4W B Grade 156*156mm Polycrystalline Solar Cell

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4W B Grade 156*156mm Polycrystalline Solar Cell

Solar Module Summarize

Solar Module is the core part of solar PV power systems,also is the highest value part of it. The function of Solor Module is to convert the sun's radiation to electrical energy, or transfer it to battery and store in it, or to drive the load running.
The Product has been widely used in space and ground, it mainly used for power generation systems, charging systems, road lighting and traffic signs areas. It could offer a wide range of power and voltage, and with high conversion efficiency, and long service life.

Main Characteristic

Long Service Life
High Efficiency Solar Cells
Special Aluminum Frame Design
High Transmission, Low Iron Tempered Glass
Advanced Cell Encapsulation

Solar power stations
Rural electrification, Small home power systems
Power supply for traffic, security, gas industry
12V and 24V battery charging system
Other industrial and commercial application

Typical I-V curve

4W B Grade 156*156mm Polycrystalline Solar Cell

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4W B Grade 156*156mm Polycrystalline Solar Cell


4W B Grade 156*156mm Polycrystalline Solar Cell



6Inch 2BB  Polycrystalline Multi Solar Cells Mono Solar Cell

For c-Si panel: 25years output warranty for no less than 80% of performance, 10 years output warranty for no less than  90% of performance. Free from material and workmanship defects within 5 years.

For a-Si panel: 20 years output warranty for no less than 80% of performance, 10 years output warranty for no less than 90% of performance. Free from material and workmanship defects within 2 years.

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Q:The purpose and means of chemical etching of silicon wafers?
Corrosion is to create suede, was not intended to be clean, but cleaning agents will inevitably etch the surface damage layer of wafer line after cutting in the solar industry is a must, because it can produce suede.
Q:What are the difficulties of silicon wafer cutting?
1, the impurity line caused by impurities in polycrystalline silicon ingot, slicing process can not completely remove the lead line on a silicon wafer.2, scratch line caused by mortar in large SIC particles or caking mortar. In the process of cutting, SIC particles stuck in between steel wire and silicon can not overflow, cause.Forms: including the whole line and half line marks, concave line, shiny, more narrow than the other.
Q:1 megawatts of solar energy need how many wafers
1 WP silicon chip, which is 1000000WPDo not know what you want to know? Detailed point!
Q:What is the surface hardness of monocrystalline silicon and polycrystalline silicon wafers
When the contact depth is about 20 ~ 32nm, the contact stiffness and the contact depth of the single crystal silicon wafer are linear,
Q:How much is the thickness of the silicon wafer
For integrated circuits: generally 4 inch wafer thickness of 0.520mm, the thickness of the 6 inch wafer
Q:Light doped and heavily doped silicon wafers
Whether it is N or P type, doping, resistivity is low, that is RE doped
Q:How to make monocrystalline silicon solar cells
Surface fleeceThe preparation of single crystal silicon wafer is the use of anisotropic etching of silicon on the surface of the silicon per square centimeter to form several million square pyramidal structure, namely, the Pyramid structure. Due to the multiple reflection and refraction of incident light on the surface, the absorption of light is increased, and the short circuit current and conversion efficiency are improved. Anisotropic etching of silicon in alkaline solution liquid is usually hot, available alkali sodium hydroxide, potassium hydroxide, lithium hydroxide and ethylenediamine etc.. Most of them were prepared by using dilute sodium hydroxide solution with a concentration of about 1%, and the corrosion temperature was 70-85. In order to obtain a uniform texture, but also in the solution add alcohols such as ethanol and isopropanol as complexing agent to accelerate the corrosion of silicon. In the preparation of velvet, the silicon chip must be first surface corrosion, alkaline or acidic etching solution to about 20 ~ 25 m, corrosion in the face, the general chemical cleaning. After surface preparation of silicon wafers are not suitable for long-term storage in the water, in order to prevent contamination, should be spread as soon as possible.
Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board
However, in order to manufacture semiconductor components and integrated circuits (IC). Pure silicon wafers have to be created and then used in a variety of processes, such as etching, doping, etc., to make conductive semiconductor circuits on silicon wafers. This process can achieve the level of precision represents the level of semiconductor manufacturing processes, such as the computer's CPU is the number of microns with the manufacture of technology. Because the process is more precise, in the same size of silicon, can make a number of more circuits, that is to achieve a higher degree of integration. At the same time, because the distance between the circuit is small, the length of the wire is short, the required working voltage is lower, the power consumption can be reduced, and the operating speed can be increased.
Q:What is the silicon area of the 125 diagonal of a single crystal of 160?
- 125 - (125*1.414-160) - =15344.4375mm - =153.444cm -Note: the chamfer angle is 45 degrees
Q:What's the difference between a silicon wafer and a battery?
Silicon chip, is a large piece of silicon, cut into a filmSolar cell, the mainstream is the silicon wafer made of crystalline silicon solar cells, or other solar cells: thin film solar cells, amorphous silicon solar energy, solar cells and so on

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