240W Panel Solar for Home Use Solar Power System

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10000 watt
Supply Capability:
20000000 watt/month

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Solar panel refers to a panel designed to absorb the sun's rays as a source of energy for generating electricity or heating. A PV module is a packaged, connected assembly of typically 6×10 solar cells. Solar PV panels constitute the solar array of a photovoltaic system that generates and supplies solar electricity in commercial and residential applications.

 Main Characteristic

1.Manufactured according to international quality and Environment Management

    System (ISO9001, ISO14001)

2. By the high transmittance, low iron tempered glass, anti-aging of the EVA(polyethylene - vinyl acetate), high-performance crystalline silicon solar cells, good Weather resistance TPT (fluoroplastics composite membrane) by pyramid , has a good Weather resistance and anti-UV, hail, water-proof capacity.

3.  OEM and customerized package are accepted

4. High efficiency crystalline silicon solar cells

Quality warranty

1.10 years limited warranty on material and workmanship

2. more than 90% power output in 10 years

3. more than 80% power output in 25 years

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240W Panel Solar  for Home Use Solar Power System

240W Panel Solar  for Home Use Solar Power System

240W Panel Solar  for Home Use Solar Power System

240W Panel Solar  for Home Use Solar Power System

240W Panel Solar  for Home Use Solar Power System

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Q:The relationship between the weight and the power of solar wafers!
The thickness of the silicon wafer is unchanged and the weight is unchanged:156*156,8 inch polycrystalline silicon chip efficiency reached 16%, single-chip power of 3.89W.This can be pushed: the thickness of the silicon wafer is 180, the efficiency is up to 16%, and the consumption of the single silicon is 3.89w*7g/w=27.23g.When the thickness of silicon wafer is 180, and the weight of silicon wafer is unchanged, the conversion rate of polycrystalline silicon chip is up to 18%, and the chip power is 156*156*0.18/1000=4.38WThis can be pushed: the thickness of the silicon wafer is 180, the weight of the silicon wafer is unchanged, and the conversion rate of the polycrystalline silicon sheet is up to 18%, and the polysilicon consumption per watt is 27.23/4.38=6.2g
Q:What are the aspects of silicon wafer testing?
Test wafer sizeThe damage degree of monocrystalline silicon wafer was measured and classified:Damage less than 30mm, can be cut into 6 inches Wafer;Broken into two pieces, can not be used;No damage;Wafer size 156*156mm;Detection speed requirements: 1.5 seconds / piece;Action process: the movement of the wafer to the detection position, the camera quickly take pictures, and then processed in the process of equipment;Wafer movement speed: about 150mm/s;
Q:How is the wafer appearance caused? The performance of the chip half white, a class of black! Seek help!
You should be the color difference problem is caused by the mortar temperature cutting room temperature and workshop temperature also influenced to reduce this effect only from the cleaning rod to minimize the time spent between, this is the enthusiasm of the staff problem
Q:The microprocessor integrates the computer with what is on a small silicon chip
The controller (English Name: controller) is a master device in accordance with the resistance change circuit wiring and a predetermined sequence change or control circuit to control the value of motor starting, speed control, braking and reverse.It consists of the program counter, the instruction register, the instruction decoder, the timing generator and the operation controller. It is the "decision making mechanism", which is to coordinate and direct the operation of the whole computer system.
Q:What is a silicon chip made of?
A simple understanding of the silicon wafer is a silicon material cut into pieces by processing. Silicon is a kind of high hardness material, silicon material looks like a stone, he must be washed clean and then heated by a stove melt forming a bulk silicon ingot, and then use the special machine to slice into pieces.
Q:Why should the wafer cut side, cut out edge Jiaosha
In fact, early silicon is not cutting edge, but with the development of microelectronics industry began the following reasons: cutting edge, W2) i: J n$W% L* M1 s `&;1, n can do a plurality of microelectronic devices on the wafer, cut down, and there is a crystal to crystal growth requirements, cutting along a direction for cutting chaos crack, cleavage is the professional said. The cutting edge tells you the direction of cleavage.2, N type and P type silicon wafer, a standard trimming is also inform you that it is n type or P type electrical characteristics, electrical characteristics, u$J2 z/ h 9 - O3, microelectronics production has been automated, such as lithography exposure if there is no cutting edge positioning, then the mask plate and the chip will be a difference of 180 degrees or a certain location, production efficiency will be very low...,4, the use of a lot of silicon, in addition to n/p also have crystal direction, for example, do MEMS requires corrosion anisotropy will be used <110> crystal direction, and MOS products in order to reduce the influence of the surface state requirements with <100> crystal...
Q:I would like to ask what the purpose of the use of semiconductor silicon wafers, doped with boron ah?
High purity silicon wafers for use in electronics and solar energy are required to be doped with boron to manufacture the P end of the P - N junction, in which P (P) - N (As) -, Ga (B) - gallium (III) indium (III) - silicon.
Q:After wafer cleaning, how to change the film?
Quality solutionCleaning method(a) RCA cleaning:RCA pioneered by Werner Kern in the N.J.Princeton RCA laboratory in 1965, and hence the name.RCA cleaning is a typical wet chemical cleaning.RCA cleaning is mainly used for cleaning the surface film, organic particles and metal contamination.1, particle cleaningThe main APM removal of silicon surface particles (also known as SC1) cleaning solution (NH4OH + H2O2 + H2O) to APM in the cleaning. The cleaning solution, due to the effects of H2O2, the silicon surface has a layer of natural oxide film (SiO2), a hydrophilic surface and between silicon particles can soaking cleaning liquid, silicon surface the natural oxide film and a silicon wafer surface by NH4OH corrosion, the particles will fall into the cleaning solution. The corrosion rate and the particle removal amount of silicon surface, for removing particles, corrosion must be a certain amount. In the cleaning solution, because the potential of silicon surface is negative, and most of the particles are repulsive force to prevent the adsorption of particles to the silicon surface.
Q:Pure curiosity why silicon wafer is round
Journey~woo~'s response: Yeah, why are they made of round bars?...... Sometimes it's a little inconvenient to design the channelRod like the natural shape of production.
Q:I grew Ag particles on a silicon wafer, about a few hundred nanometers in size
Alcohol is usually placed inside, with ultrasonic cleaning instrument scattered about, the purpose is to make the particles do not reunite together.

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