4.3W

Main Characteristic

17.6%-18% High Efficiency A Grade 125mm Monocrystalline Solar Cells

1.First-class production technology and packaging technology.
2.Adopting the world's leading technology of silicon and polycrystalline silicon cells, power density, peak hours more battery power, higher conversion efficiency.
3.Beautiful, stable, easy to take down the anodic aluminum frame electric degrees and has a wind-resistant, anti-snow function.

Features

17.6%-18% High Efficiency A Grade 125mm Monocrystalline Solar Cells

1.High transmissivity low-iron tempered glass, strong aluminium frame.

2.Manufactured according to international quality and Environment Management System (ISO9001, ISO14001).

3.Low voltage-temperature coefficient allows higher power output at high-temperature condition.

Product Pictures

 

A Grade Polycrystalline Solar Cell 4.2W-4.3W

A Grade Polycrystalline Solar Cell 4.2W-4.3W

 

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Q:The significance of silicon wafer heat treatment
Heat treatment at 650 DEG C, under the condition of rapid cooling (that is, rapidly over the temperature of 450 DEG C), the thermal donor can be eliminated. That is, we can observe that the resistivity of N sample is high, and the resistivity of P sample is low.Precipitation: 800-1200 DEG C, on behalf of temperature 1050 degrees CHeat treatment at 1050 DEG C, will bring oxygen precipitation, and the formation of defects caused by precipitation defects.Restore: > 1200
Q:Why do you want to make the wafer bigger?
The cost of the chip is directly related to the area. On the same chip, the more chips can be carved, the lower the price of the chip. Because silicon chips are inevitably produced defects (such as impurities, etc.). The larger the area of a chip, the higher the probability of the collision, and the higher the proportion of the whole wafer. A chip to do one hundred chips, a defect is 1\%. If only do ten, out of a defect is 10\%. An extreme example is the large CCD, professional camera or digital camera with the CCD is 23.7x15.6mm, light by the light area of 370 square millimeters, quickly catch up with the area of the high-end RISC processor
Q:Begged monocrystalline silicon rod is to use what tools and equipment to cut into silicon
General loss of about 40%, the general thickness of about 190um silicon, cutting seam in 120um
Q:How to make monocrystalline silicon solar cells
Diffusion bondingSolar cells require a large area of PN junction to achieve the conversion of light energy to electrical energy, while the diffusion furnace is a special equipment for manufacturing solar cell PN junction. Tube type diffusion furnace is mainly composed of quartz boat download four parts part, gas chamber, a furnace body part and a holder part etc.. Generally, the liquid source of three phosphorus oxychloride is used as the diffusion source. The P type silicon wafer is placed in a quartz tube of a tube type diffusion furnace, and three nitrogen oxychloride is used in the quartz vessel at the temperature of 850---900 degrees Celsius, and the phosphorus atom is obtained through the reaction of the phosphorus oxychloride and the silicon wafer through the reaction of the phosphorus and the phosphorus. After a certain time, the phosphorus atom from the surrounding surface layer into a silicon wafer, and wafer to internal diffusion through the void between the silicon atoms, forming a N type semiconductor and P type semiconductor interface, namely PN junction. The PN junction made by this method has good uniformity, the uniformity of box resistance is less than ten percent, and the lifetime of less than 10ms. The manufacture of PN junction is the most basic and most important process in the production of solar cells. Because it is the formation of PN junction, so that the electrons and holes in the flow is no longer back to the original place, so that the formation of the current, using the wire will lead to the current, dc.
Q:What are the aspects of silicon wafer testing?
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;
Q:Why the resistivity of silicon wafer is high and low
If it is caused by changes in temperature resistance, it is normal;
Q:How to avoid or reduce the fragmentation of thin silicon wafers without wax polishing?
You can use the U.S. ZeroMicron wax free polishing template to solve the problem of non wax polishing fragments
Q:How to calculate the conversion efficiency of monocrystalline silicon
Solar cell efficiency = (open circuit voltage * short-circuit voltage * fill factor) / (battery area * light amplitude) *100%Light intensity - AM1.5 as the standard, that is 1000W/m2Proportion of dark current - Irev>6 cell ratioThe proportion of low efficiency tablets - the proportion of P156Eff<14.5% batteries
Q:The meaning of various names
Need some wafer to test the state of the art production equipment, such as particle, etching rate, defect rate and so on, these are often called wafer control chip, the control plate is also used to group together with the normal production process to test the quality condition of a process, such as the CVD film thickness. Production equipment in the maintenance or repair immediately after. Production batch of wafer, easy to cause the scrap, and usually use some very low cost wafer to run the process to determine the quality of maintenance or repair work, this type of wafer is called dummy wafer, of course, sometimes dummy wafer also can be used in the normal production process, such as certain machine wafer must process to a certain number the problem with dummy wafer. And some machine must be a form of dummy run in the process of a certain number of wafer, otherwise the process can not guarantee the quality and so on and so on many of the wafer are Dummy. can be called a wafer chip can be basically regarded as a dummy.Dummy wafer, control, block and so on are usually recyclable
Q:What is the difference between the purpose of wafer cleaning and the cleaning of silicon material, what is the difference between the acid used
The silicon wafer cleaning is also known as the production of wool, chemical etching of silicon wafer surface, so that the light area

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